JP4220460B2 - 外部電極形成方法 - Google Patents
外部電極形成方法 Download PDFInfo
- Publication number
- JP4220460B2 JP4220460B2 JP2004347049A JP2004347049A JP4220460B2 JP 4220460 B2 JP4220460 B2 JP 4220460B2 JP 2004347049 A JP2004347049 A JP 2004347049A JP 2004347049 A JP2004347049 A JP 2004347049A JP 4220460 B2 JP4220460 B2 JP 4220460B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrode portion
- groove
- forming
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 45
- 230000015572 biosynthetic process Effects 0.000 title claims description 14
- 239000004020 conductor Substances 0.000 claims description 37
- 238000013459 approach Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
Claims (4)
- 電子部品を構成する素子が挿入可能な溝部を有する治具を準備し、前記治具が有する溝部内に前記導体ペーストを満たす準備工程と、
当該満たした導体ペーストを前記溝部の少なくとも互いに対向する第1及び第2壁面並びに底面に沿って残留させ、残余を取り除く除去工程と、
前記素子を前記溝部内に挿入し、前記素子の第1面が前記第1の壁面に近づくように前記素子を相対的に移動させて前記第1面を前記第1の壁面に当接させ、前記第1の壁面に残留する導体ペーストを前記第1面と対向する方向から前記第1面に塗布して第1の電極部分を形成する第1形成工程と、
前記第1面に対向する前記素子の第2面が前記第2の壁面に近づくように前記素子を相対的に移動させて前記第2面を前記第2の壁面に当接させ、前記第2の壁面に残留する導体ペーストを前記第2面と対向する方向から前記第2面に塗布して第2の電極部分を形成する第2形成工程と、
前記第1面及び前記第2面それぞれと隣り合う前記素子の第3面が前記底面に当接するように前記素子を相対的に移動させて、前記底面に残留する導体ペーストを前記第3面に塗布して、前記第1の電極部分及び前記第2の電極部分を繋ぐように第3の電極部分を形成する第3形成工程と、
当該素子を乾燥させて、前記第1の電極部分、前記第2の電極部分、及び前記第3の電極部分からなる外部電極を形成する電極形成工程と、
を備える、電子部品の外部電極形成方法。 - 前記第1形成工程にて前記第1の電極部分を形成し、前記第2形成工程にて前記第2の電極部分を形成した後で且つ前記第3形成工程の前に、前記素子を乾燥させて、前記第1の電極部分及び前記第2の電極部分における導体ペーストの流動性を低下させる中間処理工程を、更に備える、請求項1に記載の外部電極成形方法。
- 前記第1形成工程では、前記第1の電極部分を前記第1面の複数箇所に並べて形成し、
前記第2形成工程では、複数箇所に並べて形成した前記第1の電極部分それぞれに対応する位置に前記第2の電極部分を形成し、
前記第3形成工程では、複数箇所に並べて形成した前記第1の電極部分それぞれと、対応する位置に形成された前記第2の電極部分それぞれとを繋ぐように前記第3の電極部分を形成する、請求項1又は2に記載の外部電極形成方法。 - 前記準備工程では、前記治具として、前記素子が挿入可能な溝部が形成された複数の板状部材が互いに沿うように配置されている治具を準備し、前記複数の板状部材それぞれの溝部を跨って覆うように前記それぞれの溝部内に前記導体ペーストを満たし、
前記除去工程では、前記複数の板状部材それぞれの間に入り込んだ導体ペーストを除去することで、前記それぞれの溝部に入り込んだ導体ペーストを前記それぞれの溝部の少なくとも前記第1及び第2壁面並びに前記底面に沿って残留させる、請求項3に記載の外部電極形成方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004347049A JP4220460B2 (ja) | 2004-11-30 | 2004-11-30 | 外部電極形成方法 |
US11/288,203 US7458151B2 (en) | 2004-11-30 | 2005-11-29 | Method of forming external electrode |
TW094141941A TWI284064B (en) | 2004-11-30 | 2005-11-29 | Method of forming external electrode |
KR1020050115567A KR100688929B1 (ko) | 2004-11-30 | 2005-11-30 | 외부전극 형성방법 |
CNB2005101258435A CN100492593C (zh) | 2004-11-30 | 2005-11-30 | 外部电极形成方法 |
HK06111582.5A HK1091032A1 (en) | 2004-11-30 | 2006-10-20 | Method of forming external electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004347049A JP4220460B2 (ja) | 2004-11-30 | 2004-11-30 | 外部電極形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006156811A JP2006156811A (ja) | 2006-06-15 |
JP4220460B2 true JP4220460B2 (ja) | 2009-02-04 |
Family
ID=36566072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004347049A Active JP4220460B2 (ja) | 2004-11-30 | 2004-11-30 | 外部電極形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7458151B2 (ja) |
