CN1576294A - 用于电绝缘材料的聚酰亚胺树脂 - Google Patents
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Abstract
本发明提供一种用于电绝缘材料的聚酰亚胺树脂,其包含具有通式(I)所示的重复单元的聚酰亚胺树脂,其中R1表示二价有机基团。
Description
技术领域
本发明涉及用于电绝缘材料的聚酰亚胺树脂。更具体而言,本发明涉及具有低相对介电常数(permittivity)和低介电损耗因子以及高耐热性的聚酰亚胺树脂,其特别适合用作在高频下操作的电器(electric appliances)的布线电路板(wiring circuit board)中的绝缘材料。
背景技术
近年来,信息/通信设备例如PHS和蜂窝电话的信号频率区以及计算机CPU的时钟频率已经达到千兆赫(GHz)区域,使用更高频率的趋势明显。
通常,在布线电路中电信号的介电损耗与用于布线电路的绝缘体的相对介电常数的平方根、绝缘体的介电损耗因子和要使用的信号频率的乘积成正比。因此,信号的频率越高,介电损耗越大。因为介电损耗因子减弱了电信号而降低了信号的可靠性,所以有必要使用具有低相对介电常数和低介电损耗因子的绝缘材料。
聚酰亚胺树脂已经广泛用作布线电路板中的绝缘层,例如绝缘基层(insulating base layers)和绝缘盖层(insulating cover layers)。具体地,因为聚醚酰亚胺具有良好的耐热性、电绝缘性、机械性能等,所以聚醚酰亚胺常用作IC板和印制电路板(printed wiring boards)的绝缘材料。(见例如下面列举的专利文件1)
但是,大部分已知的聚醚酰亚胺的相对介电常数和介电损耗因子比较高,因此由于其性能原因,限制了此种聚醚酰亚胺用作高密度多层集成电路或高速高频率应用中的电路的绝缘材料。因此,已经了解用于补偿聚醚酰亚胺这种电性质的技术,该技术包括聚亚苯基醚与聚醚酰亚胺共混的技术(见例如下面列举的专利文件2)和芳香族乙烯基化合物作为交联成分与聚醚酰亚胺共混的技术(见例如下面列举的专利文件3),其中聚亚苯基醚具有低相对介电常数和较好的电性质,但是其机械强度、可模塑性(moldability)和耐热性差。但是,由于这些聚合物共混物中使用的聚合物通常与聚醚酰亚胺不相容,所以得到的聚合物共混物的机械性能和耐热性没有充分提高。
即,至今尚未知道任何具有以下所有性质的聚酰亚胺:低相对介电常数、低介电损耗因子和高耐热性,并因此适合作为在高频下操作的电器的布线电路板的绝缘材料。
专利文件1:JP 2001-151935A
专利文件2:JP 05-179140A
专利文件3:JP 05-156159A
发明内容
为了克服上述与将聚酰亚胺树脂用作电绝缘材料相关的问题,完成了本发明。
因此,本发明的目的是提供用作电绝缘材料的聚酰亚胺树脂,具体地其具有下列全部特性:低相对介电常数、低介电损耗因子和高耐热性,并因此适合作为在高频下操作的电器的布线电路板的绝缘材料。
从下面的说明中,本发明的其它目的和效果将会很明显。
本发明提供用于电绝缘材料的聚酰亚胺树脂,其包含具有通式(I)所示的重复单元的聚酰亚胺树脂:
其中R1表示二价有机基团。
本发明的用于电绝缘材料的聚酰亚胺树脂具有低相对介电常数和低介电损耗因子,即在1MHz下具有3.0或更低的相对介电常数以及在1MHz下具有0.003或更低的介电损耗因子,并因此适用于形成在高频区域中介电损耗降低的绝缘层。
发明详述
本发明的用于电绝缘材料的聚酰亚胺树脂具有通式(I)所示的重复单元:
其中R1表示二价有机基团。
具体而言,在本发明的具有通式(I)所示的重复单元的聚酰亚胺树脂中,二价有机基团R1优选为下述通式(II)、式(III)和式(IV)所示中的一种:
通式(II):
其中,R2各自独立地表示氢原子、卤原子或烃基,n表示1~5的整数;
式(III):
式(IV):
可以通过以下方法制备这种聚酰亚胺树脂:使下式(V)所示的2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BSAA)与下述通式(VI)所示的二胺进行反应而获得通式(VII)所示的聚酰胺酸,然后酰亚胺化(imidizing)聚酰胺酸(poly(amic acid));
H2N-R1-NH2(VI)
其中,R1与上述定义的相同;
其中,R1与上述定义的相同。
通式(I)所示的聚酰亚胺树脂中的二价基团R1是用于制备聚酰胺酸的通式(VI)所示的二胺的残基(即,从二胺结构上除去两个氨基而形成的二价基团)。即,根据本发明,具有低相对介电常数和低介电损耗因子的聚酰亚胺树脂可以通过使用具有二价基团R1的二胺而获得。另外,也由于具有二价基团R1的二胺反应性高,可以有利地使用具有二价基团R1的二胺。
当二价基团R1为通式(II)所示的二价基团时,R2的实例如下。当R2为卤原子,其优选实例包括氯和溴原子。当R2为烃基时,其优选实例包括烷基如甲基、乙基和丙基;芳基如苯基和萘基;芳基烷基如苄基。符号n优选为1~3的整数。
因此,具有二价基团R1的二胺的实例包括1,4-双(4-氨基苯氧基)苯、1,4-双(3-氨基苯氧基)苯、1,3-双(4-氨基苯氧基)苯、1,3-双(3-氨基苯氧基)苯、1,3-双(3-(3-氨基苯氧基)苯氧基)苯、2,2′-二甲基-4,4′-二氨基联苯和2,2-双(4-(4-氨基苯氧基)苯基)-1,1,1,3,3,3-六氟丙烷。
