DE602006001396D1 - Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung - Google Patents

Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung

Info

Publication number
DE602006001396D1
DE602006001396D1 DE602006001396T DE602006001396T DE602006001396D1 DE 602006001396 D1 DE602006001396 D1 DE 602006001396D1 DE 602006001396 T DE602006001396 T DE 602006001396T DE 602006001396 T DE602006001396 T DE 602006001396T DE 602006001396 D1 DE602006001396 D1 DE 602006001396D1
Authority
DE
Germany
Prior art keywords
lacton
amino
low
epoxy resin
resin compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006001396T
Other languages
English (en)
Inventor
Kazuya Uenishi
Masashi Horikiri
Atsushi Sudo
Takeshi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of DE602006001396D1 publication Critical patent/DE602006001396D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C08G59/626—Lactones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1545—Six-membered rings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE602006001396T 2005-02-18 2006-02-04 Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung Active DE602006001396D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05003513 2005-02-18
PCT/EP2006/000982 WO2006087111A1 (en) 2005-02-18 2006-02-04 Low shrinkage amine-curing epoxy resin compositions comprising a lactone

Publications (1)

Publication Number Publication Date
DE602006001396D1 true DE602006001396D1 (de) 2008-07-17

Family

ID=36204487

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006001396T Active DE602006001396D1 (de) 2005-02-18 2006-02-04 Aminhärtende epoxidharzzusammensetzungen mit einem lacton mit geringer schwindung

Country Status (6)

Country Link
US (1) US20080003369A1 (de)
EP (1) EP1848754B8 (de)
JP (1) JP2008530321A (de)
AT (1) ATE397634T1 (de)
DE (1) DE602006001396D1 (de)
WO (1) WO2006087111A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2021394B1 (de) * 2006-05-22 2010-09-29 Henkel AG & Co. KGaA Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf
US20130203894A1 (en) 2010-03-11 2013-08-08 Huntsman Petrochemical Llc Cycloaliphatic carbonates as reactive diluents in epoxy resins
KR101986869B1 (ko) 2012-02-02 2019-06-07 벡톤 디킨슨 홀딩즈 피티이 엘티디. 의료용 용기와 결합하기 위한 어댑터
JP2015511264A (ja) * 2012-02-22 2015-04-16 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 複合材用のブレンド
JP6497125B2 (ja) * 2015-02-25 2019-04-10 Dic株式会社 ポリアリーレンエーテル樹脂、ポリアリーレンエーテル樹脂の製造方法、硬化性樹脂材料、その硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、ビルドアップフィルム、ビルドアップ基板
EP3487904A4 (de) * 2016-07-25 2020-06-10 The Boeing Company Epoxidharz
JP6828306B2 (ja) * 2016-08-24 2021-02-10 信越化学工業株式会社 樹脂組成物、樹脂フィルム、並びに半導体装置の製造方法及び半導体装置
JP6907773B2 (ja) * 2016-09-05 2021-07-21 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
JP2018193470A (ja) * 2017-05-17 2018-12-06 Dic株式会社 δ−バレロラクトン骨格含有樹脂
US20220025140A1 (en) 2018-09-25 2022-01-27 Nippon Steel Chemical & Material Co., Ltd. Resin composition for fiber-reinforced composite material, and fiber-reinforced composite material using same
JP7198644B2 (ja) * 2018-11-27 2023-01-04 住友化学株式会社 エポキシ樹脂組成物及びその硬化物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE624986A (de) * 1961-11-20
JPS5647471A (en) * 1979-09-28 1981-04-30 Japan Synthetic Rubber Co Ltd Instantaneous adhesive composition
US4368314A (en) * 1980-08-29 1983-01-11 Toagoesi Chemical Industry Co., Ltd. Curable composition comprising spiro-orthoester compound
JPS585327A (ja) * 1981-06-30 1983-01-12 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPS5920371A (ja) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
JPS6154653A (ja) * 1984-08-25 1986-03-18 Kyocera Corp 電子部品用封止体およびその製造方法
JPH0740597B2 (ja) * 1985-05-30 1995-05-01 京セラ株式会社 電子部品用封止部材
US4943610A (en) * 1987-11-30 1990-07-24 Sayles David C Non-shrinking, dimensionally-stable modified epoxy resins
ES2060449T3 (es) * 1991-07-22 1994-11-16 Akzo Nobel Nv Composicion de revestimiento en polvo que contiene una resina, un agente de curado y zinc.
US5556927A (en) * 1994-06-16 1996-09-17 Daicel Chemical Industries, Ltd. Carbonate group-modified epoxy resin, a process for the preparation thereof, and a heat-curable resin composition
JPH11158350A (ja) * 1997-09-24 1999-06-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、これを用いたぺースト状組成物およびこれを用いて製造される半導体装置
CA2453535A1 (en) * 2001-07-27 2003-02-13 Kaneka Corporation Curable composition
US6664307B2 (en) * 2001-11-03 2003-12-16 Dymax Corporation Low-shrinkage epoxy resin formulation
JP2003238659A (ja) * 2002-02-22 2003-08-27 Toray Ind Inc エポキシ樹脂組成物およびエポキシ樹脂部材の製造方法

Also Published As

Publication number Publication date
JP2008530321A (ja) 2008-08-07
EP1848754A1 (de) 2007-10-31
EP1848754B1 (de) 2008-06-04
ATE397634T1 (de) 2008-06-15
US20080003369A1 (en) 2008-01-03
WO2006087111A1 (en) 2006-08-24
EP1848754B8 (de) 2008-07-16

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE

8364 No opposition during term of opposition