DE602004000671D1 - Polyimidmassen für elektrische Isolation - Google Patents
Polyimidmassen für elektrische IsolationInfo
- Publication number
- DE602004000671D1 DE602004000671D1 DE602004000671T DE602004000671T DE602004000671D1 DE 602004000671 D1 DE602004000671 D1 DE 602004000671D1 DE 602004000671 T DE602004000671 T DE 602004000671T DE 602004000671 T DE602004000671 T DE 602004000671T DE 602004000671 D1 DE602004000671 D1 DE 602004000671D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical insulation
- polyimide materials
- polyimide
- materials
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003191898 | 2003-07-04 | ||
JP2003191898 | 2003-07-04 | ||
JP2004118715A JP2005042091A (ja) | 2003-07-04 | 2004-04-14 | 電気絶縁材料用ポリイミド樹脂 |
JP2004118715 | 2004-04-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004000671D1 true DE602004000671D1 (de) | 2006-05-24 |
DE602004000671T2 DE602004000671T2 (de) | 2006-08-31 |
Family
ID=33436479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004000671T Expired - Fee Related DE602004000671T2 (de) | 2003-07-04 | 2004-07-02 | Polyimidmassen für elektrische Isolation |
Country Status (6)
Country | Link |
---|---|
US (1) | US7074882B2 (de) |
EP (1) | EP1494247B1 (de) |
JP (1) | JP2005042091A (de) |
KR (1) | KR20050004110A (de) |
CN (1) | CN100339416C (de) |
DE (1) | DE602004000671T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040138118A1 (en) * | 2002-09-16 | 2004-07-15 | Neil Wolfman | Metalloprotease activation of myostatin, and methods of modulating myostatin activity |
KR101082811B1 (ko) * | 2005-10-25 | 2011-11-11 | 히다치 가세고교 가부시끼가이샤 | 가요성 적층판, 그의 제조 방법, 및 가요성 인쇄 배선판 |
WO2008083258A1 (en) * | 2006-12-29 | 2008-07-10 | Adaptivenergy, Llc. | Polyimide/copolyimide films with low glass transition temperature for use as hot melt adhesives |
US8248755B2 (en) * | 2010-04-30 | 2012-08-21 | General Electric Company | Polyimides and thin films, electronic articles and capacitors comprising these, and methods of making them |
JP2012224697A (ja) * | 2011-04-18 | 2012-11-15 | Sumitomo Electric Wintec Inc | ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ |
CN103762437A (zh) * | 2013-12-31 | 2014-04-30 | 镇江蓝箭电子有限公司 | 一种高性能射频同轴连接器介质支撑的制作方法 |
JP6441732B2 (ja) * | 2014-04-24 | 2018-12-19 | Jfeケミカル株式会社 | ポリアミド酸組成物およびポリイミド組成物 |
CN103980491B (zh) * | 2014-05-23 | 2016-04-06 | 哈尔滨工业大学 | 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法 |
TWI719110B (zh) * | 2016-01-15 | 2021-02-21 | 日商Jx金屬股份有限公司 | 銅箔、覆銅積層板、印刷配線板之製造方法、電子機器之製造方法、傳輸線之製造方法及天線之製造方法 |
JP6789186B2 (ja) * | 2017-07-07 | 2020-11-25 | Jfeケミカル株式会社 | ポリアミド酸、ポリイミド、電子基板、高周波基板およびカバーレイフィルム |
JP6858693B2 (ja) * | 2017-12-12 | 2021-04-14 | Jfeケミカル株式会社 | 高周波基板材料用ポリアミド酸、高周波基板材料用ポリイミド、高周波基板材料用ポリイミドフィルム、高周波基板材料用ポリイミド成形体および高周波基板 |
JP7319950B2 (ja) * | 2020-06-22 | 2023-08-02 | Jfeケミカル株式会社 | ポリアミド酸、ポリイミド、ポリイミドフィルム、電子基板用材料および電子基板 |
CN113913149A (zh) * | 2021-11-18 | 2022-01-11 | 广州联茂电子科技有限公司 | 一种改良聚酰亚胺粘着剂和软性金属箔基板及制备方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3847867A (en) * | 1971-01-20 | 1974-11-12 | Gen Electric | Polyetherimides |
JPS5912420A (ja) * | 1982-07-14 | 1984-01-23 | Hitachi Ltd | 絶縁膜を有する素子 |
DE3506526A1 (de) | 1985-02-25 | 1986-08-28 | Akzo Gmbh, 5600 Wuppertal | Gedrucktes schaltelement mit polyimid enthaltender deckschicht |
US4978742A (en) | 1988-09-30 | 1990-12-18 | Hoechst Celanese Corp. | Polymers prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoro propane |
DE68927376D1 (de) * | 1988-12-27 | 1996-11-28 | Mitsui Toatsu Chemicals | Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung |
JPH04342724A (ja) * | 1991-05-17 | 1992-11-30 | Kanegafuchi Chem Ind Co Ltd | 芳香族ポリイミド重合体及びポリアミック酸重合体 |
DE4135058A1 (de) | 1991-10-24 | 1993-04-29 | Basf Lacke & Farben | Loesungen von polyimidbildenden ausgangsstoffen |
JPH05156159A (ja) | 1991-12-02 | 1993-06-22 | Sekiyu Sangyo Kasseika Center | 樹脂組成物およびその製造方法 |
JPH05179140A (ja) | 1991-12-29 | 1993-07-20 | Sekiyu Sangyo Kasseika Center | ポリマー組成物およびその製造方法 |
