JP2002523549A5 - - Google Patents
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- Publication number
- JP2002523549A5 JP2002523549A5 JP2000566357A JP2000566357A JP2002523549A5 JP 2002523549 A5 JP2002523549 A5 JP 2002523549A5 JP 2000566357 A JP2000566357 A JP 2000566357A JP 2000566357 A JP2000566357 A JP 2000566357A JP 2002523549 A5 JP2002523549 A5 JP 2002523549A5
- Authority
- JP
- Japan
- Prior art keywords
- hydrolyzed
- mixture
- silane
- composition
- partially hydrolyzed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 description 18
- 229910000077 silane Inorganic materials 0.000 description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229920000412 polyarylene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229920000265 Polyparaphenylene Polymers 0.000 description 3
- -1 Polyphenylene Polymers 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- JEOAUTNZTUGROC-UHFFFAOYSA-N 3-[4-[4-(3-oxo-2,4,5-triphenylcyclopenta-1,4-dien-1-yl)phenoxy]phenyl]-2,4,5-triphenylcyclopenta-2,4-dien-1-one Chemical compound O=C1C(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)C(C=2C=CC(OC=3C=CC(=CC=3)C=3C(=C(C(=O)C=3C=3C=CC=CC=3)C=3C=CC=CC=3)C=3C=CC=CC=3)=CC=2)=C1C1=CC=CC=C1 JEOAUTNZTUGROC-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YUOGUVUAZGQYFR-UHFFFAOYSA-N 1,3,5-tris(2-phenylethynyl)benzene Chemical compound C1=CC=CC=C1C#CC1=CC(C#CC=2C=CC=CC=2)=CC(C#CC=2C=CC=CC=2)=C1 YUOGUVUAZGQYFR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/138,510 | 1998-08-24 | ||
| US09/138,510 US6184284B1 (en) | 1998-08-24 | 1998-08-24 | Adhesion promoter and self-priming resin compositions and articles made therefrom |
| PCT/US1999/019242 WO2000011096A1 (en) | 1998-08-24 | 1999-08-23 | Adhesion promoter and self-priming resin compositions and articles made therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002523549A JP2002523549A (ja) | 2002-07-30 |
| JP2002523549A5 true JP2002523549A5 (enExample) | 2007-03-08 |
| JP4343443B2 JP4343443B2 (ja) | 2009-10-14 |
Family
ID=22482345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000566357A Expired - Lifetime JP4343443B2 (ja) | 1998-08-24 | 1999-08-23 | 接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6184284B1 (enExample) |
| EP (1) | EP1112329B2 (enExample) |
| JP (1) | JP4343443B2 (enExample) |
| KR (1) | KR100604629B1 (enExample) |
| CN (1) | CN1210362C (enExample) |
| DE (1) | DE69918316T3 (enExample) |
| TW (1) | TWI234577B (enExample) |
| WO (1) | WO2000011096A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002534546A (ja) | 1999-01-08 | 2002-10-15 | ザ ダウ ケミカル カンパニー | 良好な接着性および靭性を有する低誘電率ポリマーおよび該ポリマーから作製された物品 |
| US7115531B2 (en) | 2000-08-21 | 2006-10-03 | Dow Global Technologies Inc. | Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices |
| US6710450B2 (en) * | 2001-02-28 | 2004-03-23 | International Business Machines Corporation | Interconnect structure with precise conductor resistance and method to form same |
| JP5320653B2 (ja) | 2001-03-26 | 2013-10-23 | Ｊｓｒ株式会社 | 膜形成用組成物および絶縁膜形成用材料 |
| AU2002305835A1 (en) * | 2001-06-08 | 2002-12-23 | The Regents Of The University Of Michigan | Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication |
| CN1630744A (zh) * | 2001-09-07 | 2005-06-22 | 博登化学公司 | 使用粘合促进剂的涂覆光纤及其制备和使用方法 |
| US6806182B2 (en) * | 2002-05-01 | 2004-10-19 | International Business Machines Corporation | Method for eliminating via resistance shift in organic ILD |
| TW200426191A (en) * | 2003-03-27 | 2004-12-01 | Sumitomo Chemical Co | Coating liquid for forming insulating film and method for producing insulating film |
| TW200505966A (en) | 2003-04-02 | 2005-02-16 | Dow Global Technologies Inc | Organosilicate resin formulation for use in microelectronic devices |
| US7164197B2 (en) * | 2003-06-19 | 2007-01-16 | 3M Innovative Properties Company | Dielectric composite material |
| US20050100712A1 (en) * | 2003-11-12 | 2005-05-12 | Simmons Blake A. | Polymerization welding and application to microfluidics |
| US8790632B2 (en) * | 2004-10-07 | 2014-07-29 | Actamax Surgical Materials, Llc | Polymer-based tissue-adhesive form medical use |
| JP2006104375A (ja) * | 2004-10-07 | 2006-04-20 | Sumitomo Chemical Co Ltd | 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜 |
| US20060275616A1 (en) * | 2005-06-03 | 2006-12-07 | Clough Robert S | Silane-based coupling agent |
| US20070004844A1 (en) * | 2005-06-30 | 2007-01-04 | Clough Robert S | Dielectric material |
| US8679536B2 (en) * | 2005-08-24 | 2014-03-25 | Actamax Surgical Materials, Llc | Aldol-crosslinked polymeric hydrogel adhesives |
| US8679537B2 (en) * | 2005-08-24 | 2014-03-25 | Actamaz Surgical Materials, LLC | Methods for sealing an orifice in tissue using an aldol-crosslinked polymeric hydrogel adhesive |
| US7390377B1 (en) | 2005-09-22 | 2008-06-24 | Sandia Corporation | Bonding thermoplastic polymers |
| CN101616750B (zh) * | 2007-05-01 | 2012-07-25 | 贝克株式会社 | 涂装方法 |
| CA2733682C (en) * | 2008-08-12 | 2014-10-14 | Air Products And Chemicals, Inc. | Polymeric compositions comprising per(phenylethynyl) arene derivatives |
| GB2480451A (en) * | 2010-05-18 | 2011-11-23 | E2V Tech | Electron tube rf output window |
| US9006353B2 (en) | 2011-11-18 | 2015-04-14 | Delsper LP | Crosslinking compounds for high glass transition temperature polymers |
| KR20140023856A (ko) * | 2012-08-16 | 2014-02-27 | 동우 화인켐 주식회사 | 아크릴계 점착제 조성물 |
| KR102197418B1 (ko) | 2012-10-22 | 2020-12-31 | 델스퍼 엘피 | 가교된 유기 중합체 조성물 |
| US9273215B2 (en) | 2012-10-30 | 2016-03-01 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
| JP6272908B2 (ja) | 2013-01-28 | 2018-01-31 | デルスパー リミテッド パートナーシップ | シーリングおよび耐摩耗性構成部材のための抗押出性組成物 |
| CA2906858C (en) | 2013-03-15 | 2021-09-21 | Delsper LP | Cross-linked organic polymers for use as elastomers |
| CN103755964B (zh) * | 2013-12-27 | 2016-03-30 | 深圳市安品有机硅材料有限公司 | 聚硅氧烷增粘树脂及其制备方法 |
| US9153357B1 (en) * | 2014-03-27 | 2015-10-06 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
| KR101623771B1 (ko) * | 2014-10-16 | 2016-05-25 | 도레이첨단소재 주식회사 | 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름 |
| US9481810B2 (en) | 2014-12-15 | 2016-11-01 | Rohm And Haas Electronic Materials Llc | Silylated polyarylenes |
| US9752051B2 (en) * | 2015-04-06 | 2017-09-05 | Rohm And Haas Electronic Materials Llc | Polyarylene polymers |
| US10790146B2 (en) * | 2016-12-05 | 2020-09-29 | Rohm And Haas Electronic Materials Llc | Aromatic resins for underlayers |
| BR112022022724A2 (pt) | 2020-06-05 | 2023-02-14 | Dow Global Technologies Llc | Composição, método para a produção da composição, composição adesiva, método para produzir um laminado, e, laminado |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL301721A (enExample) | 1962-12-21 | 1900-01-01 | ||
| US3922299A (en) | 1974-03-05 | 1975-11-25 | Univ Delaware | Vinylic substitution reactions |
| US4642329A (en) | 1984-08-27 | 1987-02-10 | The Dow Chemical Company | Prepolymer processing of arylcyclobutene monomeric compositions |
| US4826997A (en) | 1984-08-27 | 1989-05-02 | The Dow Chemical Company | N-Substituted arylcyclo butenyl-maleimides |
| US4999449A (en) | 1984-08-27 | 1991-03-12 | The Dow Chemical Company | Novel poly(arylcyclobutenes) |
| US4724260A (en) | 1984-08-27 | 1988-02-09 | The Dow Chemical Company | Unsaturated alkyl monoarylcyclobutane monomers |
| US4540763A (en) | 1984-09-14 | 1985-09-10 | The Dow Chemical Company | Polymers derived from poly(arylcyclobutenes) |
| DE3578980D1 (de) | 1984-11-07 | 1990-09-06 | Gen Electric | Silanderivate zur verbesserung der eigenschaften von polyphenylenoxid-polyamidzusammensetzungen. |
| US4783514A (en) | 1986-02-28 | 1988-11-08 | The Dow Chemical Company | Polymeric monoarylcyclobutane compositions |
| US4687823A (en) | 1986-07-01 | 1987-08-18 | The Dow Chemical Company | Alkynyl-bridged poly(arylcyclobutene) resins |
| US4730030A (en) | 1986-07-25 | 1988-03-08 | The Dow Chemical Company | Arylcyclobutane/dienophile copolymer |
| US4732858A (en) | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| US4950583A (en) | 1986-09-17 | 1990-08-21 | Brewer Science Inc. | Adhesion promoting product and process for treating an integrated circuit substrate therewith |
| JPH0749516B2 (ja) | 1987-01-28 | 1995-05-31 | 東レ・ダウコーニング・シリコーン株式会社 | ポリフエニレンオキサイド樹脂組成物 |
| US4759874A (en) | 1987-08-03 | 1988-07-26 | The Dow Chemical Company | Benzocyclobutene-based die attach adhesive compositions |
| US4812588A (en) | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
| US4831172A (en) | 1988-03-23 | 1989-05-16 | The Dow Chemical Company | Benzocyclobutene-based organosilane adhesion aids |
| US5002808A (en) | 1988-03-23 | 1991-03-26 | The Dow Chemical Company | Adhesion methods employing benzocyclobutene-based organosilane adhesion aids |
| JP2594142B2 (ja) | 1988-11-30 | 1997-03-26 | 東芝シリコーン株式会社 | 電子部品の製造方法 |
| US4973636A (en) | 1989-05-30 | 1990-11-27 | Shell Oil Company | Bisbenzocyclobutene/bisimide compositions |
| US5246782A (en) | 1990-12-10 | 1993-09-21 | The Dow Chemical Company | Laminates of polymers having perfluorocyclobutane rings and polymers containing perfluorocyclobutane rings |
| US5025080A (en) | 1990-03-30 | 1991-06-18 | Shell Oil Company | Resin composition from di(arylcyclobutenealkyl) ether of di(hydroxyphenyl) oligomer |
| EP0457351A3 (en) | 1990-05-17 | 1993-03-10 | Mitsubishi Petrochemical Co., Ltd. | Process for producing silane-modified polyphenylene ether and thermoplastic resin composition containing the same |
| US5185391A (en) | 1991-11-27 | 1993-02-09 | The Dow Chemical Company | Oxidation inhibited arylcyclobutene polymers |
| CA2125567A1 (en) | 1991-12-10 | 1993-06-24 | Frank L. Oaks | Photocurable cyclobutarene compositions |
| JP2965277B2 (ja) † | 1992-07-24 | 1999-10-18 | 松下電工株式会社 | ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板 |
| US5416233A (en) | 1994-01-25 | 1995-05-16 | The Dow Chemical Company | Preparation of vinylsilane-benzocyclobutenes |
| US5668210A (en) | 1994-10-24 | 1997-09-16 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
| DE59610089D1 (de) | 1995-11-02 | 2003-03-06 | Ciba Sc Holding Ag | Härtbare Zusammensetzung enthaltend Cycloolefin, Silan und Füllstoff |
| US5965679A (en) | 1996-09-10 | 1999-10-12 | The Dow Chemical Company | Polyphenylene oligomers and polymers |
| JP3858426B2 (ja) | 1998-02-02 | 2006-12-13 | Ｊｓｒ株式会社 | ポリマー組成物 |
-
1998
- 1998-08-24 US US09/138,510 patent/US6184284B1/en not_active Expired - Lifetime
-
1999
- 1999-08-23 WO PCT/US1999/019242 patent/WO2000011096A1/en not_active Ceased
- 1999-08-23 KR KR1020017002305A patent/KR100604629B1/ko not_active Expired - Lifetime
- 1999-08-23 EP EP99943863A patent/EP1112329B2/en not_active Expired - Lifetime
- 1999-08-23 CN CNB998100188A patent/CN1210362C/zh not_active Expired - Lifetime
- 1999-08-23 DE DE69918316T patent/DE69918316T3/de not_active Expired - Lifetime
- 1999-08-23 JP JP2000566357A patent/JP4343443B2/ja not_active Expired - Lifetime
- 1999-08-24 TW TW088114471A patent/TWI234577B/zh not_active IP Right Cessation
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