JP4343443B2 - 接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品 - Google Patents

接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品 Download PDF

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Publication number
JP4343443B2
JP4343443B2 JP2000566357A JP2000566357A JP4343443B2 JP 4343443 B2 JP4343443 B2 JP 4343443B2 JP 2000566357 A JP2000566357 A JP 2000566357A JP 2000566357 A JP2000566357 A JP 2000566357A JP 4343443 B2 JP4343443 B2 JP 4343443B2
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JP
Japan
Prior art keywords
hydrolyzed
mixture
silane
partially hydrolyzed
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2000566357A
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English (en)
Japanese (ja)
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JP2002523549A (ja
JP2002523549A5 (enExample
Inventor
エム．ジュニア ストキック，セオドア
ビー． マーティン，ブライアン
ジェイ． ストランドジョード，アンドリュー
イー． ヘツナー，ジャック
エフ． ハリス，ロバート
エイチ．ザ サード タウンセンド，ポール
シー． フライ，ドナルド
エル． シュミット，ドナルド
Original Assignee
ダウ グローバル テクノロジーズ インコーポレイティド
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Application filed by ダウ グローバル テクノロジーズ インコーポレイティド filed Critical ダウ グローバル テクノロジーズ インコーポレイティド
Publication of JP2002523549A publication Critical patent/JP2002523549A/ja
Publication of JP2002523549A5 publication Critical patent/JP2002523549A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D165/02—Polyphenylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2000566357A 1998-08-24 1999-08-23 接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品 Expired - Lifetime JP4343443B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/138,510 1998-08-24
US09/138,510 US6184284B1 (en) 1998-08-24 1998-08-24 Adhesion promoter and self-priming resin compositions and articles made therefrom
PCT/US1999/019242 WO2000011096A1 (en) 1998-08-24 1999-08-23 Adhesion promoter and self-priming resin compositions and articles made therefrom

Publications (3)

Publication Number Publication Date
JP2002523549A JP2002523549A (ja) 2002-07-30
JP2002523549A5 JP2002523549A5 (enExample) 2007-03-08
JP4343443B2 true JP4343443B2 (ja) 2009-10-14

Family

ID=22482345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000566357A Expired - Lifetime JP4343443B2 (ja) 1998-08-24 1999-08-23 接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品

Country Status (8)

Country Link
US (1) US6184284B1 (enExample)
EP (1) EP1112329B2 (enExample)
JP (1) JP4343443B2 (enExample)
KR (1) KR100604629B1 (enExample)
CN (1) CN1210362C (enExample)
DE (1) DE69918316T3 (enExample)
TW (1) TWI234577B (enExample)
WO (1) WO2000011096A1 (enExample)

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US7115531B2 (en) 2000-08-21 2006-10-03 Dow Global Technologies Inc. Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
US6710450B2 (en) * 2001-02-28 2004-03-23 International Business Machines Corporation Interconnect structure with precise conductor resistance and method to form same
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AU2002305835A1 (en) * 2001-06-08 2002-12-23 The Regents Of The University Of Michigan Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
CN1630744A (zh) * 2001-09-07 2005-06-22 博登化学公司 使用粘合促进剂的涂覆光纤及其制备和使用方法
US6806182B2 (en) * 2002-05-01 2004-10-19 International Business Machines Corporation Method for eliminating via resistance shift in organic ILD
TW200426191A (en) * 2003-03-27 2004-12-01 Sumitomo Chemical Co Coating liquid for forming insulating film and method for producing insulating film
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
US20050100712A1 (en) * 2003-11-12 2005-05-12 Simmons Blake A. Polymerization welding and application to microfluidics
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CN101616750B (zh) * 2007-05-01 2012-07-25 贝克株式会社 涂装方法
CA2733682C (en) * 2008-08-12 2014-10-14 Air Products And Chemicals, Inc. Polymeric compositions comprising per(phenylethynyl) arene derivatives
GB2480451A (en) * 2010-05-18 2011-11-23 E2V Tech Electron tube rf output window
US9006353B2 (en) 2011-11-18 2015-04-14 Delsper LP Crosslinking compounds for high glass transition temperature polymers
KR20140023856A (ko) * 2012-08-16 2014-02-27 동우 화인켐 주식회사 아크릴계 점착제 조성물
KR102197418B1 (ko) 2012-10-22 2020-12-31 델스퍼 엘피 가교된 유기 중합체 조성물
US9273215B2 (en) 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
JP6272908B2 (ja) 2013-01-28 2018-01-31 デルスパー リミテッド パートナーシップ シーリングおよび耐摩耗性構成部材のための抗押出性組成物
CA2906858C (en) 2013-03-15 2021-09-21 Delsper LP Cross-linked organic polymers for use as elastomers
CN103755964B (zh) * 2013-12-27 2016-03-30 深圳市安品有机硅材料有限公司 聚硅氧烷增粘树脂及其制备方法
US9153357B1 (en) * 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
KR101623771B1 (ko) * 2014-10-16 2016-05-25 도레이첨단소재 주식회사 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름
US9481810B2 (en) 2014-12-15 2016-11-01 Rohm And Haas Electronic Materials Llc Silylated polyarylenes
US9752051B2 (en) * 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
US10790146B2 (en) * 2016-12-05 2020-09-29 Rohm And Haas Electronic Materials Llc Aromatic resins for underlayers
BR112022022724A2 (pt) 2020-06-05 2023-02-14 Dow Global Technologies Llc Composição, método para a produção da composição, composição adesiva, método para produzir um laminado, e, laminado

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Also Published As

Publication number Publication date
US6184284B1 (en) 2001-02-06
JP2002523549A (ja) 2002-07-30
DE69918316T2 (de) 2005-07-21
KR100604629B1 (ko) 2006-07-28
EP1112329A1 (en) 2001-07-04
EP1112329B1 (en) 2004-06-23
DE69918316T3 (de) 2011-02-24
WO2000011096A1 (en) 2000-03-02
TWI234577B (en) 2005-06-21
EP1112329B2 (en) 2010-07-14
DE69918316D1 (de) 2004-07-29
KR20010089172A (ko) 2001-09-29
CN1210362C (zh) 2005-07-13
CN1318093A (zh) 2001-10-17

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