可以优选在有机溶剂中,通过将2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BSAA)和二胺进行反应,通常以溶液形式获得聚酰胺酸。通常在常压和100℃或更低,优选80℃或更低的温度下,进行2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BSAA)和二胺的反应。反应时间随使用的二胺和溶剂以及反应温度而变化,但是通常为4~24小时。如此获得的聚酰胺酸的数均分子量通常为1000~100,000,优选为5000~50,000。
有机溶剂的实例包括N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基-2-吡咯烷酮和1,3-二甲基-2-咪唑啉酮。但是所使用的有机溶剂应当被解释为不局限于这些实例。
为了形成包含本发明的从所获得的聚酰胺酸溶液生成的聚酰亚胺树脂的绝缘层,可以使用包括下述步骤的方法:将聚酰胺酸溶液涂布到合适基材上,接着干燥该溶液形成涂布膜(coating film),然后加热该涂布膜而酰亚胺化该聚合物,由此形成包含聚酰亚胺树脂的涂布膜。这种酰亚胺化聚酰胺酸的加热温度范围通常为100~450℃,优选为130~400℃。
本发明用于电绝缘材料的聚酰亚胺树脂适用于例如形成布线电路板中的绝缘层。虽然并不具体限定布线电路板,其实例包括在电气/电子设备中的布线电路板和多层布线电路板,例如挠性布线电路板和电路支撑悬挂板(circuit-bearing suspension board)。本发明的聚酰亚胺树脂可以有利地用于形成各种绝缘层,例如在此种布线电路板中的绝缘基层和绝缘盖层,以及在多层布线电路板中的中间层电介质。但是,应该指出没有具体限定作为电绝缘材料的本发明的聚酰亚胺树脂的用途。
实施例
下面将参考实施例和比较例,更详细地描述本发明,但是不应当将本发明解释为局限于此。
实施例1
向500毫升容积的可分离四口烧瓶中,加入16.08克(55毫摩尔)1,4-双(4-氨基苯氧基)苯、28.63克(55毫摩尔)2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BSAA)和178.82克N,N-二甲基乙酰胺。将得到的混合物在室温下搅拌24小时,获得聚酰胺酸的N,N-二甲基乙酰胺溶液。
该聚酰胺酸的N,N-二甲基乙酰胺溶液用涂布器浇注到玻璃板上。在循环热气干燥炉中,于300℃下加热涂布后的溶液2小时,然后在380℃下在空气中加热30分钟,以便将聚酰胺酸酰亚胺化。因此,得到了聚酰亚胺树脂膜。从玻璃板上将该膜剥离,并用下述方法测量相对介电常数、介电损耗因子和玻璃化点(上述内容适用于下文)。
实施例2
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用1,4-双(3-氨基苯氧基)苯作为二胺。
实施例3
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用2,2-双(4-(4-氨基苯氧基)苯基)-1,1,1,3,3,3-六氟丙烷作为二胺。
实施例4
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用1,3-双(4-氨基苯氧基)苯作为二胺。
实施例5
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用2,2′-二甲基-4,4`-二氨基联苯作为二胺。
实施例6
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用1,3-双(3-氨基苯氧基)苯作为二胺。
实施例7
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用1,3-双(3-(3-氨基苯氧基)苯氧基)苯作为二胺。
比较例1
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用间苯二胺作为二胺。
比较例2
以与实施例1相同的方式得到聚酰亚胺树脂膜,不同之处在于使用联苯四羧酸二酐作为酸二酐。
在实施例1~7和比较例1~2中得到的聚酰亚胺树脂膜的相对介电常数、介电损耗因子和玻璃化点示于表1。
表1
玻璃化点(℃) | 相对介电常数 | 介电损耗因子 | |||
1MHz | 10GMz | 1MHz | 10GMz | ||
实施例1 | 161 | 2.74 | 2.61 | 0.0008 | 0.0024 |
实施例2 | 202 | 2.74 | 2.63 | 0.0011 | 0.0031 |
实施例3 | 207 | 2.72 | 2.59 | 0.0012 | 0.0037 |
实施例4 | 191 | 2.82 | 2.69 | 0.0021 | 0.0062 |
实施例5 | 229 | 2.5 | 2.37 | 0.0008 | 0.0025 |
