CN101448868B - 低收缩环氧阳离子可固化组合物 - Google Patents

低收缩环氧阳离子可固化组合物 Download PDF

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Publication number
CN101448868B
CN101448868B CN200780018782XA CN200780018782A CN101448868B CN 101448868 B CN101448868 B CN 101448868B CN 200780018782X A CN200780018782X A CN 200780018782XA CN 200780018782 A CN200780018782 A CN 200780018782A CN 101448868 B CN101448868 B CN 101448868B
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China
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substituted
composition
aromatic
carbon atoms
oxygen
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Expired - Fee Related
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CN200780018782XA
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Chinese (zh)
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CN101448868A (zh
Inventor
须藤淳
远藤健
铃木茜
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Henkel Jsc
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Henkel Jsc
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing Of Solid Wastes (AREA)
CN200780018782XA 2006-05-22 2007-05-18 低收缩环氧阳离子可固化组合物 Expired - Fee Related CN101448868B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06010525.1 2006-05-22
EP06010525 2006-05-22
PCT/EP2007/054827 WO2007135094A1 (en) 2006-05-22 2007-05-18 Low shrinkage epoxy-cationic curable compositions

Publications (2)

Publication Number Publication Date
CN101448868A CN101448868A (zh) 2009-06-03
CN101448868B true CN101448868B (zh) 2011-08-31

Family

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CN200780018782XA Expired - Fee Related CN101448868B (zh) 2006-05-22 2007-05-18 低收缩环氧阳离子可固化组合物

Country Status (8)

Country Link
US (1) US7740734B2 (enExample)
EP (1) EP2021394B1 (enExample)
JP (1) JP5190055B2 (enExample)
KR (1) KR20090015067A (enExample)
CN (1) CN101448868B (enExample)
AT (1) ATE482986T1 (enExample)
DE (1) DE602007009519D1 (enExample)
WO (1) WO2007135094A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6147103B2 (ja) * 2013-06-07 2017-06-14 日東電工株式会社 アンダーフィル材、積層シート及び半導体装置の製造方法
CN105977368B (zh) * 2016-04-29 2018-06-05 广东鼎立森新材料有限公司 一种发光装置的环氧硅氧烷树脂密封料及其制备方法
DE102019129517A1 (de) 2019-10-31 2021-05-06 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch feuchteinduziert härtbare Masse, Verwendung der Masse sowie Verfahren zum Fügen, Vergießen und Beschichten von Substraten
JP2023065001A (ja) * 2021-10-27 2023-05-12 旭化成株式会社 エポキシ系樹脂の収縮抑制剤及びその使用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701513A (en) * 1986-12-15 1987-10-20 W. R. Grace & Co. Novel epoxy hardeners
EP0436025A1 (en) * 1988-09-20 1991-07-10 Hisamitsu Pharmaceutical Co., Inc. NOVEL DIBENZ b,e]OXEPIN DERIVATIVES

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149924A (ja) 1982-09-28 1984-08-28 Toshiba Corp 低収縮性熱硬化性樹脂組成物
JPS59199712A (ja) 1983-04-27 1984-11-12 Mitsui Toatsu Chem Inc 硬化性樹脂組成物
DE4439485C2 (de) * 1994-10-26 1998-04-09 Ivoclar Ag Bicycloaliphatische 2-Methylen-1,3-dioxepane und deren Verwendung
JPH09194565A (ja) * 1996-01-24 1997-07-29 Sumitomo Bakelite Co Ltd 環状カーボナート樹脂組成物及びその硬化物
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Jsr株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
JP4662094B2 (ja) * 2000-10-25 2011-03-30 日立化成工業株式会社 スピロケタール化合物、アルキンジオール化合物及びこのアルキンジオール化合物を用いたスピロケタール化合物の製造法
JP2002322268A (ja) * 2001-04-27 2002-11-08 Toagosei Co Ltd 多官能オキセタン化合物と環状カルボン酸無水物からなるオキセタン樹脂の製造方法
KR100502993B1 (ko) * 2002-03-08 2005-07-25 주식회사 루밴틱스 광통신부품용 광학접착제
JP4820629B2 (ja) * 2004-11-25 2011-11-24 株式会社トクヤマ 硬化性組成物
DE602006001396D1 (de) * 2005-02-18 2008-07-17 Henkel Kgaa Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701513A (en) * 1986-12-15 1987-10-20 W. R. Grace & Co. Novel epoxy hardeners
EP0436025A1 (en) * 1988-09-20 1991-07-10 Hisamitsu Pharmaceutical Co., Inc. NOVEL DIBENZ b,e]OXEPIN DERIVATIVES

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2002-128785A 2002.05.09
NOBUKATSU N ET AL.Cationic Ring-Opening Polymerization of Monothiocarbonate with a Norbornene Group.《JOURNAL OF POLYMER SCIENCE,POLYMER CHEMISTRY EDITION》.2002,第40卷(第11期),1698-1705. *

Also Published As

Publication number Publication date
EP2021394B1 (en) 2010-09-29
JP2009537684A (ja) 2009-10-29
ATE482986T1 (de) 2010-10-15
US7740734B2 (en) 2010-06-22
DE602007009519D1 (de) 2010-11-11
EP2021394A1 (en) 2009-02-11
WO2007135094A1 (en) 2007-11-29
JP5190055B2 (ja) 2013-04-24
KR20090015067A (ko) 2009-02-11
CN101448868A (zh) 2009-06-03
US20090087571A1 (en) 2009-04-02

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Granted publication date: 20110831

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