JP4386430B2 - 塗布膜形成装置 - Google Patents

塗布膜形成装置 Download PDF

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Publication number
JP4386430B2
JP4386430B2 JP2004273645A JP2004273645A JP4386430B2 JP 4386430 B2 JP4386430 B2 JP 4386430B2 JP 2004273645 A JP2004273645 A JP 2004273645A JP 2004273645 A JP2004273645 A JP 2004273645A JP 4386430 B2 JP4386430 B2 JP 4386430B2
Authority
JP
Japan
Prior art keywords
substrate
stage
roller
processing
processing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004273645A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005322873A (ja
JP2005322873A5 (enExample
Inventor
一仁 宮崎
清久 立山
公男 元田
光広 坂井
拓伸 梶原
武郎 帰山
義治 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004273645A priority Critical patent/JP4386430B2/ja
Priority to TW094110774A priority patent/TWI260686B/zh
Priority to KR1020050028560A priority patent/KR101069494B1/ko
Publication of JP2005322873A publication Critical patent/JP2005322873A/ja
Publication of JP2005322873A5 publication Critical patent/JP2005322873A5/ja
Application granted granted Critical
Publication of JP4386430B2 publication Critical patent/JP4386430B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2004273645A 2004-04-07 2004-09-21 塗布膜形成装置 Expired - Lifetime JP4386430B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004273645A JP4386430B2 (ja) 2004-04-07 2004-09-21 塗布膜形成装置
TW094110774A TWI260686B (en) 2004-04-07 2005-04-04 Coating film forming apparatus
KR1020050028560A KR101069494B1 (ko) 2004-04-07 2005-04-06 도포막형성장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004113023 2004-04-07
JP2004273645A JP4386430B2 (ja) 2004-04-07 2004-09-21 塗布膜形成装置

Publications (3)

Publication Number Publication Date
JP2005322873A JP2005322873A (ja) 2005-11-17
JP2005322873A5 JP2005322873A5 (enExample) 2006-10-05
JP4386430B2 true JP4386430B2 (ja) 2009-12-16

Family

ID=35469892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004273645A Expired - Lifetime JP4386430B2 (ja) 2004-04-07 2004-09-21 塗布膜形成装置

Country Status (3)

Country Link
JP (1) JP4386430B2 (enExample)
KR (1) KR101069494B1 (enExample)
TW (1) TWI260686B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100803147B1 (ko) * 2007-04-04 2008-02-14 세메스 주식회사 도포장치 및 이를 이용한 처리액의 도포 방법
KR100840528B1 (ko) 2007-04-13 2008-06-23 주식회사 케이씨텍 슬릿 코터용 예비토출장치
KR200456618Y1 (ko) * 2007-05-07 2011-11-09 주식회사 케이씨텍 슬릿 코터용 예비토출장치
KR100969347B1 (ko) 2009-09-07 2010-07-09 한국기계연구원 멀티 코터 및 이를 이용한 코팅 방법과 롤 프린팅 방법
KR102061315B1 (ko) * 2011-07-27 2019-12-31 스미도모쥬기가이고교 가부시키가이샤 기판제조장치 및 기판제조방법
JP5912403B2 (ja) * 2011-10-21 2016-04-27 東京エレクトロン株式会社 塗布処理装置
KR101744512B1 (ko) * 2016-02-04 2017-06-20 황중국 양면 코팅장치
CN117184835A (zh) * 2022-05-31 2023-12-08 上海德沪涂膜设备有限公司 涂布设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11169769A (ja) * 1997-12-08 1999-06-29 Toray Ind Inc 塗布装置及び塗布方法並びにカラーフィルタの製造装置及び製造方法
JP2001070858A (ja) * 1999-07-07 2001-03-21 Canon Inc 塗料の塗工装置および塗工方法

Also Published As

Publication number Publication date
JP2005322873A (ja) 2005-11-17
TW200537585A (en) 2005-11-16
KR101069494B1 (ko) 2011-09-30
KR20060045531A (ko) 2006-05-17
TWI260686B (en) 2006-08-21

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