JP5334351B2 - 改善された性能および信頼性を有する金属酸化物半導体デバイス - Google Patents
改善された性能および信頼性を有する金属酸化物半導体デバイス Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 229910044991 metal oxide Inorganic materials 0.000 title claims description 5
- 150000004706 metal oxides Chemical class 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 239000011810 insulating material Substances 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 95
- 235000012431 wafers Nutrition 0.000 description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 230000008569 process Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 13
- 230000005684 electric field Effects 0.000 description 12
- 229910052814 silicon oxide Inorganic materials 0.000 description 12
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- 238000009792 diffusion process Methods 0.000 description 10
- 239000012535 impurity Substances 0.000 description 10
- 210000000746 body region Anatomy 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
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- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
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- 229910052698 phosphorus Inorganic materials 0.000 description 3
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- 238000001020 plasma etching Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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Description
Claims (8)
- 第1の導電型の基板および前記基板の少なくとも一部分の上に形成された第2の導電型の第2の層を備える半導体層と、
前記第2の層の上面の近傍の前記第2の層に形成された前記第2の導電型のソース領域と、
前記第2の層の上面の近傍の前記第2の層に形成され、前記ソース領域から横方向に離間するドレイン領域と、
前記第2の層の上面の近傍の前記第2の層の上および少なくとも部分的に前記ソース領域と前記ドレイン領域の間に形成されたゲートと、
前記ゲートと前記ドレイン領域の間の前記第2の層に形成された少なくとも1つの導電性トレンチであって、前記半導体層の前記上面の近傍に形成され、前記第2の層を通って前記基板までほぼ垂直に延びる少なくとも1つのトレンチとを備え、
前記少なくとも1つのトレンチが、前記トレンチを形成する側壁をほぼライニングする絶縁材料を備え、前記トレンチが導電性材料でほぼ充填され、該導電性材料の底面と該基板とが電気的に接触する金属酸化物半導体(MOS)デバイス。
- 前記第2の層がエピタキシャル層を備える請求項1に記載のデバイス。
- 前記少なくとも1つのトレンチは、前記ドレイン領域の電圧が増大すると、空乏領域が前記トレンチから広がって、前記少なくとも1つのトレンチの間の領域をほぼ充填し、これによって前記デバイスにおけるホット・キャリア注入を低減するように構成される請求項1に記載のデバイス。
- 該少なくとも1つのトレンチは、少なくとも第1の導電性トレンチと第2の導電性トレンチをさらに備え、前記少なくとも第1の導電性トレンチと第2の導電性トレンチが互いに離間し、前記ドレイン領域の電圧が増大すると、空乏領域が前記第1の導電性トレンチ及び第2の導電性トレンチから広がって、前記第1の導電性トレンチと第2の導電性トレンチとの間の領域をほぼ充填し、これによって前記デバイスにおけるホット・キャリアの注入を低減するように構成される請求項1に記載のデバイス。
- 前記半導体層の上面の近傍および前記ゲートと前記ドレインとの間に形成された遮蔽構造をさらに備え、前記遮蔽構造が前記ソース領域に電気的に接続され、前記ゲートから横方向に離間し、前記ゲートに対してほぼ重ならない請求項1に記載のデバイス。
- 第1の導電型の基板および該基板の少なくとも一部分の上に形成された第2の導電型の第2の層を備える半導体層の上面の近傍にゲートを形成する工程と、
前記第2の層の上面の近傍の前記第2の層に第2の導電型のソース領域およびドレイン領域を形成する工程であって、前記ソース領域が前記ドレイン領域から横方向に離間し、前記ゲートが少なくとも部分的に前記ソースと前記ドレイン領域との間に形成される、工程と、
前記ゲートと前記ドレイン領域との間の前記第2の層に少なくとも1つの導電性トレンチを形成する工程であって、前記少なくとも1つの導電性トレンチが前記半導体層の上面の近傍に形成され、前記第2の層を通って前記基板までほぼ垂直に延びる、工程とを備え、
前記少なくとも1つの導電性トレンチが、前記少なくとも1つの導電性トレンチを形成する側壁をほぼライニングする絶縁材料を備え、前記少なくとも1つの導電性トレンチが導電性材料でほぼ充填され、該導電性材料の底面と該基板とが電気的に接触する金属酸化物半導体(MOS)デバイスを形成するための方法。
- 1つまたは複数の金属酸化物半導体(MOS)デバイスを備える集積回路(IC)デバイスであって、前記MOSデバイスの少なくとも1つが、
第1の導電型の基板および前記基板の少なくとも一部分の上に形成された第2の導電型の第2の層を備えた半導体層と、
前記第2の層の上面の近傍の前記第2の層に形成された前記第2の導電型のソース領域と、
