CN1210362C - 增粘剂和自底漆树脂组合物及由其制备的制品 - Google Patents

增粘剂和自底漆树脂组合物及由其制备的制品 Download PDF

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Publication number
CN1210362C
CN1210362C CNB998100188A CN99810018A CN1210362C CN 1210362 C CN1210362 C CN 1210362C CN B998100188 A CNB998100188 A CN B998100188A CN 99810018 A CN99810018 A CN 99810018A CN 1210362 C CN1210362 C CN 1210362C
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CN
China
Prior art keywords
hydrolyzed
mixture
composition
group
silane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB998100188A
Other languages
English (en)
Chinese (zh)
Other versions
CN1318093A (zh
Inventor
T·M·小斯托基克
B·B·马丁
A·J·斯特兰乔德
J·E·赫茨纳
R·F·哈里斯
P·H·汤森三世
D·C·弗赖伊
D·L·施米特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Original Assignee
Dow Chemical Co
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22482345&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1210362(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Chemical Co, Dow Global Technologies LLC filed Critical Dow Chemical Co
Publication of CN1318093A publication Critical patent/CN1318093A/zh
Application granted granted Critical
Publication of CN1210362C publication Critical patent/CN1210362C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D165/02—Polyphenylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB998100188A 1998-08-24 1999-08-23 增粘剂和自底漆树脂组合物及由其制备的制品 Expired - Lifetime CN1210362C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/138,510 1998-08-24
US09/138,510 US6184284B1 (en) 1998-08-24 1998-08-24 Adhesion promoter and self-priming resin compositions and articles made therefrom

Publications (2)

Publication Number Publication Date
CN1318093A CN1318093A (zh) 2001-10-17
CN1210362C true CN1210362C (zh) 2005-07-13

Family

ID=22482345

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998100188A Expired - Lifetime CN1210362C (zh) 1998-08-24 1999-08-23 增粘剂和自底漆树脂组合物及由其制备的制品

Country Status (8)