US5328979A (en) * | 1992-11-16 | 1994-07-12 | The University Of Akron | Thermoplastic copolyimides and composites therefrom |
JP2914852B2 (ja) * | 1993-08-17 | 1999-07-05 | 信越化学工業株式会社 | 回路保護用膜 |
JP3663603B2 (ja) * | 1994-09-09 | 2005-06-22 | Jsr株式会社 | 液晶配向剤 |
US5917005A (en) * | 1997-07-14 | 1999-06-29 | General Electric Company | Polyetherimides with resistance to high temperatures |
JP2000248253A (ja) * | 1998-12-28 | 2000-09-12 | Mitsui Chemicals Inc | 耐熱性接着剤 |
WO2000046816A1 (fr) * | 1999-02-03 | 2000-08-10 | Tomoegawa Paper Co., Ltd. | Composition de resine thermoplastique dotee d'une faible permittivite, preimpregne, plaque stratifiee et matiere stratifiee pour circuit a base d'une telle composition |
JP2000289165A (ja) * | 1999-04-08 | 2000-10-17 | Kanegafuchi Chem Ind Co Ltd | 耐熱性ボンディングシート |
JP2001151935A (ja) | 1999-11-30 | 2001-06-05 | Otsuka Chem Co Ltd | 回路基板用樹脂組成物 |
JP3482946B2 (ja) * | 2000-06-28 | 2004-01-06 | 日立化成工業株式会社 | 接着フィルム及び半導体装置 |
JP2002363283A (ja) * | 2001-06-06 | 2002-12-18 | Nitto Denko Corp | ポリアミド酸とそれより得られるポリイミド樹脂とそれらの回路基板への利用 |
US6500904B1 (en) * | 2001-11-02 | 2002-12-31 | General Electric Company | High molecular weight poly(imide)s and methods of synthesis thereof |
JP4132825B2 (ja) | 2002-01-10 | 2008-08-13 | 日東電工株式会社 | 金属箔積層体及びその製造方法 |
JP2004359868A (ja) * | 2003-06-05 | 2004-12-24 | Kaneka Corp | 熱可塑ポリイミド性樹脂の製造方法 |
-
2004
- 2004-04-14 JP JP2004118715A patent/JP2005042091A/ja active Pending
- 2004-07-02 US US10/882,304 patent/US7074882B2/en not_active Expired - Fee Related
- 2004-07-02 DE DE602004000671T patent/DE602004000671T2/de not_active Expired - Fee Related
- 2004-07-02 EP EP04015684A patent/EP1494247B1/de not_active Expired - Fee Related
- 2004-07-02 KR KR1020040051570A patent/KR20050004110A/ko not_active Application Discontinuation
- 2004-07-05 CN CNB2004100629467A patent/CN100339416C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1494247A1 (de) | 2005-01-05 |
JP2005042091A (ja) | 2005-02-17 |
EP1494247B1 (de) | 2006-04-19 |
US20050004323A1 (en) | 2005-01-06 |
CN100339416C (zh) | 2007-09-26 |
KR20050004110A (ko) | 2005-01-12 |
DE602004000671T2 (de) | 2006-08-31 |
CN1576294A (zh) | 2005-02-09 |
US7074882B2 (en) | 2006-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602005021338D1 (de) | Elektrische dermabrasionsvorrichtung | |
DE602004031525D1 (de) | Isolierende durchführungsbaugruppe für elektrochemische einrichtungen | |
DE602005016513D1 (de) | Elektrische Drehmaschine | |
DE602004023370D1 (de) | Montagekonstruktion für elektrische fahrzeugeinrichtungen | |
DE602004007110D1 (de) | Modulare elektrische einrichtung | |
DE602005004317D1 (de) | Befestigungseinrichtung für elektrische Steckverbinder und Verwendung derselben | |
DE602005023324D1 (de) | Selbstabmantelungssystem für zwei elektrische leiter | |
DE502005000299D1 (de) | Elektrische Steckvorrichtung | |
ITMI20051723A1 (it) | Struttura elettrica riscaldante | |
DE502005008113D1 (de) | Halterung für eine elektrische komponente | |
DE502005001198D1 (de) | Elektrische Steckverbindung | |
GB0419639D0 (en) | Testing electrical continuity | |
DE602004000671D1 (de) | Polyimidmassen für elektrische Isolation | |
DE502005010450D1 (de) | Elektrische baugruppe | |
DE602004004466D1 (de) | Elektrische Verbindungsvorrichtung | |
DE502006000485D1 (de) | Elektrische Steckverbindung | |
DE502004002876D1 (de) | Fassung für elektrisches Betriebsmittel | |
DE60333050D1 (de) | Elektrische Verbindungseinrichtung | |
DE502006009383D1 (de) | Elektrische Schaltanlage | |
DE602006006383D1 (de) | Elektrische Anschlussbox | |
DE60313822D1 (de) | Steckverbinder für ein elektrisches Gerät | |
NO20050329D0 (no) | Gassisolert elektrisk koblingsutstyr | |
DE602005026749D1 (de) | Störschutz für elektrische Geräte | |
DE60301875D1 (de) | Verbindungseinrichtung für elektrische leitungen | |
DE602005003447D1 (de) | Elektrische Verbindervorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |