JP5190055B2 - 低収縮性エポキシ−カチオン硬化性組成物 - Google Patents

低収縮性エポキシ−カチオン硬化性組成物 Download PDF

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Publication number
JP5190055B2
JP5190055B2 JP2009511480A JP2009511480A JP5190055B2 JP 5190055 B2 JP5190055 B2 JP 5190055B2 JP 2009511480 A JP2009511480 A JP 2009511480A JP 2009511480 A JP2009511480 A JP 2009511480A JP 5190055 B2 JP5190055 B2 JP 5190055B2
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Japan
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group
substituted
oxygen
aromatic
carbon atoms
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JP2009511480A
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Japanese (ja)
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JP2009537684A (ja
JP2009537684A5 (enExample
Inventor
篤 須藤
剛 遠藤
茜 鈴木
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing Of Solid Wastes (AREA)
JP2009511480A 2006-05-22 2007-05-18 低収縮性エポキシ−カチオン硬化性組成物 Expired - Fee Related JP5190055B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06010525.1 2006-05-22
EP06010525 2006-05-22
PCT/EP2007/054827 WO2007135094A1 (en) 2006-05-22 2007-05-18 Low shrinkage epoxy-cationic curable compositions

Publications (3)

Publication Number Publication Date
JP2009537684A JP2009537684A (ja) 2009-10-29
JP2009537684A5 JP2009537684A5 (enExample) 2011-07-07
JP5190055B2 true JP5190055B2 (ja) 2013-04-24

Family

ID=38190610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009511480A Expired - Fee Related JP5190055B2 (ja) 2006-05-22 2007-05-18 低収縮性エポキシ−カチオン硬化性組成物

Country Status (8)

Country Link
US (1) US7740734B2 (enExample)
EP (1) EP2021394B1 (enExample)
JP (1) JP5190055B2 (enExample)
KR (1) KR20090015067A (enExample)
CN (1) CN101448868B (enExample)
AT (1) ATE482986T1 (enExample)
DE (1) DE602007009519D1 (enExample)
WO (1) WO2007135094A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6147103B2 (ja) * 2013-06-07 2017-06-14 日東電工株式会社 アンダーフィル材、積層シート及び半導体装置の製造方法
CN105977368B (zh) * 2016-04-29 2018-06-05 广东鼎立森新材料有限公司 一种发光装置的环氧硅氧烷树脂密封料及其制备方法
DE102019129517A1 (de) 2019-10-31 2021-05-06 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch feuchteinduziert härtbare Masse, Verwendung der Masse sowie Verfahren zum Fügen, Vergießen und Beschichten von Substraten
JP2023065001A (ja) * 2021-10-27 2023-05-12 旭化成株式会社 エポキシ系樹脂の収縮抑制剤及びその使用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149924A (ja) 1982-09-28 1984-08-28 Toshiba Corp 低収縮性熱硬化性樹脂組成物
JPS59199712A (ja) 1983-04-27 1984-11-12 Mitsui Toatsu Chem Inc 硬化性樹脂組成物
US4701513A (en) * 1986-12-15 1987-10-20 W. R. Grace & Co. Novel epoxy hardeners
EP0436025A4 (en) * 1988-09-20 1991-09-11 Hisamitsu Pharmaceutical Co. Inc. Novel dibenz b,e)oxepin derivatives
DE4439485C2 (de) * 1994-10-26 1998-04-09 Ivoclar Ag Bicycloaliphatische 2-Methylen-1,3-dioxepane und deren Verwendung
JPH09194565A (ja) * 1996-01-24 1997-07-29 Sumitomo Bakelite Co Ltd 環状カーボナート樹脂組成物及びその硬化物
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Jsr株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
JP4662094B2 (ja) * 2000-10-25 2011-03-30 日立化成工業株式会社 スピロケタール化合物、アルキンジオール化合物及びこのアルキンジオール化合物を用いたスピロケタール化合物の製造法
JP2002322268A (ja) * 2001-04-27 2002-11-08 Toagosei Co Ltd 多官能オキセタン化合物と環状カルボン酸無水物からなるオキセタン樹脂の製造方法
KR100502993B1 (ko) * 2002-03-08 2005-07-25 주식회사 루밴틱스 광통신부품용 광학접착제
JP4820629B2 (ja) * 2004-11-25 2011-11-24 株式会社トクヤマ 硬化性組成物
DE602006001396D1 (de) * 2005-02-18 2008-07-17 Henkel Kgaa Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung

Also Published As

Publication number Publication date
EP2021394B1 (en) 2010-09-29
JP2009537684A (ja) 2009-10-29
ATE482986T1 (de) 2010-10-15
US7740734B2 (en) 2010-06-22
DE602007009519D1 (de) 2010-11-11
EP2021394A1 (en) 2009-02-11
WO2007135094A1 (en) 2007-11-29
KR20090015067A (ko) 2009-02-11
CN101448868B (zh) 2011-08-31
CN101448868A (zh) 2009-06-03
US20090087571A1 (en) 2009-04-02

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