DE69918316T3 - Haftvermittler und adhäsionsfähige harzzusammensetzungen und daraus hergestellte gegenstände - Google Patents
Haftvermittler und adhäsionsfähige harzzusammensetzungen und daraus hergestellte gegenstände Download PDFInfo
- Publication number
- DE69918316T3 DE69918316T3 DE69918316T DE69918316T DE69918316T3 DE 69918316 T3 DE69918316 T3 DE 69918316T3 DE 69918316 T DE69918316 T DE 69918316T DE 69918316 T DE69918316 T DE 69918316T DE 69918316 T3 DE69918316 T3 DE 69918316T3
- Authority
- DE
- Germany
- Prior art keywords
- hydrolyzed
- composition
- silane
- partially hydrolyzed
- mixtures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title claims description 62
- 239000000853 adhesive Substances 0.000 title description 4
- 230000001070 adhesive effect Effects 0.000 title description 4
- 239000004840 adhesive resin Substances 0.000 title 1
- 229920006223 adhesive resin Polymers 0.000 title 1
- 229920000642 polymer Polymers 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 28
- -1 polyphenylene Polymers 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 22
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 21
- 229910000077 silane Inorganic materials 0.000 claims description 21
- 239000002904 solvent Substances 0.000 claims description 20
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 229920000412 polyarylene Polymers 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 229920006037 cross link polymer Polymers 0.000 claims description 13
- 238000004132 cross linking Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- YUOGUVUAZGQYFR-UHFFFAOYSA-N 1,3,5-tris(2-phenylethynyl)benzene Chemical compound C1=CC=CC=C1C#CC1=CC(C#CC=2C=CC=CC=2)=CC(C#CC=2C=CC=CC=2)=C1 YUOGUVUAZGQYFR-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- JEOAUTNZTUGROC-UHFFFAOYSA-N 3-[4-[4-(3-oxo-2,4,5-triphenylcyclopenta-1,4-dien-1-yl)phenoxy]phenyl]-2,4,5-triphenylcyclopenta-2,4-dien-1-one Chemical compound O=C1C(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)C(C=2C=CC(OC=3C=CC(=CC=3)C=3C(=C(C(=O)C=3C=3C=CC=CC=3)C=3C=CC=CC=3)C=3C=CC=CC=3)=CC=2)=C1C1=CC=CC=C1 JEOAUTNZTUGROC-UHFFFAOYSA-N 0.000 claims description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 4
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 claims description 4
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 125000003161 (C1-C6) alkylene group Chemical group 0.000 claims description 3
- 230000007062 hydrolysis Effects 0.000 claims description 2
- 238000006460 hydrolysis reaction Methods 0.000 claims description 2
- 150000002118 epoxides Chemical class 0.000 claims 2
- IWHBZQRHJKVFHA-UHFFFAOYSA-N 2,3,5-triphenylcyclopenta-2,4-dien-1-one Chemical compound O=C1C(C=2C=CC=CC=2)=CC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 IWHBZQRHJKVFHA-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 30
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 25
- 239000008199 coating composition Substances 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 18
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 17
- 239000002987 primer (paints) Substances 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- FQQOMPOPYZIROF-UHFFFAOYSA-N cyclopenta-2,4-dien-1-one Chemical compound O=C1C=CC=C1 FQQOMPOPYZIROF-UHFFFAOYSA-N 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 150000004756 silanes Chemical class 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- HSFWRNGVRCDJHI-UHFFFAOYSA-N Acetylene Chemical compound C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 7