Country Link
US (1) US6184284B1 (enExample)
EP (1) EP1112329B2 (enExample)
JP (1) JP4343443B2 (enExample)
KR (1) KR100604629B1 (enExample)
CN (1) CN1210362C (enExample)
DE (1) DE69918316T3 (enExample)
TW (1) TWI234577B (enExample)
WO (1) WO2000011096A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002534546A (ja) 1999-01-08 2002-10-15 ザ ダウ ケミカル カンパニー 良好な接着性および靭性を有する低誘電率ポリマーおよび該ポリマーから作製された物品
US7115531B2 (en) 2000-08-21 2006-10-03 Dow Global Technologies Inc. Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
US6710450B2 (en) * 2001-02-28 2004-03-23 International Business Machines Corporation Interconnect structure with precise conductor resistance and method to form same
JP5320653B2 (ja) 2001-03-26 2013-10-23 Ｊｓｒ株式会社 膜形成用組成物および絶縁膜形成用材料
AU2002305835A1 (en) * 2001-06-08 2002-12-23 The Regents Of The University Of Michigan Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
CN1630744A (zh) * 2001-09-07 2005-06-22 博登化学公司 使用粘合促进剂的涂覆光纤及其制备和使用方法
US6806182B2 (en) * 2002-05-01 2004-10-19 International Business Machines Corporation Method for eliminating via resistance shift in organic ILD
TW200426191A (en) * 2003-03-27 2004-12-01 Sumitomo Chemical Co Coating liquid for forming insulating film and method for producing insulating film
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
US20050100712A1 (en) * 2003-11-12 2005-05-12 Simmons Blake A. Polymerization welding and application to microfluidics
US8790632B2 (en) * 2004-10-07 2014-07-29 Actamax Surgical Materials, Llc Polymer-based tissue-adhesive form medical use
JP2006104375A (ja) * 2004-10-07 2006-04-20 Sumitomo Chemical Co Ltd 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜
US20060275616A1 (en) * 2005-06-03 2006-12-07 Clough Robert S Silane-based coupling agent
US20070004844A1 (en) * 2005-06-30 2007-01-04 Clough Robert S Dielectric material
US8679536B2 (en) * 2005-08-24 2014-03-25 Actamax Surgical Materials, Llc Aldol-crosslinked polymeric hydrogel adhesives
US8679537B2 (en) * 2005-08-24 2014-03-25 Actamaz Surgical Materials, LLC Methods for sealing an orifice in tissue using an aldol-crosslinked polymeric hydrogel adhesive
US7390377B1 (en) 2005-09-22 2008-06-24 Sandia Corporation Bonding thermoplastic polymers
CN101616750B (zh) * 2007-05-01 2012-07-25 贝克株式会社 涂装方法
CA2733682C (en) * 2008-08-12 2014-10-14 Air Products And Chemicals, Inc. Polymeric compositions comprising per(phenylethynyl) arene derivatives
GB2480451A (en) * 2010-05-18 2011-11-23 E2V Tech Electron tube rf output window
US9006353B2 (en) 2011-11-18 2015-04-14 Delsper LP Crosslinking compounds for high glass transition temperature polymers
KR20140023856A (ko) * 2012-08-16 2014-02-27 동우 화인켐 주식회사 아크릴계 점착제 조성물
KR102197418B1 (ko) 2012-10-22 2020-12-31 델스퍼 엘피 가교된 유기 중합체 조성물
US9273215B2 (en) 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
JP6272908B2 (ja) 2013-01-28 2018-01-31 デルスパー リミテッド パートナーシップ シーリングおよび耐摩耗性構成部材のための抗押出性組成物
CA2906858C (en) 2013-03-15 2021-09-21 Delsper LP Cross-linked organic polymers for use as elastomers
CN103755964B (zh) * 2013-12-27 2016-03-30 深圳市安品有机硅材料有限公司 聚硅氧烷增粘树脂及其制备方法
US9153357B1 (en) * 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
KR101623771B1 (ko) * 2014-10-16 2016-05-25 도레이첨단소재 주식회사 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름
US9481810B2 (en) 2014-12-15 2016-11-01 Rohm And Haas Electronic Materials Llc Silylated polyarylenes
US9752051B2 (en) * 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
US10790146B2 (en) * 2016-12-05 2020-09-29 Rohm And Haas Electronic Materials Llc Aromatic resins for underlayers
BR112022022724A2 (pt) 2020-06-05 2023-02-14 Dow Global Technologies Llc Composição, método para a produção da composição, composição adesiva, método para produzir um laminado, e, laminado

