JP2009537684A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009537684A5 JP2009537684A5 JP2009511480A JP2009511480A JP2009537684A5 JP 2009537684 A5 JP2009537684 A5 JP 2009537684A5 JP 2009511480 A JP2009511480 A JP 2009511480A JP 2009511480 A JP2009511480 A JP 2009511480A JP 2009537684 A5 JP2009537684 A5 JP 2009537684A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- substituted
- oxygen
- aromatic
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003118 aryl group Chemical group 0.000 claims 19
- 229910052760 oxygen Inorganic materials 0.000 claims 19
- 239000001301 oxygen Substances 0.000 claims 19
- 239000000203 mixture Substances 0.000 claims 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 14
- 125000000217 alkyl group Chemical group 0.000 claims 10
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- 150000001767 cationic compounds Chemical class 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 8
- 239000003822 epoxy resin Substances 0.000 claims 8
- 229910052739 hydrogen Inorganic materials 0.000 claims 8
- 239000001257 hydrogen Substances 0.000 claims 8
- 229920000647 polyepoxide Polymers 0.000 claims 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 6
- 125000004429 atom Chemical group 0.000 claims 6
- 125000003545 alkoxy group Chemical group 0.000 claims 5
- 125000001072 heteroaryl group Chemical group 0.000 claims 5
- 239000004593 Epoxy Substances 0.000 claims 4
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 claims 4
- 239000000376 reactant Substances 0.000 claims 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 239000007848 Bronsted acid Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 125000004122 cyclic group Chemical group 0.000 claims 3
- 229910052736 halogen Inorganic materials 0.000 claims 3
- 150000002367 halogens Chemical class 0.000 claims 3
- 239000000565 sealant Substances 0.000 claims 3
- -1 Alkylating agents Chemical class 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 150000002431 hydrogen Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 229910052757 nitrogen Chemical group 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 150000002829 nitrogen Chemical group 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000012255 powdered metal Substances 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- 239000011593 sulfur Substances 0.000 claims 2
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 claims 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims 2
- MIOPJNTWMNEORI-GMSGAONNSA-N (S)-camphorsulfonic acid Chemical compound C1C[C@@]2(CS(O)(=O)=O)C(=O)C[C@@H]1C2(C)C MIOPJNTWMNEORI-GMSGAONNSA-N 0.000 claims 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims 1
- 239000002841 Lewis acid Substances 0.000 claims 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 1
- 229910018286 SbF 6 Inorganic materials 0.000 claims 1
- 125000005907 alkyl ester group Chemical group 0.000 claims 1
- 150000001350 alkyl halides Chemical class 0.000 claims 1
- 229940100198 alkylating agent Drugs 0.000 claims 1
- 239000002168 alkylating agent Substances 0.000 claims 1
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 150000001491 aromatic compounds Chemical class 0.000 claims 1
- 125000002102 aryl alkyloxo group Chemical group 0.000 claims 1
- 125000004104 aryloxy group Chemical group 0.000 claims 1
- AGEZXYOZHKGVCM-UHFFFAOYSA-N benzyl bromide Chemical compound BrCC1=CC=CC=C1 AGEZXYOZHKGVCM-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 claims 1
- 150000007517 lewis acids Chemical class 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910001507 metal halide Inorganic materials 0.000 claims 1
- 150000005309 metal halides Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000012766 organic filler Substances 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 150000004714 phosphonium salts Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 150000004760 silicates Chemical class 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims 1
- FTVLMFQEYACZNP-UHFFFAOYSA-N trimethylsilyl trifluoromethanesulfonate Chemical compound C[Si](C)(C)OS(=O)(=O)C(F)(F)F FTVLMFQEYACZNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
- 0 C*c1c(*)c(*)c(*)c(*OC2(*3)[In])c1*C(C(*)C1*)=C2C3=C1I Chemical compound C*c1c(*)c(*)c(*)c(*OC2(*3)[In])c1*C(C(*)C1*)=C2C3=C1I 0.000 description 2
- WBZPTMNDVFVYBX-UHFFFAOYSA-N C1OCc(cccc2)c2-c2c1cccc2 Chemical compound C1OCc(cccc2)c2-c2c1cccc2 WBZPTMNDVFVYBX-UHFFFAOYSA-N 0.000 description 1
- ZHIKKBIRFHTHQH-UHFFFAOYSA-N CC(c(cccc1)c1-c1c2cccc1)OC2=O Chemical compound CC(c(cccc1)c1-c1c2cccc1)OC2=O ZHIKKBIRFHTHQH-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06010525.1 | 2006-05-22 | ||
| EP06010525 | 2006-05-22 | ||
| PCT/EP2007/054827 WO2007135094A1 (en) | 2006-05-22 | 2007-05-18 | Low shrinkage epoxy-cationic curable compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009537684A JP2009537684A (ja) | 2009-10-29 |
| JP2009537684A5 true JP2009537684A5 (enExample) | 2011-07-07 |
| JP5190055B2 JP5190055B2 (ja) | 2013-04-24 |
Family
ID=38190610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009511480A Expired - Fee Related JP5190055B2 (ja) | 2006-05-22 | 2007-05-18 | 低収縮性エポキシ−カチオン硬化性組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7740734B2 (enExample) |
| EP (1) | EP2021394B1 (enExample) |
| JP (1) | JP5190055B2 (enExample) |
| KR (1) | KR20090015067A (enExample) |
| CN (1) | CN101448868B (enExample) |
| AT (1) | ATE482986T1 (enExample) |
| DE (1) | DE602007009519D1 (enExample) |
| WO (1) | WO2007135094A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6147103B2 (ja) * | 2013-06-07 | 2017-06-14 | 日東電工株式会社 | アンダーフィル材、積層シート及び半導体装置の製造方法 |
| CN105977368B (zh) * | 2016-04-29 | 2018-06-05 | 广东鼎立森新材料有限公司 | 一种发光装置的环氧硅氧烷树脂密封料及其制备方法 |
| DE102019129517A1 (de) | 2019-10-31 | 2021-05-06 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch feuchteinduziert härtbare Masse, Verwendung der Masse sowie Verfahren zum Fügen, Vergießen und Beschichten von Substraten |
| JP2023065001A (ja) * | 2021-10-27 | 2023-05-12 | 旭化成株式会社 | エポキシ系樹脂の収縮抑制剤及びその使用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59149924A (ja) | 1982-09-28 | 1984-08-28 | Toshiba Corp | 低収縮性熱硬化性樹脂組成物 |
| JPS59199712A (ja) | 1983-04-27 | 1984-11-12 | Mitsui Toatsu Chem Inc | 硬化性樹脂組成物 |
| US4701513A (en) * | 1986-12-15 | 1987-10-20 | W. R. Grace & Co. | Novel epoxy hardeners |
| EP0436025A4 (en) * | 1988-09-20 | 1991-09-11 | Hisamitsu Pharmaceutical Co. Inc. | Novel dibenz b,e)oxepin derivatives |
| DE4439485C2 (de) * | 1994-10-26 | 1998-04-09 | Ivoclar Ag | Bicycloaliphatische 2-Methylen-1,3-dioxepane und deren Verwendung |
| JPH09194565A (ja) * | 1996-01-24 | 1997-07-29 | Sumitomo Bakelite Co Ltd | 環状カーボナート樹脂組成物及びその硬化物 |
| JP4350832B2 (ja) * | 1999-04-19 | 2009-10-21 | Ｊｓｒ株式会社 | 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物 |
| JP4662094B2 (ja) * | 2000-10-25 | 2011-03-30 | 日立化成工業株式会社 | スピロケタール化合物、アルキンジオール化合物及びこのアルキンジオール化合物を用いたスピロケタール化合物の製造法 |
| JP2002322268A (ja) * | 2001-04-27 | 2002-11-08 | Toagosei Co Ltd | 多官能オキセタン化合物と環状カルボン酸無水物からなるオキセタン樹脂の製造方法 |
| KR100502993B1 (ko) * | 2002-03-08 | 2005-07-25 | 주식회사 루밴틱스 | 광통신부품용 광학접착제 |
| JP4820629B2 (ja) * | 2004-11-25 | 2011-11-24 | 株式会社トクヤマ | 硬化性組成物 |
| DE602006001396D1 (de) * | 2005-02-18 | 2008-07-17 | Henkel Kgaa | Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung |
-
2007
- 2007-05-18 JP JP2009511480A patent/JP5190055B2/ja not_active Expired - Fee Related
- 2007-05-18 EP EP07729272A patent/EP2021394B1/en not_active Not-in-force
- 2007-05-18 CN CN200780018782XA patent/CN101448868B/zh not_active Expired - Fee Related
- 2007-05-18 KR KR1020087028242A patent/KR20090015067A/ko not_active Abandoned
- 2007-05-18 DE DE602007009519T patent/DE602007009519D1/de active Active
- 2007-05-18 WO PCT/EP2007/054827 patent/WO2007135094A1/en not_active Ceased
- 2007-05-18 AT AT07729272T patent/ATE482986T1/de not_active IP Right Cessation
-
2008
- 2008-11-21 US US12/275,772 patent/US7740734B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI746849B (zh) | 樹脂組成物 | |
| JP4632069B2 (ja) | 硬化性フルオロポリエーテル系コーティング剤組成物 | |
| JP2010504386A5 (enExample) | ||
| JP2002523549A5 (enExample) | ||
| JPH05320514A (ja) | 硬化性シリコーン組成物 | |
| JP4138001B2 (ja) | 電気工学または電子工学部品の注型材料としてのシリコーン変性エポキシ樹脂の使用 | |
| JPH09503013A (ja) | 水性ポリシロキサン／ポリシリケート系バインダー | |
| KR102504140B1 (ko) | 밀봉용 액상 에폭시 수지 조성물 및 전자 부품 장치 | |
| JP2009537684A5 (enExample) | ||
| CN103881022A (zh) | 用于封装的组合物和包括该组合物的封装的设备 | |
| JP5939723B2 (ja) | ポリカルボシラン、およびポリカルボシランを含んでなるｌｅｄ向け封入剤用硬化性組成物 | |
| CN105408995A (zh) | 控制晶片在压塑成型时翘曲的方法及使用该方法的制品 | |
| CN101743233A (zh) | 含苯并*嗪的物质组合物和用其制备的可固化组合物 | |
| JP2008512546A (ja) | 無水物官能性シルセスキオキサン樹脂 | |
| KR102024067B1 (ko) | 목질 바닥재 부착용 친환경 물유리계 접착제 및 이의 제조방법 | |
| JPWO2014133103A1 (ja) | 硬化性組成物、硬化物、硬化性組成物の使用方法、並びに、光素子封止体及びその製造方法 | |
| EP1789495B1 (en) | Room-temperature curable organopolysiloxane composition and electrical or electronic devices | |
| KR20160047006A (ko) | 고강도 가열형 에폭시 아스팔트 혼합물 및 시공방법 | |
| WO2015041339A1 (ja) | 硬化性組成物、硬化物および硬化性組成物の使用方法 | |
| JP2010504382A5 (enExample) | ||
| JP2017122216A (ja) | 硬化性組成物、硬化物、硬化性組成物の使用方法、及び光デバイス | |
| KR101829213B1 (ko) | 온도감지기 충진용 수지 조성물 | |
| US7863399B2 (en) | Curing silicone composition and cured product thereof | |
| KR20240004810A (ko) | 단일 성분 방수 조성물 및 이의 용도 | |
| JP5190055B2 (ja) | 低収縮性エポキシ−カチオン硬化性組成物 |