- 239000002318 adhesion promoter Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000002243 precursor Substances 0.000 description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 6
- 150000002170 ethers Chemical group 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 238000001953 recrystallisation Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- 238000005698 Diels-Alder reaction Methods 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000004817 gas chromatography Methods 0.000 description 3
- 238000004128 high performance liquid chromatography Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- CFAKWWQIUFSQFU-UHFFFAOYSA-N 2-hydroxy-3-methylcyclopent-2-en-1-one Chemical compound CC1=C(O)C(=O)CC1 CFAKWWQIUFSQFU-UHFFFAOYSA-N 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- LLCSWKVOHICRDD-UHFFFAOYSA-N buta-1,3-diyne Chemical group C#CC#C LLCSWKVOHICRDD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- FGTHNRJXIKCBGC-JIBZRZDWSA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]-4-ethylcyclohexan-1-one Chemical compound O=C1\C(=C\C=2C=CC(=CC=2)N=[N+]=[N-])CC(CC)C\C1=C/C1=CC=C(N=[N+]=[N-])C=C1 FGTHNRJXIKCBGC-JIBZRZDWSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DBNWBEGCONIRGQ-UHFFFAOYSA-N 1,1-diphenylpropan-2-one Chemical compound C=1C=CC=CC=1C(C(=O)C)C1=CC=CC=C1 DBNWBEGCONIRGQ-UHFFFAOYSA-N 0.000 description 1
- YWDUZLFWHVQCHY-UHFFFAOYSA-N 1,3,5-tribromobenzene Chemical compound BrC1=CC(Br)=CC(Br)=C1 YWDUZLFWHVQCHY-UHFFFAOYSA-N 0.000 description 1
- YFKBXYGUSOXJGS-UHFFFAOYSA-N 1,3-Diphenyl-2-propanone Chemical class C=1C=CC=CC=1CC(=O)CC1=CC=CC=C1 YFKBXYGUSOXJGS-UHFFFAOYSA-N 0.000 description 1
- HZBBDIQVVAFMMV-UHFFFAOYSA-N 1-azido-4-[4-[2-[4-(4-azidophenoxy)phenyl]propan-2-yl]phenoxy]benzene Chemical compound C=1C=C(OC=2C=CC(=CC=2)N=[N+]=[N-])C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N=[N+]=[N-])C=C1 HZBBDIQVVAFMMV-UHFFFAOYSA-N 0.000 description 1
- 239000001837 2-hydroxy-3-methylcyclopent-2-en-1-one Substances 0.000 description 1
- VMZCDNSFRSVYKQ-UHFFFAOYSA-N 2-phenylacetyl chloride Chemical compound ClC(=O)CC1=CC=CC=C1 VMZCDNSFRSVYKQ-UHFFFAOYSA-N 0.000 description 1
- DVLFYONBTKHTER-UHFFFAOYSA-N 3-(N-morpholino)propanesulfonic acid Chemical compound OS(=O)(=O)CCCN1CCOCC1 DVLFYONBTKHTER-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QQWICBKIBSOBIT-WXUKJITCSA-N [(e)-2-(4-bicyclo[4.2.0]octa-1(6),2,4-trienyl)ethenyl]-[[(e)-2-(4-bicyclo[4.2.0]octa-1(6),2,4-trienyl)ethenyl]-dimethylsilyl]oxy-dimethylsilane Chemical compound C1=C2CCC2=CC(/C=C/[Si](C)(O[Si](C)(C)\C=C\C=2C=C3CCC3=CC=2)C)=C1 QQWICBKIBSOBIT-WXUKJITCSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- BTHCBXJLLCHNMS-UHFFFAOYSA-N acetyloxysilicon Chemical compound CC(=O)O[Si] BTHCBXJLLCHNMS-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 150000005840 aryl radicals Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000013058 crude material Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005646 oximino group Chemical group 0.000 description 1
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000004366 reverse phase liquid chromatography Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 229910052566 spinel group Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- NVBFHJWHLNUMCV-UHFFFAOYSA-N sulfamide Chemical compound NS(N)(=O)=O NVBFHJWHLNUMCV-UHFFFAOYSA-N 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
- C09D165/02—Polyphenylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
- C08G2261/312—Non-condensed aromatic systems, e.g. benzene
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US138510 | 1998-08-24 | ||
| US09/138,510 US6184284B1 (en) | 1998-08-24 | 1998-08-24 | Adhesion promoter and self-priming resin compositions and articles made therefrom |
| PCT/US1999/019242 WO2000011096A1 (en) | 1998-08-24 | 1999-08-23 | Adhesion promoter and self-priming resin compositions and articles made therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE69918316D1 DE69918316D1 (de) | 2004-07-29 |
| DE69918316T2 DE69918316T2 (de) | 2005-07-21 |
| DE69918316T3 true DE69918316T3 (de) | 2011-02-24 |
Family
ID=22482345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69918316T Expired - Lifetime DE69918316T3 (de) | 1998-08-24 | 1999-08-23 | Haftvermittler und adhäsionsfähige harzzusammensetzungen und daraus hergestellte gegenstände |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6184284B1 (enExample) |
| EP (1) | EP1112329B2 (enExample) |
| JP (1) | JP4343443B2 (enExample) |
| KR (1) | KR100604629B1 (enExample) |
| CN (1) | CN1210362C (enExample) |
| DE (1) | DE69918316T3 (enExample) |
| TW (1) | TWI234577B (enExample) |
| WO (1) | WO2000011096A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002534546A (ja) | 1999-01-08 | 2002-10-15 | ザ ダウ ケミカル カンパニー | 良好な接着性および靭性を有する低誘電率ポリマーおよび該ポリマーから作製された物品 |
| US7115531B2 (en) | 2000-08-21 | 2006-10-03 | Dow Global Technologies Inc. | Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices |
| US6710450B2 (en) * | 2001-02-28 | 2004-03-23 | International Business Machines Corporation | Interconnect structure with precise conductor resistance and method to form same |
| JP5320653B2 (ja) | 2001-03-26 | 2013-10-23 | Ｊｓｒ株式会社 | 膜形成用組成物および絶縁膜形成用材料 |
| AU2002305835A1 (en) * | 2001-06-08 | 2002-12-23 | The Regents Of The University Of Michigan | Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication |
| CN1630744A (zh) * | 2001-09-07 | 2005-06-22 | 博登化学公司 | 使用粘合促进剂的涂覆光纤及其制备和使用方法 |
| US6806182B2 (en) * | 2002-05-01 | 2004-10-19 | International Business Machines Corporation | Method for eliminating via resistance shift in organic ILD |
| TW200426191A (en) * | 2003-03-27 | 2004-12-01 | Sumitomo Chemical Co | Coating liquid for forming insulating film and method for producing insulating film |
| TW200505966A (en) | 2003-04-02 | 2005-02-16 | Dow Global Technologies Inc | Organosilicate resin formulation for use in microelectronic devices |
| US7164197B2 (en) * | 2003-06-19 | 2007-01-16 | 3M Innovative Properties Company | Dielectric composite material |
| US20050100712A1 (en) * | 2003-11-12 | 2005-05-12 | Simmons Blake A. | Polymerization welding and application to microfluidics |
| US8790632B2 (en) * | 2004-10-07 | 2014-07-29 | Actamax Surgical Materials, Llc | Polymer-based tissue-adhesive form medical use |
| JP2006104375A (ja) * | 2004-10-07 | 2006-04-20 | Sumitomo Chemical Co Ltd | 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜 |
| US20060275616A1 (en) * | 2005-06-03 | 2006-12-07 | Clough Robert S | Silane-based coupling agent |
| US20070004844A1 (en) * | 2005-06-30 | 2007-01-04 | Clough Robert S | Dielectric material |
| US8679536B2 (en) * | 2005-08-24 | 2014-03-25 | Actamax Surgical Materials, Llc | Aldol-crosslinked polymeric hydrogel adhesives |
| US8679537B2 (en) * | 2005-08-24 | 2014-03-25 | Actamaz Surgical Materials, LLC | Methods for sealing an orifice in tissue using an aldol-crosslinked polymeric hydrogel adhesive |
| US7390377B1 (en) | 2005-09-22 | 2008-06-24 | Sandia Corporation | Bonding thermoplastic polymers |
| CN101616750B (zh) * | 2007-05-01 | 2012-07-25 | 贝克株式会社 | 涂装方法 |
| CA2733682C (en) * | 2008-08-12 | 2014-10-14 | Air Products And Chemicals, Inc. | Polymeric compositions comprising per(phenylethynyl) arene derivatives |
| GB2480451A (en) * | 2010-05-18 | 2011-11-23 | E2V Tech | Electron tube rf output window |
| US9006353B2 (en) | 2011-11-18 | 2015-04-14 | Delsper LP | Crosslinking compounds for high glass transition temperature polymers |
| KR20140023856A (ko) * | 2012-08-16 | 2014-02-27 | 동우 화인켐 주식회사 | 아크릴계 점착제 조성물 |
| KR102197418B1 (ko) | 2012-10-22 | 2020-12-31 | 델스퍼 엘피 | 가교된 유기 중합체 조성물 |
| US9273215B2 (en) | 2012-10-30 | 2016-03-01 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
| JP6272908B2 (ja) | 2013-01-28 | 2018-01-31 | デルスパー リミテッド パートナーシップ | シーリングおよび耐摩耗性構成部材のための抗押出性組成物 |
| CA2906858C (en) | 2013-03-15 | 2021-09-21 | Delsper LP | Cross-linked organic polymers for use as elastomers |
| CN103755964B (zh) * | 2013-12-27 | 2016-03-30 | 深圳市安品有机硅材料有限公司 | 聚硅氧烷增粘树脂及其制备方法 |
| US9153357B1 (en) * | 2014-03-27 | 2015-10-06 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
| KR101623771B1 (ko) * | 2014-10-16 | 2016-05-25 | 도레이첨단소재 주식회사 | 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름 |
| US9481810B2 (en) | 2014-12-15 | 2016-11-01 | Rohm And Haas Electronic Materials Llc | Silylated polyarylenes |
| US9752051B2 (en) * | 2015-04-06 | 2017-09-05 | Rohm And Haas Electronic Materials Llc | Polyarylene polymers |
| US10790146B2 (en) * | 2016-12-05 | 2020-09-29 | Rohm And Haas Electronic Materials Llc | Aromatic resins for underlayers |
| BR112022022724A2 (pt) | 2020-06-05 | 2023-02-14 | Dow Global Technologies Llc | Composição, método para a produção da composição, composição adesiva, método para produzir um laminado, e, laminado |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL301721A (enExample) | 1962-12-21 | 1900-01-01 | ||
| US3922299A (en) | 1974-03-05 | 1975-11-25 | Univ Delaware | Vinylic substitution reactions |
| US4642329A (en) | 1984-08-27 | 1987-02-10 | The Dow Chemical Company | Prepolymer processing of arylcyclobutene monomeric compositions |
| US4826997A (en) | 1984-08-27 | 1989-05-02 | The Dow Chemical Company | N-Substituted arylcyclo butenyl-maleimides |
| US4999449A (en) | 1984-08-27 | 1991-03-12 | The Dow Chemical Company | Novel poly(arylcyclobutenes) |
| US4724260A (en) | 1984-08-27 | 1988-02-09 | The Dow Chemical Company | Unsaturated alkyl monoarylcyclobutane monomers |
| US4540763A (en) | 1984-09-14 | 1985-09-10 | The Dow Chemical Company | Polymers derived from poly(arylcyclobutenes) |
| DE3578980D1 (de) | 1984-11-07 | 1990-09-06 | Gen Electric | Silanderivate zur verbesserung der eigenschaften von polyphenylenoxid-polyamidzusammensetzungen. |
| US4783514A (en) | 1986-02-28 | 1988-11-08 | The Dow Chemical Company | Polymeric monoarylcyclobutane compositions |
| US4687823A (en) | 1986-07-01 | 1987-08-18 | The Dow Chemical Company | Alkynyl-bridged poly(arylcyclobutene) resins |
| US4730030A (en) | 1986-07-25 | 1988-03-08 | The Dow Chemical Company | Arylcyclobutane/dienophile copolymer |
| US4732858A (en) | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| US4950583A (en) | 1986-09-17 | 1990-08-21 | Brewer Science Inc. | Adhesion promoting product and process for treating an integrated circuit substrate therewith |
| JPH0749516B2 (ja) | 1987-01-28 | 1995-05-31 | 東レ・ダウコーニング・シリコーン株式会社 | ポリフエニレンオキサイド樹脂組成物 |
| US4759874A (en) | 1987-08-03 | 1988-07-26 | The Dow Chemical Company | Benzocyclobutene-based die attach adhesive compositions |
| US4812588A (en) | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
| US4831172A (en) | 1988-03-23 | 1989-05-16 | The Dow Chemical Company | Benzocyclobutene-based organosilane adhesion aids |
| US5002808A (en) | 1988-03-23 | 1991-03-26 | The Dow Chemical Company | Adhesion methods employing benzocyclobutene-based organosilane adhesion aids |
| JP2594142B2 (ja) | 1988-11-30 | 1997-03-26 | 東芝シリコーン株式会社 | 電子部品の製造方法 |
| US4973636A (en) | 1989-05-30 | 1990-11-27 | Shell Oil Company | Bisbenzocyclobutene/bisimide compositions |
| US5246782A (en) | 1990-12-10 | 1993-09-21 | The Dow Chemical Company | Laminates of polymers having perfluorocyclobutane rings and polymers containing perfluorocyclobutane rings |
| US5025080A (en) | 1990-03-30 | 1991-06-18 | Shell Oil Company | Resin composition from di(arylcyclobutenealkyl) ether of di(hydroxyphenyl) oligomer |
| EP0457351A3 (en) | 1990-05-17 | 1993-03-10 | Mitsubishi Petrochemical Co., Ltd. | Process for producing silane-modified polyphenylene ether and thermoplastic resin composition containing the same |
| US5185391A (en) | 1991-11-27 | 1993-02-09 | The Dow Chemical Company | Oxidation inhibited arylcyclobutene polymers |
| CA2125567A1 (en) | 1991-12-10 | 1993-06-24 | Frank L. Oaks | Photocurable cyclobutarene compositions |
| JP2965277B2 (ja) † | 1992-07-24 | 1999-10-18 | 松下電工株式会社 | ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板 |
| US5416233A (en) | 1994-01-25 | 1995-05-16 | The Dow Chemical Company | Preparation of vinylsilane-benzocyclobutenes |
| US5668210A (en) | 1994-10-24 | 1997-09-16 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
| DE59610089D1 (de) | 1995-11-02 | 2003-03-06 | Ciba Sc Holding Ag | Härtbare Zusammensetzung enthaltend Cycloolefin, Silan und Füllstoff |
| US5965679A (en) | 1996-09-10 | 1999-10-12 | The Dow Chemical Company | Polyphenylene oligomers and polymers |
| JP3858426B2 (ja) | 1998-02-02 | 2006-12-13 | Ｊｓｒ株式会社 | ポリマー組成物 |
-
1998
- 1998-08-24 US US09/138,510 patent/US6184284B1/en not_active Expired - Lifetime
-
1999
- 1999-08-23 WO PCT/US1999/019242 patent/WO2000011096A1/en not_active Ceased
- 1999-08-23 KR KR1020017002305A patent/KR100604629B1/ko not_active Expired - Lifetime
- 1999-08-23 EP EP99943863A patent/EP1112329B2/en not_active Expired - Lifetime
- 1999-08-23 CN CNB998100188A patent/CN1210362C/zh not_active Expired - Lifetime
- 1999-08-23 DE DE69918316T patent/DE69918316T3/de not_active Expired - Lifetime
