JP2002523549A5 - - Google Patents

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Publication number
JP2002523549A5
JP2002523549A5 JP2000566357A JP2000566357A JP2002523549A5 JP 2002523549 A5 JP2002523549 A5 JP 2002523549A5 JP 2000566357 A JP2000566357 A JP 2000566357A JP 2000566357 A JP2000566357 A JP 2000566357A JP 2002523549 A5 JP2002523549 A5 JP 2002523549A5
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JP
Japan
Prior art keywords
hydrolyzed
mixture
silane
composition
partially hydrolyzed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000566357A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002523549A (ja
JP4343443B2 (ja
Filing date
Publication date
Priority claimed from US09/138,510 external-priority patent/US6184284B1/en
Application filed filed Critical
Publication of JP2002523549A publication Critical patent/JP2002523549A/ja
Publication of JP2002523549A5 publication Critical patent/JP2002523549A5/ja
Application granted granted Critical
Publication of JP4343443B2 publication Critical patent/JP4343443B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000566357A 1998-08-24 1999-08-23 接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品 Expired - Lifetime JP4343443B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/138,510 US6184284B1 (en) 1998-08-24 1998-08-24 Adhesion promoter and self-priming resin compositions and articles made therefrom
US09/138,510 1998-08-24
PCT/US1999/019242 WO2000011096A1 (en) 1998-08-24 1999-08-23 Adhesion promoter and self-priming resin compositions and articles made therefrom

Publications (3)

Publication Number Publication Date
JP2002523549A JP2002523549A (ja) 2002-07-30
JP2002523549A5 true JP2002523549A5 (enExample) 2007-03-08
JP4343443B2 JP4343443B2 (ja) 2009-10-14

Family

ID=22482345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000566357A Expired - Lifetime JP4343443B2 (ja) 1998-08-24 1999-08-23 接着促進剤および自己下塗り性樹脂組成物およびそれらから作製される物品

Country Status (8)

Country Link
US (1) US6184284B1 (enExample)
EP (1) EP1112329B2 (enExample)
JP (1) JP4343443B2 (enExample)
KR (1) KR100604629B1 (enExample)
CN (1) CN1210362C (enExample)
DE (1) DE69918316T3 (enExample)
TW (1) TWI234577B (enExample)
WO (1) WO2000011096A1 (enExample)

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US6942750B2 (en) * 2001-06-08 2005-09-13 The Regents Of The University Of Michigan Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
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US6806182B2 (en) * 2002-05-01 2004-10-19 International Business Machines Corporation Method for eliminating via resistance shift in organic ILD
TW200426191A (en) * 2003-03-27 2004-12-01 Sumitomo Chemical Co Coating liquid for forming insulating film and method for producing insulating film
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
US20050100712A1 (en) * 2003-11-12 2005-05-12 Simmons Blake A. Polymerization welding and application to microfluidics
JP2006104375A (ja) * 2004-10-07 2006-04-20 Sumitomo Chemical Co Ltd 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜
US8790632B2 (en) * 2004-10-07 2014-07-29 Actamax Surgical Materials, Llc Polymer-based tissue-adhesive form medical use
US20060275616A1 (en) * 2005-06-03 2006-12-07 Clough Robert S Silane-based coupling agent
US20070004844A1 (en) * 2005-06-30 2007-01-04 Clough Robert S Dielectric material
US8679536B2 (en) * 2005-08-24 2014-03-25 Actamax Surgical Materials, Llc Aldol-crosslinked polymeric hydrogel adhesives
US8679537B2 (en) * 2005-08-24 2014-03-25 Actamaz Surgical Materials, LLC Methods for sealing an orifice in tissue using an aldol-crosslinked polymeric hydrogel adhesive
US7390377B1 (en) 2005-09-22 2008-06-24 Sandia Corporation Bonding thermoplastic polymers
CN101616750B (zh) * 2007-05-01 2012-07-25 贝克株式会社 涂装方法
EP2313465B1 (en) 2008-08-12 2015-07-15 Delsper LP Polymeric compositions comprising per(phenylethynyl) arene derivatives
GB2480451A (en) * 2010-05-18 2011-11-23 E2V Tech Electron tube rf output window
JP5918385B2 (ja) 2011-11-18 2016-05-18 デルスパー リミティド パートナーシップ 高ガラス転移点ポリマーのための架橋化合物
KR20140023856A (ko) * 2012-08-16 2014-02-27 동우 화인켐 주식회사 아크릴계 점착제 조성물
EP2909253B1 (en) 2012-10-22 2021-11-10 Delsper LP Cross-linked organic polymer compositions
US9273215B2 (en) * 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
WO2014117110A1 (en) 2013-01-28 2014-07-31 Greene, Tweed Technologies, Inc. Anti-extrusion compositions for sealing and wear components
US9109075B2 (en) 2013-03-15 2015-08-18 Delsper LP Cross-linked organic polymers for use as elastomers in high temperature applications
CN103755964B (zh) * 2013-12-27 2016-03-30 深圳市安品有机硅材料有限公司 聚硅氧烷增粘树脂及其制备方法
US9153357B1 (en) * 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
KR101623771B1 (ko) * 2014-10-16 2016-05-25 도레이첨단소재 주식회사 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름
US9481810B2 (en) 2014-12-15 2016-11-01 Rohm And Haas Electronic Materials Llc Silylated polyarylenes
US9752051B2 (en) 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
US10790146B2 (en) * 2016-12-05 2020-09-29 Rohm And Haas Electronic Materials Llc Aromatic resins for underlayers
CN115515783B (zh) 2020-06-05 2025-12-23 阿科玛法国公司 环氧磷酸酯

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