实施例6 | 161 | 2.56 | 2.35 | 0.0010 | 0.0030 |
实施例7 | 133 | 2.83 | 2.64 | 0.0024 | 0.0050 |
比较例1 | 214 | 3.68 | 3.55 | 0.0035 | 0.0105 |
比较例2 | 257 | 3.32 | 3.19 | 0.0031 | 0.0090 |
按下面的方式测量各聚酰亚胺树脂的相对介电常数、介电损耗因子和玻璃化点。
测量相对介电常数和介电损耗因子
使用Yokogawa-Hewlett-Packard公司制造的介电分析仪(dielectricanalyzer)HP16451B,在1MHz下测量相对介电常数和介电损耗因子。而且,使用Kanto Electronics Application and Development公司制造的矢量网路分析仪(vector network analyzer)HP8753D/E,在10GHz下测量相对介电常数和介电损耗因子。
测量玻璃化点
按设备说明书,使用Seiko Instruments公司制造的TMA/SS100,以10℃/分钟的速度将聚酰亚胺树脂膜从30℃加热到400℃,测量玻璃化点。
虽然已经参考具体实施方式详细地描述了本发明,对本领域普通技术人员来说,在不脱离本发明精神和范围的情况下,对本发明作出不同的改变和改进是显而易见的。
本申请基于日本专利申请2003-191898(2003年7月4日提交)和2004-118715(2004年4月14日提交),在此引入其全部内容作为参考。
Claims (7)
1.一种用于电绝缘材料的聚酰亚胺树脂,其包含具有通式(I)所示的重复单元的聚酰亚胺树脂:
其中R1表示二价有机基团。
3.根据权利要求1的聚酰亚胺树脂,其中所述R1由通式(II)表示。
4.根据权利要求1的聚酰亚胺树脂,其中所述R1由式(III)表示。
5.根据权利要求1的聚酰亚胺树脂,其中所述R1由式(IV)表示。
6.根据权利要求1的聚酰亚胺树脂,其数均分子量为1000~100000。
7.根据权利要求1的聚酰亚胺树脂,其数均分子量为5000~50000。
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JP191898/03 | 2003-07-04 | ||
JP2003191898 | 2003-07-04 | ||
JP191898/2003 | 2003-07-04 | ||
JP2004118715A JP2005042091A (ja) | 2003-07-04 | 2004-04-14 | 電気絶縁材料用ポリイミド樹脂 |
JP118715/2004 | 2004-04-14 | ||
JP118715/04 | 2004-04-14 |
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CN1576294A true CN1576294A (zh) | 2005-02-09 |
CN100339416C CN100339416C (zh) | 2007-09-26 |
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US (1) | US7074882B2 (zh) |
EP (1) | EP1494247B1 (zh) |
JP (1) | JP2005042091A (zh) |
KR (1) | KR20050004110A (zh) |
CN (1) | CN100339416C (zh) |
DE (1) | DE602004000671T2 (zh) |
Cited By (1)
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CN113913149A (zh) * | 2021-11-18 | 2022-01-11 | 广州联茂电子科技有限公司 | 一种改良聚酰亚胺粘着剂和软性金属箔基板及制备方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MXPA05002968A (es) * | 2002-09-16 | 2005-09-08 | Univ Johns Hopkins | Activacion de miostatina por metaloproteasa, y metodos de modular la actividad de miostatina. |
US8501279B2 (en) | 2005-10-25 | 2013-08-06 | Hitachi Chemical Company, Ltd. | Flexible laminate board, process for manufacturing of the board, and flexible print wiring board |
WO2008083258A1 (en) * | 2006-12-29 | 2008-07-10 | Adaptivenergy, Llc. | Polyimide/copolyimide films with low glass transition temperature for use as hot melt adhesives |