- 1999-08-23 JP JP2000566357A patent/JP4343443B2/ja not_active Expired - Lifetime
- 1999-08-24 TW TW088114471A patent/TWI234577B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6184284B1 (en) | 2001-02-06 |
| JP2002523549A (ja) | 2002-07-30 |
| DE69918316T2 (de) | 2005-07-21 |
| KR100604629B1 (ko) | 2006-07-28 |
| EP1112329A1 (en) | 2001-07-04 |
| EP1112329B1 (en) | 2004-06-23 |
| WO2000011096A1 (en) | 2000-03-02 |
| JP4343443B2 (ja) | 2009-10-14 |
| TWI234577B (en) | 2005-06-21 |
| EP1112329B2 (en) | 2010-07-14 |
| DE69918316D1 (de) | 2004-07-29 |
| KR20010089172A (ko) | 2001-09-29 |
| CN1210362C (zh) | 2005-07-13 |
| CN1318093A (zh) | 2001-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69918316T3 (de) | Haftvermittler und adhäsionsfähige harzzusammensetzungen und daraus hergestellte gegenstände | |
| DE69918473T2 (de) | Funktionelle Gruppen für die Vernetzung von Polymeren | |
| DE69731010T2 (de) | Polyphenylen-Oligomere und -Polymere | |
| EP2997075B1 (en) | Novel polymer and thermosetting composition containing same | |
| DE69301229T2 (de) | Verfahren zur Herstellung einer Siliciumdioxidschicht | |
| DE3150054C2 (de) | Licht- oder strahlungsempfindliche Polymerzusammensetzungen und ihre Verwendung | |
| DE69505267T2 (de) | Haftvermittler und adhäsionsfähige arylcyclobutanharzzusammensetzung | |
| EP0291778A1 (de) | Verfahren zur Herstellung hochwärmebeständiger Dielektrika | |
| EP0504314A1 (en) | NOVEL BISTRIAZENE COMPOUNDS AND POLYMERIC CROSSLINKED COMPOSITIONS USING THE SAME. | |
| JP2002534546A (ja) | 良好な接着性および靭性を有する低誘電率ポリマーおよび該ポリマーから作製された物品 | |
| DE2601577A1 (de) | Von phenylindan-diaminen sich ableitende, loesliche polyamid-imide | |
| DE69324662T2 (de) | Polyamid-Lösungszusammensetzungen und Verfahren zur Herstellung | |
| EP1323761B1 (en) | Polyphenol resin, process for its production, epoxy resin composition and its use | |
| EP1375559B1 (de) | Dielektrikum mit Sperrwirkung gegen Kupferdiffusion | |
| WO2003031499A2 (de) | Photochemisch und/oder thermisch strukturierbare harze auf silanbasis, einstufiges verfahren zu deren herstellung, dabei einsetzbare ausgangsverbindungen und herstellungsverfahren für diese | |
| KR100741648B1 (ko) | 피막 증강제를 함유하는 스핀-온-유전성 조성물 | |
| US7625636B2 (en) | Insulating-film forming composition, insulating film and preparation process thereof | |
| DE112004001135B4 (de) | Neuartiges Polymer und Herstellung von Nanoporösem, niedrig dielektrischem Polymerverbundfilm unter Verwendung desselben | |
| US6824642B2 (en) | Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties | |
| DE3382653T2 (de) | Chinoxalin-polymere mit biphenylen-endgruppen und ihre verwendung als isolierueberzuege in halbleiterelementen. | |
| EP1375563B1 (de) | Isoliermaterial für Aluminium und Kupfermetallisierungen | |
| DE10147927C1 (de) | Poly-o-hyodroxyamide, Polybenzoxazole, elektronisches Bauteil sowie Verfahren zu ihrer Herstellung | |
| DE10126572B4 (de) | Polyhydroxyamide und daraus erhältliche hochvernetzte chemisch und thermisch stabile Polymere | |
| DE69004897T2 (de) | Zusammensetzungen von Polyimidvorläufern und ihre Verwendungen. | |
| US4791028A (en) | Polymer coatings |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8363 | Opposition against the patent | ||
| 8366 | Restricted maintained after opposition proceedings |