DE602004000671D1 - Polyimidmassen für elektrische Isolation - Google Patents

Polyimidmassen für elektrische Isolation

Info

Publication number
DE602004000671D1
DE602004000671D1 DE602004000671T DE602004000671T DE602004000671D1 DE 602004000671 D1 DE602004000671 D1 DE 602004000671D1 DE 602004000671 T DE602004000671 T DE 602004000671T DE 602004000671 T DE602004000671 T DE 602004000671T DE 602004000671 D1 DE602004000671 D1 DE 602004000671D1
Authority
DE
Germany
Prior art keywords
electrical insulation
polyimide materials
polyimide
materials
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004000671T
Other languages
English (en)
Other versions
DE602004000671T2 (de
Inventor
Takami Hikita
Hisae Sugihara
Amane Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602004000671D1 publication Critical patent/DE602004000671D1/de
Application granted granted Critical
Publication of DE602004000671T2 publication Critical patent/DE602004000671T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/427—Polyethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE602004000671T 2003-07-04 2004-07-02 Polyimidmassen für elektrische Isolation Expired - Fee Related DE602004000671T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003191898 2003-07-04
JP2003191898 2003-07-04
JP2004118715 2004-04-14
JP2004118715A JP2005042091A (ja) 2003-07-04 2004-04-14 電気絶縁材料用ポリイミド樹脂

Publications (2)

Publication Number Publication Date
DE602004000671D1 true DE602004000671D1 (de) 2006-05-24
DE602004000671T2 DE602004000671T2 (de) 2006-08-31

Family

ID=33436479

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004000671T Expired - Fee Related DE602004000671T2 (de) 2003-07-04 2004-07-02 Polyimidmassen für elektrische Isolation

Country Status (6)