前記第2の層の前記上面の近傍の該第2の層に形成され、前記ソース領域から横方向に離間する前記第2の導電型のドレイン領域と、
前記第2の層の上面の近傍の第2の層の上および少なくとも部分的に前記ソース領域と前記ドレイン領域との間に形成されたゲートと、
前記ゲートと前記ドレイン領域との間の前記第2の層に形成された少なくとも1つの導電性トレンチであって、前記少なくとも1つの導電性トレンチが前記第2の層の上面の近傍に形成され、前記第2の層を通って前記基板までほぼ垂直に延びる、少なくとも1つの導電性トレンチとを備え、
前記少なくとも1つの導電性トレンチが、前記少なくとも1つの導電性トレンチを形成する側壁をほぼライニングする絶縁材料を備え、前記少なくとも1つの導電性トレンチが導電性材料でほぼ充填され、該導電性材料の底面と該基板とが電気的に接触する集積回路(IC)デバイス。
- 前記少なくとも第1及び第2のトレンチが、互いに、及び、前記ソース領域と該ドレイン領域との間のデバイスに形成されたチャネル領域に対して離間し、前記第1のトレンチ及び第2のトレンチは前記チャネル領域の湾曲を制御するように構成される請求項4記載のデバイス。
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US10/688231 | 2003-10-17 | ||
US10/688,231 US7005703B2 (en) | 2003-10-17 | 2003-10-17 | Metal-oxide-semiconductor device having improved performance and reliability |
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US7163856B2 (en) * | 2003-11-13 | 2007-01-16 | Volterra Semiconductor Corporation | Method of fabricating a lateral double-diffused mosfet (LDMOS) transistor and a conventional CMOS transistor |
US7087959B2 (en) * | 2004-08-18 | 2006-08-08 | Agere Systems Inc. | Metal-oxide-semiconductor device having an enhanced shielding structure |
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TWI249791B (en) * | 2005-01-07 | 2006-02-21 | Powerchip Semiconductor Corp | Method for fabricating semiconductor devie |
DE102005012217B4 (de) * | 2005-03-15 | 2007-02-22 | Infineon Technologies Austria Ag | Lateraler MISFET und Verfahren zur Herstellung desselben |
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US7473976B2 (en) * | 2006-02-16 | 2009-01-06 | Fairchild Semiconductor Corporation | Lateral power transistor with self-biasing electrodes |
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KR100770539B1 (ko) * | 2006-08-11 | 2007-10-25 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 그 제조 방법 |
JP4601603B2 (ja) * | 2006-12-27 | 2010-12-22 | ルネサスエレクトロニクス株式会社 | パワーmisfet、半導体装置およびdc/dcコンバータ |
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KR100974697B1 (ko) * | 2008-07-09 | 2010-08-06 | 주식회사 동부하이텍 | Ldmos 소자 및 ldmos 소자의 제조 방법 |
KR101531882B1 (ko) * | 2008-12-31 | 2015-07-06 | 주식회사 동부하이텍 | 반도체 소자 및 그 제조 방법 |
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CN104347420B (zh) * | 2013-08-07 | 2018-06-01 | 中芯国际集成电路制造(北京)有限公司 | Ldmos器件及其形成方法 |
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CN110534514B (zh) * | 2019-09-05 | 2022-01-25 | 电子科技大学 | 一种横向高压功率半导体器件的槽型终端结构 |
CN113130632B (zh) * | 2019-12-31 | 2022-08-12 | 无锡华润上华科技有限公司 | 横向扩散金属氧化物半导体器件及其制备方法 |
CN112164719B (zh) * | 2020-08-28 | 2022-03-08 | 电子科技大学 | 具有等势浮空槽的低阻器件及其制造方法 |
CN111816707B (zh) * | 2020-08-28 | 2022-03-08 | 电子科技大学 | 消除体内曲率效应的等势降场器件及其制造方法 |
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US20060128085A1 (en) | 2006-06-15 |
TWI325181B (en) | 2010-05-21 |
US7005703B2 (en) | 2006-02-28 |
JP2005123624A (ja) | 2005-05-12 |
TW200515606A (en) | 2005-05-01 |
US7335565B2 (en) | 2008-02-26 |
KR20050037367A (ko) | 2005-04-21 |
US20050082610A1 (en) | 2005-04-21 |
KR101044528B1 (ko) | 2011-06-27 |
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