US8248755B2 (en) * | 2010-04-30 | 2012-08-21 | General Electric Company | Polyimides and thin films, electronic articles and capacitors comprising these, and methods of making them |
JP2012224697A (ja) * | 2011-04-18 | 2012-11-15 | Sumitomo Electric Wintec Inc | ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ |
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JP6441732B2 (ja) * | 2014-04-24 | 2018-12-19 | Jfeケミカル株式会社 | ポリアミド酸組成物およびポリイミド組成物 |
CN103980491B (zh) * | 2014-05-23 | 2016-04-06 | 哈尔滨工业大学 | 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法 |
PH12017000015A1 (en) * | 2016-01-15 | 2018-08-06 | Jx Nippon Mining & Metals Corp | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for poducing electronic apparatus, method for producing transmission channel, and method for producing antenna |
JP6789186B2 (ja) * | 2017-07-07 | 2020-11-25 | Jfeケミカル株式会社 | ポリアミド酸、ポリイミド、電子基板、高周波基板およびカバーレイフィルム |
JP6858693B2 (ja) * | 2017-12-12 | 2021-04-14 | Jfeケミカル株式会社 | 高周波基板材料用ポリアミド酸、高周波基板材料用ポリイミド、高周波基板材料用ポリイミドフィルム、高周波基板材料用ポリイミド成形体および高周波基板 |
JP7319950B2 (ja) * | 2020-06-22 | 2023-08-02 | Jfeケミカル株式会社 | ポリアミド酸、ポリイミド、ポリイミドフィルム、電子基板用材料および電子基板 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3847867A (en) * | 1971-01-20 | 1974-11-12 | Gen Electric | Polyetherimides |
JPS5912420A (ja) * | 1982-07-14 | 1984-01-23 | Hitachi Ltd | 絶縁膜を有する素子 |
DE3506526A1 (de) | 1985-02-25 | 1986-08-28 | Akzo Gmbh, 5600 Wuppertal | Gedrucktes schaltelement mit polyimid enthaltender deckschicht |
US4978742A (en) * | 1988-09-30 | 1990-12-18 | Hoechst Celanese Corp. | Polymers prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoro propane |
DE68927376D1 (de) * | 1988-12-27 | 1996-11-28 | Mitsui Toatsu Chemicals | Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung |
JPH04342724A (ja) * | 1991-05-17 | 1992-11-30 | Kanegafuchi Chem Ind Co Ltd | 芳香族ポリイミド重合体及びポリアミック酸重合体 |
DE4135058A1 (de) | 1991-10-24 | 1993-04-29 | Basf Lacke & Farben | Loesungen von polyimidbildenden ausgangsstoffen |
JPH05156159A (ja) | 1991-12-02 | 1993-06-22 | Sekiyu Sangyo Kasseika Center | 樹脂組成物およびその製造方法 |
JPH05179140A (ja) | 1991-12-29 | 1993-07-20 | Sekiyu Sangyo Kasseika Center | ポリマー組成物およびその製造方法 |