Country Link
US (1) US7074882B2 (de)
EP (1) EP1494247B1 (de)
JP (1) JP2005042091A (de)
KR (1) KR20050004110A (de)
CN (1) CN100339416C (de)
DE (1) DE602004000671T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2498044A1 (en) * 2002-09-16 2004-03-25 Wyeth Metalloprotease activation of myostatin, and methods of modulating myostatin activity
CN102752956B (zh) 2005-10-25 2015-04-08 日立化成株式会社 挠性层合板以及挠性印刷电路板
WO2008083258A1 (en) * 2006-12-29 2008-07-10 Adaptivenergy, Llc. Polyimide/copolyimide films with low glass transition temperature for use as hot melt adhesives
US8248755B2 (en) * 2010-04-30 2012-08-21 General Electric Company Polyimides and thin films, electronic articles and capacitors comprising these, and methods of making them
JP2012224697A (ja) * 2011-04-18 2012-11-15 Sumitomo Electric Wintec Inc ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ
CN103762437A (zh) * 2013-12-31 2014-04-30 镇江蓝箭电子有限公司 一种高性能射频同轴连接器介质支撑的制作方法
JP6441732B2 (ja) * 2014-04-24 2018-12-19 Ｊｆｅケミカル株式会社 ポリアミド酸組成物およびポリイミド組成物
CN103980491B (zh) * 2014-05-23 2016-04-06 哈尔滨工业大学 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法
US10448507B2 (en) * 2016-01-15 2019-10-15 Jx Nippon Mining & Metals Corporation Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
JP6789186B2 (ja) * 2017-07-07 2020-11-25 Ｊｆｅケミカル株式会社 ポリアミド酸、ポリイミド、電子基板、高周波基板およびカバーレイフィルム
JP6858693B2 (ja) * 2017-12-12 2021-04-14 Ｊｆｅケミカル株式会社 高周波基板材料用ポリアミド酸、高周波基板材料用ポリイミド、高周波基板材料用ポリイミドフィルム、高周波基板材料用ポリイミド成形体および高周波基板
JP7319950B2 (ja) * 2020-06-22 2023-08-02 Ｊｆｅケミカル株式会社 ポリアミド酸、ポリイミド、ポリイミドフィルム、電子基板用材料および電子基板
CN113913149A (zh) * 2021-11-18 2022-01-11 广州联茂电子科技有限公司 一种改良聚酰亚胺粘着剂和软性金属箔基板及制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3847867A (en) 1971-01-20 1974-11-12 Gen Electric Polyetherimides
JPS5912420A (ja) * 1982-07-14 1984-01-23 Hitachi Ltd 絶縁膜を有する素子
DE3506526A1 (de) * 1985-02-25 1986-08-28 Akzo Gmbh, 5600 Wuppertal Gedrucktes schaltelement mit polyimid enthaltender deckschicht
US4978742A (en) * 1988-09-30 1990-12-18 Hoechst Celanese Corp. Polymers prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoro propane
DE68927376D1 (de) * 1988-12-27 1996-11-28 Mitsui Toatsu Chemicals Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung
JPH04342724A (ja) * 1991-05-17 1992-11-30 Kanegafuchi Chem Ind Co Ltd 芳香族ポリイミド重合体及びポリアミック酸重合体
DE4135058A1 (de) * 1991-10-24 1993-04-29 Basf Lacke & Farben Loesungen von polyimidbildenden ausgangsstoffen
JPH05156159A (ja) 1991-12-02 1993-06-22 Sekiyu Sangyo Kasseika Center 樹脂組成物およびその製造方法
JPH05179140A (ja) 1991-12-29 1993-07-20 Sekiyu Sangyo Kasseika Center ポリマー組成物およびその製造方法
US5328979A (en) * 1992-11-16 1994-07-12 The University Of Akron Thermoplastic copolyimides and composites therefrom
JP2914852B2 (ja) * 1993-08-17 1999-07-05 信越化学工業株式会社 回路保護用膜
JP3663603B2 (ja) * 1994-09-09 2005-06-22 Ｊｓｒ株式会社 液晶配向剤
US5917005A (en) * 1997-07-14 1999-06-29 General Electric Company Polyetherimides with resistance to high temperatures
JP2000248253A (ja) * 1998-12-28 2000-09-12 Mitsui Chemicals Inc 耐熱性接着剤
TWI228727B (en) * 1999-02-03 2005-03-01 Tomoegawa Paper Co Ltd Thermosetting low dielectric resin composition, and prepreg, laminate, and laminate for circuit employing said resin composition
JP2000289165A (ja) * 1999-04-08 2000-10-17 Kanegafuchi Chem Ind Co Ltd 耐熱性ボンディングシート
JP2001151935A (ja) 1999-11-30 2001-06-05 Otsuka Chem Co Ltd 回路基板用樹脂組成物
JP3482946B2 (ja) * 2000-06-28 2004-01-06 日立化成工業株式会社 接着フィルム及び半導体装置
JP2002363283A (ja) * 2001-06-06 2002-12-18 Nitto Denko Corp ポリアミド酸とそれより得られるポリイミド樹脂とそれらの回路基板への利用
US6500904B1 (en) * 2001-11-02 2002-12-31 General Electric Company High molecular weight poly(imide)s and methods of synthesis thereof
JP4132825B2 (ja) * 2002-01-10 2008-08-13 日東電工株式会社 金属箔積層体及びその製造方法
JP2004359868A (ja) * 2003-06-05 2004-12-24 Kaneka Corp 熱可塑ポリイミド性樹脂の製造方法

Also Published As

Publication number Publication date
EP1494247A1 (de) 2005-01-05
DE602004000671T2 (de) 2006-08-31
JP2005042091A (ja) 2005-02-17
US20050004323A1 (en) 2005-01-06
KR20050004110A (ko) 2005-01-12
EP1494247B1 (de) 2006-04-19
US7074882B2 (en) 2006-07-11
CN1576294A (zh) 2005-02-09
CN100339416C (zh) 2007-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee