JP4302721B2 - 硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子 - Google Patents

硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子 Download PDF

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Publication number
JP4302721B2
JP4302721B2 JP2006188847A JP2006188847A JP4302721B2 JP 4302721 B2 JP4302721 B2 JP 4302721B2 JP 2006188847 A JP2006188847 A JP 2006188847A JP 2006188847 A JP2006188847 A JP 2006188847A JP 4302721 B2 JP4302721 B2 JP 4302721B2
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Japan
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group
component
parts
mass
sio
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JP2006188847A
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English (en)
Japanese (ja)
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JP2008013719A (ja
Inventor
宜良 亀田
利之 小材
恒雄 木村
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2006188847A priority Critical patent/JP4302721B2/ja
Priority to CN2007101095278A priority patent/CN101104737B/zh
Priority to KR1020070068519A priority patent/KR101335906B1/ko
Priority to TW096124928A priority patent/TWI406904B/zh
Publication of JP2008013719A publication Critical patent/JP2008013719A/ja
Application granted granted Critical
Publication of JP4302721B2 publication Critical patent/JP4302721B2/ja
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Sealing Material Composition (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Liquid Crystal (AREA)
JP2006188847A 2006-07-10 2006-07-10 硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子 Expired - Fee Related JP4302721B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006188847A JP4302721B2 (ja) 2006-07-10 2006-07-10 硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子
CN2007101095278A CN101104737B (zh) 2006-07-10 2007-06-27 固化性有机聚硅氧烷组合物、含有该组合物的平板显示器用密封剂及平板显示元件
KR1020070068519A KR101335906B1 (ko) 2006-07-10 2007-07-09 경화성 오르가노폴리실록산 조성물, 그것을 포함하는 평판디스플레이용 시일제, 및 평판 디스플레이 소자
TW096124928A TWI406904B (zh) 2006-07-10 2007-07-09 A hardened organopolysiloxane composition, a flat surface display sealant and a flat panel display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006188847A JP4302721B2 (ja) 2006-07-10 2006-07-10 硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子

Publications (2)

Publication Number Publication Date
JP2008013719A JP2008013719A (ja) 2008-01-24
JP4302721B2 true JP4302721B2 (ja) 2009-07-29

Family

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Family Applications (1)

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JP2006188847A Expired - Fee Related JP4302721B2 (ja) 2006-07-10 2006-07-10 硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子

Country Status (4)

Country Link
JP (1) JP4302721B2 (zh)
KR (1) KR101335906B1 (zh)
CN (1) CN101104737B (zh)
TW (1) TWI406904B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053526A1 (ja) * 2010-10-20 2012-04-26 旭化成イーマテリアルズ株式会社 酸化物ナノ粒子反応生成物及びシリコーン組成物
JP5409695B2 (ja) * 2011-04-26 2014-02-05 信越化学工業株式会社 オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
WO2013031798A1 (ja) * 2011-09-01 2013-03-07 東亞合成株式会社 耐熱衝撃性硬化物及びその製造方法
US20170037066A1 (en) * 2014-04-25 2017-02-09 Shin-Etsu Chemical Co., Ltd. Novel bis (alkoxysilyl-vinylene) group-containing silicon compound and production method of same
JP6953339B2 (ja) * 2018-03-22 2021-10-27 信越化学工業株式会社 撥水剤組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639286B2 (ja) 1992-07-14 1997-08-06 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物
US5508360A (en) * 1995-03-31 1996-04-16 Dow Corning Corporation Moisture-curable hot melt silicone pressure-sensitive adhesives
KR100967770B1 (ko) * 2002-10-23 2010-07-05 헨켈 코포레이션 고속 수분 경화성 및 자외선-수분 이중 경화성 조성물
JP2004189942A (ja) 2002-12-12 2004-07-08 Shin Etsu Chem Co Ltd シリコーン変性アクリレート系樹脂および光硬化型樹脂組成物
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Led用封止剤組成物
JP4819685B2 (ja) * 2003-10-08 2011-11-24 ダウ・コーニング・コーポレイション シリコーンmq樹脂強化シリコーンエラストマーエマルジョン
JP2006077234A (ja) 2004-08-10 2006-03-23 Shin Etsu Chem Co Ltd Led素子封止用樹脂組成物および該組成物を硬化してなる硬化物

Also Published As

Publication number Publication date
CN101104737B (zh) 2012-07-18
TW200819502A (en) 2008-05-01
CN101104737A (zh) 2008-01-16
KR101335906B1 (ko) 2013-12-02
TWI406904B (zh) 2013-09-01
KR20080005863A (ko) 2008-01-15
JP2008013719A (ja) 2008-01-24

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