KR100604629B1 - 밀착 촉진제 및 자체 하도성 수지 조성물과 이로부터제조되는 제품 - Google Patents

밀착 촉진제 및 자체 하도성 수지 조성물과 이로부터제조되는 제품 Download PDF

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Publication number
KR100604629B1
KR100604629B1 KR1020017002305A KR20017002305A KR100604629B1 KR 100604629 B1 KR100604629 B1 KR 100604629B1 KR 1020017002305 A KR1020017002305 A KR 1020017002305A KR 20017002305 A KR20017002305 A KR 20017002305A KR 100604629 B1 KR100604629 B1 KR 100604629B1
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South Korea
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hydrolyzed
composition
silane
partially hydrolyzed
polymer
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Expired - Lifetime
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KR1020017002305A
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Korean (ko)
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KR20010089172A (ko
Inventor
2세 티오도르 엠. 스토키치
브라이언 비. 마틴
앤드류 제이. 스트랜드조드
잭 이. 헤츠너
로버트 에프. 해리스
3세 폴 에이치. 타운젠드
도날드 씨. 프라이
도날드 엘. 슈미트
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다우 글로벌 테크놀로지스 인크.
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D165/02—Polyphenylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020017002305A 1998-08-24 1999-08-23 밀착 촉진제 및 자체 하도성 수지 조성물과 이로부터제조되는 제품 Expired - Lifetime KR100604629B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/138,510 1998-08-24
US09/138,510 US6184284B1 (en) 1998-08-24 1998-08-24 Adhesion promoter and self-priming resin compositions and articles made therefrom

Publications (2)

Publication Number Publication Date
KR20010089172A KR20010089172A (ko) 2001-09-29
KR100604629B1 true KR100604629B1 (ko) 2006-07-28

Family

ID=22482345

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017002305A Expired - Lifetime KR100604629B1 (ko) 1998-08-24 1999-08-23 밀착 촉진제 및 자체 하도성 수지 조성물과 이로부터제조되는 제품

Country Status (8)

Country Link
US (1) US6184284B1 (enExample)
EP (1) EP1112329B2 (enExample)
JP (1) JP4343443B2 (enExample)
KR (1) KR100604629B1 (enExample)
CN (1) CN1210362C (enExample)
DE (1) DE69918316T3 (enExample)
TW (1) TWI234577B (enExample)
WO (1) WO2000011096A1 (enExample)

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AU2002305835A1 (en) * 2001-06-08 2002-12-23 The Regents Of The University Of Michigan Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
CN1630744A (zh) * 2001-09-07 2005-06-22 博登化学公司 使用粘合促进剂的涂覆光纤及其制备和使用方法
US6806182B2 (en) * 2002-05-01 2004-10-19 International Business Machines Corporation Method for eliminating via resistance shift in organic ILD
TW200426191A (en) * 2003-03-27 2004-12-01 Sumitomo Chemical Co Coating liquid for forming insulating film and method for producing insulating film
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
US20050100712A1 (en) * 2003-11-12 2005-05-12 Simmons Blake A. Polymerization welding and application to microfluidics
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US9006353B2 (en) 2011-11-18 2015-04-14 Delsper LP Crosslinking compounds for high glass transition temperature polymers
KR20140023856A (ko) * 2012-08-16 2014-02-27 동우 화인켐 주식회사 아크릴계 점착제 조성물
KR102197418B1 (ko) 2012-10-22 2020-12-31 델스퍼 엘피 가교된 유기 중합체 조성물
US9273215B2 (en) 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
JP6272908B2 (ja) 2013-01-28 2018-01-31 デルスパー リミテッド パートナーシップ シーリングおよび耐摩耗性構成部材のための抗押出性組成物
CA2906858C (en) 2013-03-15 2021-09-21 Delsper LP Cross-linked organic polymers for use as elastomers
CN103755964B (zh) * 2013-12-27 2016-03-30 深圳市安品有机硅材料有限公司 聚硅氧烷增粘树脂及其制备方法
US9153357B1 (en) * 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
KR101623771B1 (ko) * 2014-10-16 2016-05-25 도레이첨단소재 주식회사 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름
US9481810B2 (en) 2014-12-15 2016-11-01 Rohm And Haas Electronic Materials Llc Silylated polyarylenes
US9752051B2 (en) * 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
US10790146B2 (en) * 2016-12-05 2020-09-29 Rohm And Haas Electronic Materials Llc Aromatic resins for underlayers
BR112022022724A2 (pt) 2020-06-05 2023-02-14 Dow Global Technologies Llc Composição, método para a produção da composição, composição adesiva, método para produzir um laminado, e, laminado

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Also Published As

Publication number Publication date
US6184284B1 (en) 2001-02-06
JP2002523549A (ja) 2002-07-30
DE69918316T2 (de) 2005-07-21
EP1112329A1 (en) 2001-07-04
EP1112329B1 (en) 2004-06-23
DE69918316T3 (de) 2011-02-24
WO2000011096A1 (en) 2000-03-02
JP4343443B2 (ja) 2009-10-14
TWI234577B (en) 2005-06-21
EP1112329B2 (en) 2010-07-14
DE69918316D1 (de) 2004-07-29
KR20010089172A (ko) 2001-09-29
CN1210362C (zh) 2005-07-13
CN1318093A (zh) 2001-10-17

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