US5328979A (en) * | 1992-11-16 | 1994-07-12 | The University Of Akron | Thermoplastic copolyimides and composites therefrom |
JP2914852B2 (ja) * | 1993-08-17 | 1999-07-05 | 信越化学工業株式会社 | 回路保護用膜 |
JP3663603B2 (ja) * | 1994-09-09 | 2005-06-22 | Jsr株式会社 | 液晶配向剤 |
US5917005A (en) * | 1997-07-14 | 1999-06-29 | General Electric Company | Polyetherimides with resistance to high temperatures |
JP2000248253A (ja) * | 1998-12-28 | 2000-09-12 | Mitsui Chemicals Inc | 耐熱性接着剤 |
US6492030B1 (en) * | 1999-02-03 | 2002-12-10 | Tomoegawa Paper Co., Ltd. | Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same |
JP2000289165A (ja) * | 1999-04-08 | 2000-10-17 | Kanegafuchi Chem Ind Co Ltd | 耐熱性ボンディングシート |
JP2001151935A (ja) | 1999-11-30 | 2001-06-05 | Otsuka Chem Co Ltd | 回路基板用樹脂組成物 |
JP3482946B2 (ja) * | 2000-06-28 | 2004-01-06 | 日立化成工業株式会社 | 接着フィルム及び半導体装置 |
JP2002363283A (ja) * | 2001-06-06 | 2002-12-18 | Nitto Denko Corp | ポリアミド酸とそれより得られるポリイミド樹脂とそれらの回路基板への利用 |
US6500904B1 (en) * | 2001-11-02 | 2002-12-31 | General Electric Company | High molecular weight poly(imide)s and methods of synthesis thereof |
JP4132825B2 (ja) | 2002-01-10 | 2008-08-13 | 日東電工株式会社 | 金属箔積層体及びその製造方法 |
JP2004359868A (ja) * | 2003-06-05 | 2004-12-24 | Kaneka Corp | 熱可塑ポリイミド性樹脂の製造方法 |
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- 2004-04-14 JP JP2004118715A patent/JP2005042091A/ja active Pending
- 2004-07-02 KR KR1020040051570A patent/KR20050004110A/ko not_active Application Discontinuation
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- 2004-07-02 EP EP04015684A patent/EP1494247B1/en not_active Expired - Fee Related
- 2004-07-02 US US10/882,304 patent/US7074882B2/en not_active Expired - Fee Related
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113913149A (zh) * | 2021-11-18 | 2022-01-11 | 广州联茂电子科技有限公司 | 一种改良聚酰亚胺粘着剂和软性金属箔基板及制备方法 |
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DE602004000671D1 (de) | 2006-05-24 |
US20050004323A1 (en) | 2005-01-06 |
JP2005042091A (ja) | 2005-02-17 |
KR20050004110A (ko) | 2005-01-12 |
DE602004000671T2 (de) | 2006-08-31 |
US7074882B2 (en) | 2006-07-11 |
CN100339416C (zh) | 2007-09-26 |
EP1494247B1 (en) | 2006-04-19 |
EP1494247A1 (en) | 2005-01-05 |
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