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL301721A (enExample) 1962-12-21 1900-01-01
US3922299A (en) 1974-03-05 1975-11-25 Univ Delaware Vinylic substitution reactions
US4642329A (en) 1984-08-27 1987-02-10 The Dow Chemical Company Prepolymer processing of arylcyclobutene monomeric compositions
US4826997A (en) 1984-08-27 1989-05-02 The Dow Chemical Company N-Substituted arylcyclo butenyl-maleimides
US4999449A (en) 1984-08-27 1991-03-12 The Dow Chemical Company Novel poly(arylcyclobutenes)
US4724260A (en) 1984-08-27 1988-02-09 The Dow Chemical Company Unsaturated alkyl monoarylcyclobutane monomers
US4540763A (en) 1984-09-14 1985-09-10 The Dow Chemical Company Polymers derived from poly(arylcyclobutenes)
DE3578980D1 (de) 1984-11-07 1990-09-06 Gen Electric Silanderivate zur verbesserung der eigenschaften von polyphenylenoxid-polyamidzusammensetzungen.
US4783514A (en) 1986-02-28 1988-11-08 The Dow Chemical Company Polymeric monoarylcyclobutane compositions
US4687823A (en) 1986-07-01 1987-08-18 The Dow Chemical Company Alkynyl-bridged poly(arylcyclobutene) resins
US4730030A (en) 1986-07-25 1988-03-08 The Dow Chemical Company Arylcyclobutane/dienophile copolymer
US4732858A (en) 1986-09-17 1988-03-22 Brewer Science, Inc. Adhesion promoting product and process for treating an integrated circuit substrate
US4950583A (en) 1986-09-17 1990-08-21 Brewer Science Inc. Adhesion promoting product and process for treating an integrated circuit substrate therewith
JPH0749516B2 (ja) 1987-01-28 1995-05-31 東レ・ダウコーニング・シリコーン株式会社 ポリフエニレンオキサイド樹脂組成物
US4759874A (en) 1987-08-03 1988-07-26 The Dow Chemical Company Benzocyclobutene-based die attach adhesive compositions
US4812588A (en) 1987-12-14 1989-03-14 The Dow Chemical Company Polyorganosiloxane-bridged bisbenzocyclobutene monomers
US4831172A (en) 1988-03-23 1989-05-16 The Dow Chemical Company Benzocyclobutene-based organosilane adhesion aids
US5002808A (en) 1988-03-23 1991-03-26 The Dow Chemical Company Adhesion methods employing benzocyclobutene-based organosilane adhesion aids
JP2594142B2 (ja) 1988-11-30 1997-03-26 東芝シリコーン株式会社 電子部品の製造方法
US4973636A (en) 1989-05-30 1990-11-27 Shell Oil Company Bisbenzocyclobutene/bisimide compositions
US5246782A (en) 1990-12-10 1993-09-21 The Dow Chemical Company Laminates of polymers having perfluorocyclobutane rings and polymers containing perfluorocyclobutane rings
US5025080A (en) 1990-03-30 1991-06-18 Shell Oil Company Resin composition from di(arylcyclobutenealkyl) ether of di(hydroxyphenyl) oligomer
EP0457351A3 (en) 1990-05-17 1993-03-10 Mitsubishi Petrochemical Co., Ltd. Process for producing silane-modified polyphenylene ether and thermoplastic resin composition containing the same
US5185391A (en) 1991-11-27 1993-02-09 The Dow Chemical Company Oxidation inhibited arylcyclobutene polymers
CA2125567A1 (en) 1991-12-10 1993-06-24 Frank L. Oaks Photocurable cyclobutarene compositions
JP2965277B2 (ja) † 1992-07-24 1999-10-18 松下電工株式会社 ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板
US5416233A (en) 1994-01-25 1995-05-16 The Dow Chemical Company Preparation of vinylsilane-benzocyclobutenes
US5668210A (en) 1994-10-24 1997-09-16 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
DE59610089D1 (de) 1995-11-02 2003-03-06 Ciba Sc Holding Ag Härtbare Zusammensetzung enthaltend Cycloolefin, Silan und Füllstoff
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
JP3858426B2 (ja) 1998-02-02 2006-12-13 Ｊｓｒ株式会社 ポリマー組成物

Also Published As

Publication number Publication date
US6184284B1 (en) 2001-02-06
JP2002523549A (ja) 2002-07-30
DE69918316T2 (de) 2005-07-21
KR100604629B1 (ko) 2006-07-28
EP1112329A1 (en) 2001-07-04
EP1112329B1 (en) 2004-06-23
DE69918316T3 (de) 2011-02-24
WO2000011096A1 (en) 2000-03-02
JP4343443B2 (ja) 2009-10-14
TWI234577B (en) 2005-06-21
EP1112329B2 (en) 2010-07-14
DE69918316D1 (de) 2004-07-29
KR20010089172A (ko) 2001-09-29
CN1318093A (zh) 2001-10-17

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C06 Publication
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SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: DOW GLOBAL TECHNICAL COMPANY

Free format text: FORMER OWNER: THE DOW CHEMICAL CO.

Effective date: 20021226

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

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Address after: Michigan

Applicant after: Dow Global Technologies Inc.

Address before: Michigan

Applicant before: The Dow Chemical Co.

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Granted publication date: 20050713

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