ATE397634T1 - Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung - Google Patents

Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung

Info

Publication number
ATE397634T1
ATE397634T1 AT06706642T AT06706642T ATE397634T1 AT E397634 T1 ATE397634 T1 AT E397634T1 AT 06706642 T AT06706642 T AT 06706642T AT 06706642 T AT06706642 T AT 06706642T AT E397634 T1 ATE397634 T1 AT E397634T1
Authority
AT
Austria
Prior art keywords
lactone
epoxy resin
curing epoxy
resin compositions
amine curing
Prior art date
Application number
AT06706642T
Other languages
English (en)
Inventor
Kazuya Uenishi
Masashi Horikiri
Atsushi Sudo
Takeshi Endo
Original Assignee
Henkel Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Kgaa filed Critical Henkel Kgaa
Application granted granted Critical
Publication of ATE397634T1 publication Critical patent/ATE397634T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C08G59/626—Lactones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1545—Six-membered rings
AT06706642T 2005-02-18 2006-02-04 Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung ATE397634T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05003513 2005-02-18

Publications (1)

Publication Number Publication Date
ATE397634T1 true ATE397634T1 (de) 2008-06-15

Family

ID=36204487

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06706642T ATE397634T1 (de) 2005-02-18 2006-02-04 Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung

Country Status (6)

Country Link
US (1) US20080003369A1 (de)
EP (1) EP1848754B8 (de)
JP (1) JP2008530321A (de)
AT (1) ATE397634T1 (de)
DE (1) DE602006001396D1 (de)
WO (1) WO2006087111A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007009519D1 (de) * 2006-05-22 2010-11-11 Henkel Ag & Co Kgaa Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf
WO2011112405A1 (en) * 2010-03-11 2011-09-15 Huntsman Petrochemical Llc Cycloaliphatic carbonates as reactive diluents in epoxy resins
MX358074B (es) 2012-02-02 2018-08-03 Becton Dickinson Holdings Pte Ltd Acoplamiento de un contenedor medico mediante un adaptador.
CN104136483B (zh) * 2012-02-22 2016-08-24 巴斯夫欧洲公司 用于复合材料的共混物
JP6497125B2 (ja) * 2015-02-25 2019-04-10 Dic株式会社 ポリアリーレンエーテル樹脂、ポリアリーレンエーテル樹脂の製造方法、硬化性樹脂材料、その硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、ビルドアップフィルム、ビルドアップ基板
CA3231558A1 (en) * 2016-07-25 2018-02-01 The Boeing Company Epoxy resin
JP6828306B2 (ja) * 2016-08-24 2021-02-10 信越化学工業株式会社 樹脂組成物、樹脂フィルム、並びに半導体装置の製造方法及び半導体装置
JP6907773B2 (ja) * 2016-09-05 2021-07-21 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
JP2018193470A (ja) * 2017-05-17 2018-12-06 Dic株式会社 δ−バレロラクトン骨格含有樹脂
JP7424990B2 (ja) 2018-09-25 2024-01-30 日鉄ケミカル＆マテリアル株式会社 繊維強化複合材料用樹脂組成物及びそれを用いた繊維強化複合材料
JP7198644B2 (ja) * 2018-11-27 2023-01-04 住友化学株式会社 エポキシ樹脂組成物及びその硬化物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE624986A (de) * 1961-11-20
JPS5647471A (en) * 1979-09-28 1981-04-30 Japan Synthetic Rubber Co Ltd Instantaneous adhesive composition
US4368314A (en) * 1980-08-29 1983-01-11 Toagoesi Chemical Industry Co., Ltd. Curable composition comprising spiro-orthoester compound
JPS585327A (ja) * 1981-06-30 1983-01-12 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPS5920371A (ja) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
JPS6154653A (ja) * 1984-08-25 1986-03-18 Kyocera Corp 電子部品用封止体およびその製造方法
JPH0740597B2 (ja) * 1985-05-30 1995-05-01 京セラ株式会社 電子部品用封止部材
US4943610A (en) * 1987-11-30 1990-07-24 Sayles David C Non-shrinking, dimensionally-stable modified epoxy resins
EP0525870B1 (de) * 1991-07-22 1994-09-07 Akzo Nobel N.V. Pulverbeschichtung ein Harz, ein Vernetzungsmittel und Zink enthaltend
US5556927A (en) * 1994-06-16 1996-09-17 Daicel Chemical Industries, Ltd. Carbonate group-modified epoxy resin, a process for the preparation thereof, and a heat-curable resin composition
JPH11158350A (ja) * 1997-09-24 1999-06-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、これを用いたぺースト状組成物およびこれを用いて製造される半導体装置
US7115695B2 (en) * 2001-07-27 2006-10-03 Kaneka Corporation Curable composition
US6664307B2 (en) * 2001-11-03 2003-12-16 Dymax Corporation Low-shrinkage epoxy resin formulation
JP2003238659A (ja) * 2002-02-22 2003-08-27 Toray Ind Inc エポキシ樹脂組成物およびエポキシ樹脂部材の製造方法

Also Published As

Publication number Publication date
DE602006001396D1 (de) 2008-07-17
US20080003369A1 (en) 2008-01-03
EP1848754B1 (de) 2008-06-04
EP1848754A1 (de) 2007-10-31
JP2008530321A (ja) 2008-08-07
EP1848754B8 (de) 2008-07-16
WO2006087111A1 (en) 2006-08-24

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