JP (1) | JP4220460B2 (ja) |
KR (1) | KR100688929B1 (ja) |
CN (1) | CN100492593C (ja) |
HK (1) | HK1091032A1 (ja) |
TW (1) | TWI284064B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100746906B1 (ko) * | 2006-09-18 | 2007-08-07 | 주식회사 이어메카 | 무선 이어폰 |
JP4661815B2 (ja) * | 2007-03-29 | 2011-03-30 | Tdk株式会社 | 電子部品の製造方法 |
JP4835686B2 (ja) | 2008-12-22 | 2011-12-14 | Tdk株式会社 | 積層コンデンサ |
JP4849123B2 (ja) * | 2008-12-22 | 2012-01-11 | Tdk株式会社 | 積層コンデンサの製造方法 |
US8198547B2 (en) | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed pass-through components for printed circuit boards |
US8735734B2 (en) | 2009-07-23 | 2014-05-27 | Lexmark International, Inc. | Z-directed delay line components for printed circuit boards |
US20110017504A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Ferrite Bead Components for Printed Circuit Boards |
US20110017502A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Components for Printed Circuit Boards |
US9078374B2 (en) | 2011-08-31 | 2015-07-07 | Lexmark International, Inc. | Screening process for manufacturing a Z-directed component for a printed circuit board |
US8790520B2 (en) | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US8752280B2 (en) * | 2011-09-30 | 2014-06-17 | Lexmark International, Inc. | Extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8658245B2 (en) | 2011-08-31 | 2014-02-25 | Lexmark International, Inc. | Spin coat process for manufacturing a Z-directed component for a printed circuit board |
US8943684B2 (en) * | 2011-08-31 | 2015-02-03 | Lexmark International, Inc. | Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US8830692B2 (en) | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
JP6633829B2 (ja) * | 2014-11-21 | 2020-01-22 | 株式会社クリエイティブコーティングス | 電子部品の製造方法及び装置 |
JP6378122B2 (ja) * | 2014-12-05 | 2018-08-22 | 太陽誘電株式会社 | 積層セラミック電子部品 |
JP7398122B2 (ja) * | 2021-06-03 | 2023-12-14 | 株式会社クリエイティブコーティングス | 電子部品の製造方法及びペースト塗布装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6048230U (ja) * | 1983-09-11 | 1985-04-04 | 株式会社村田製作所 | 積層コンデンサ |
JPS60109204A (ja) | 1983-11-17 | 1985-06-14 | 株式会社村田製作所 | チップ部品の外部電極形成方法 |
JPH0677099A (ja) | 1992-08-22 | 1994-03-18 | Taiyo Yuden Co Ltd | 電子部品の外部電極形成方法 |
JPH0922815A (ja) | 1995-07-07 | 1997-01-21 | Taiyo Yuden Co Ltd | チップ部品の外部電極形成方法 |
US5753299A (en) * | 1996-08-26 | 1998-05-19 | Electro Scientific Industries, Inc. | Method and apparatus for forming termination stripes |
JP3240963B2 (ja) * | 1997-07-24 | 2001-12-25 | 株式会社村田製作所 | チップ状電子部品の電極形成方法およびチップ状電子部品用ホルダ |
JP2000030916A (ja) | 1998-07-16 | 2000-01-28 | Murata Mfg Co Ltd | 電子部品の電極塗布方法および装置 |
JP2001060532A (ja) | 1999-08-19 | 2001-03-06 | Tdk Corp | 積層セラミック電子部品の外部電極形成方法 |
TW429169B (en) | 1999-11-19 | 2001-04-11 | Schmidt Scient Taiwan Ltd | Method for forming electrode with dipping end used for long-shaped surface mounted device that needs coated conduction metal on both ends and the apparatus for performing this method |
JP3918083B2 (ja) | 2000-11-13 | 2007-05-23 | 株式会社村田製作所 | 電子部品の製造装置および電子部品の製造方法 |
JP2004088068A (ja) | 2002-06-27 | 2004-03-18 | Kyocera Corp | チップ型電子部品の外部電極形成方法及び装置 |
JP3744505B2 (ja) | 2003-04-08 | 2006-02-15 | 松下電器産業株式会社 | チップ型電子部品の外部電極形成方法 |
-
2004
- 2004-11-30 JP JP2004347049A patent/JP4220460B2/ja active Active
-
2005
- 2005-11-29 TW TW094141941A patent/TWI284064B/zh active
- 2005-11-29 US US11/288,203 patent/US7458151B2/en not_active Expired - Fee Related
- 2005-11-30 CN CNB2005101258435A patent/CN100492593C/zh active Active
- 2005-11-30 KR KR1020050115567A patent/KR100688929B1/ko active IP Right Grant
-
2006
- 2006-10-20 HK HK06111582.5A patent/HK1091032A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060060819A (ko) | 2006-06-05 |
TW200626253A (en) | 2006-08-01 |
US20060112546A1 (en) | 2006-06-01 |
HK1091032A1 (en) | 2007-01-05 |
TWI284064B (en) | 2007-07-21 |
CN100492593C (zh) | 2009-05-27 |
KR100688929B1 (ko) | 2007-03-02 |
CN1808696A (zh) | 2006-07-26 |
US7458151B2 (en) | 2008-12-02 |
JP2006156811A (ja) | 2006-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4220460B2 (ja) | 外部電極形成方法 | |
JP4188972B2 (ja) | 外部電極形成方法 | |
DE102006024213A1 (de) | Verfahren zum Herstellen eines Bausteins mit einer elektrischen Kontaktierung | |
JP4299296B2 (ja) | 外部電極形成方法 | |
JP4697285B2 (ja) | 外部電極形成方法 | |
JP4458068B2 (ja) | 外部電極形成方法 | |
JPH0362917A (ja) | 電子部品の電極形成方法 | |
US20230064682A1 (en) | Stencil for stencil printing process | |
US11622452B2 (en) | Method of manufacturing a conductive track on a board via stencil printing | |
KR102648789B1 (ko) | 전자부품의 제조 방법 및 장치 | |
JP2007518258A (ja) | 回路部品を回路基板に接着する方法 | |
CN103369823B (zh) | 印刷电路板及其制造方法 | |
US20230060880A1 (en) | Flattening surface of pasted track in stencil printing process | |
TWI853154B (zh) | 電子零件之製造方法及裝置 | |
US20230062023A1 (en) | Squeegee for stencil printing | |
JP3919113B2 (ja) | 半田こて | |
JP4360193B2 (ja) | 電子部品へのペースト転写方法 | |
TW202310692A (zh) | 電子零件之製造方法及糊劑塗佈裝置 | |
JP4273213B2 (ja) | 実装部品取り外し用治具 | |
JPH0636899B2 (ja) | 電子部品端部のペースト塗布方法 | |
JP2007081163A (ja) | 外部電極形成用治具およびチップ型電子部品の製造方法。 | |
JP2013018195A (ja) | ペースト印刷用スキージ、ペースト印刷装置、配線基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080313 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080318 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080421 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20081111 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081113 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111121 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4220460 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121121 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121121 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131121 Year of fee payment: 5 |