ATE397634T1 - Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung - Google Patents
Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindungInfo
- Publication number
- ATE397634T1 ATE397634T1 AT06706642T AT06706642T ATE397634T1 AT E397634 T1 ATE397634 T1 AT E397634T1 AT 06706642 T AT06706642 T AT 06706642T AT 06706642 T AT06706642 T AT 06706642T AT E397634 T1 ATE397634 T1 AT E397634T1
- Authority
- AT
- Austria
- Prior art keywords
- lactone
- epoxy resin
- curing epoxy
- resin compositions
- amine curing
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 150000002596 lactones Chemical class 0.000 title abstract 2
- 150000001412 amines Chemical class 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 125000001072 heteroaryl group Chemical group 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/625—Hydroxyacids
- C08G59/626—Lactones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1545—Six-membered rings
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05003513 | 2005-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE397634T1 true ATE397634T1 (de) | 2008-06-15 |
Family
ID=36204487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06706642T ATE397634T1 (de) | 2005-02-18 | 2006-02-04 | Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20080003369A1 (de) |
| EP (1) | EP1848754B8 (de) |
| JP (1) | JP2008530321A (de) |
| AT (1) | ATE397634T1 (de) |
| DE (1) | DE602006001396D1 (de) |
| WO (1) | WO2006087111A1 (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE482986T1 (de) * | 2006-05-22 | 2010-10-15 | Henkel Ag & Co Kgaa | Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf |
| WO2011112405A1 (en) | 2010-03-11 | 2011-09-15 | Huntsman Petrochemical Llc | Cycloaliphatic carbonates as reactive diluents in epoxy resins |
| CN104203194B (zh) | 2012-02-02 | 2017-09-08 | 碧迪股份有限公司 | 用于与医用容器相联接的适配器 |
| BR112014016724A8 (pt) * | 2012-02-22 | 2017-07-04 | Basf Se | combinação, processo para a produção de combinação, processo para a produção de uma resina epóxi curada, e, resina epóxi curada |
| JP6497125B2 (ja) * | 2015-02-25 | 2019-04-10 | Dic株式会社 | ポリアリーレンエーテル樹脂、ポリアリーレンエーテル樹脂の製造方法、硬化性樹脂材料、その硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、ビルドアップフィルム、ビルドアップ基板 |
| US11059937B2 (en) * | 2016-07-25 | 2021-07-13 | The Boeing Company | Epoxy resin |
| JP6828306B2 (ja) * | 2016-08-24 | 2021-02-10 | 信越化学工業株式会社 | 樹脂組成物、樹脂フィルム、並びに半導体装置の製造方法及び半導体装置 |
| JP6907773B2 (ja) * | 2016-09-05 | 2021-07-21 | 住友ベークライト株式会社 | エポキシ樹脂組成物および半導体装置 |
| JP2018193470A (ja) * | 2017-05-17 | 2018-12-06 | Dic株式会社 | δ−バレロラクトン骨格含有樹脂 |
| EP3858899A4 (de) * | 2018-09-25 | 2022-06-29 | NIPPON STEEL Chemical & Material Co., Ltd. | Harzzusammensetzung für faserverstärkten verbundstoff und faserverstärkter verbundstoff damit |
| JP7198644B2 (ja) * | 2018-11-27 | 2023-01-04 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| EP4159785A4 (de) * | 2020-05-27 | 2024-05-29 | Sumitomo Chemical Company, Limited | Epoxidharzzusammensetzung und gehärtetes produkt daraus |
| WO2025205599A1 (ja) * | 2024-03-26 | 2025-10-02 | Ube株式会社 | 芳香族ラクトン含有樹脂及びその製造方法並びに硬化性樹脂組成物 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE624986A (de) * | 1961-11-20 | |||
| JPS5647471A (en) * | 1979-09-28 | 1981-04-30 | Japan Synthetic Rubber Co Ltd | Instantaneous adhesive composition |
| US4368314A (en) * | 1980-08-29 | 1983-01-11 | Toagoesi Chemical Industry Co., Ltd. | Curable composition comprising spiro-orthoester compound |
| JPS585327A (ja) * | 1981-06-30 | 1983-01-12 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS5920371A (ja) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | 導電性接着剤 |
| JPS6154653A (ja) * | 1984-08-25 | 1986-03-18 | Kyocera Corp | 電子部品用封止体およびその製造方法 |
| JPH0740597B2 (ja) * | 1985-05-30 | 1995-05-01 | 京セラ株式会社 | 電子部品用封止部材 |
| US4943610A (en) * | 1987-11-30 | 1990-07-24 | Sayles David C | Non-shrinking, dimensionally-stable modified epoxy resins |
| DK0525870T3 (da) * | 1991-07-22 | 1994-11-28 | Akzo Nobel Nv | Pulvermalingsammensætning indeholdende en harpiks,en hærder og zink |
| US5556927A (en) * | 1994-06-16 | 1996-09-17 | Daicel Chemical Industries, Ltd. | Carbonate group-modified epoxy resin, a process for the preparation thereof, and a heat-curable resin composition |
| JPH11158350A (ja) * | 1997-09-24 | 1999-06-15 | Hitachi Chem Co Ltd | エポキシ樹脂組成物、これを用いたぺースト状組成物およびこれを用いて製造される半導体装置 |
| EP1445287B1 (de) * | 2001-07-27 | 2009-05-27 | Kaneka Corporation | Härtbare zusammensetzung |
| US6664307B2 (en) * | 2001-11-03 | 2003-12-16 | Dymax Corporation | Low-shrinkage epoxy resin formulation |
| JP2003238659A (ja) * | 2002-02-22 | 2003-08-27 | Toray Ind Inc | エポキシ樹脂組成物およびエポキシ樹脂部材の製造方法 |
-
2006
- 2006-02-04 EP EP06706642A patent/EP1848754B8/de not_active Expired - Lifetime
- 2006-02-04 DE DE602006001396T patent/DE602006001396D1/de not_active Expired - Lifetime
- 2006-02-04 WO PCT/EP2006/000982 patent/WO2006087111A1/en not_active Ceased
- 2006-02-04 JP JP2007555492A patent/JP2008530321A/ja not_active Withdrawn
- 2006-02-04 AT AT06706642T patent/ATE397634T1/de not_active IP Right Cessation
-
2007
- 2007-07-19 US US11/780,170 patent/US20080003369A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20080003369A1 (en) | 2008-01-03 |
| JP2008530321A (ja) | 2008-08-07 |
| WO2006087111A1 (en) | 2006-08-24 |
| EP1848754B1 (de) | 2008-06-04 |
| EP1848754A1 (de) | 2007-10-31 |
| EP1848754B8 (de) | 2008-07-16 |
| DE602006001396D1 (de) | 2008-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |