HK1091032A1 - Method of forming external electrode - Google Patents
Method of forming external electrodeInfo
- Publication number
- HK1091032A1 HK1091032A1 HK06111582.5A HK06111582A HK1091032A1 HK 1091032 A1 HK1091032 A1 HK 1091032A1 HK 06111582 A HK06111582 A HK 06111582A HK 1091032 A1 HK1091032 A1 HK 1091032A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- external electrode
- forming external
- forming
- electrode
- external
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004347049A JP4220460B2 (ja) | 2004-11-30 | 2004-11-30 | 外部電極形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1091032A1 true HK1091032A1 (en) | 2007-01-05 |
Family
ID=36566072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06111582.5A HK1091032A1 (en) | 2004-11-30 | 2006-10-20 | Method of forming external electrode |
Country Status (6)
Country | Link |
---|---|
US (1) | US7458151B2 (xx) |
JP (1) | JP4220460B2 (xx) |
KR (1) | KR100688929B1 (xx) |
CN (1) | CN100492593C (xx) |
HK (1) | HK1091032A1 (xx) |
TW (1) | TWI284064B (xx) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100746906B1 (ko) * | 2006-09-18 | 2007-08-07 | 주식회사 이어메카 | 무선 이어폰 |
JP4661815B2 (ja) * | 2007-03-29 | 2011-03-30 | Tdk株式会社 | 電子部品の製造方法 |
JP4849123B2 (ja) * | 2008-12-22 | 2012-01-11 | Tdk株式会社 | 積層コンデンサの製造方法 |
JP4835686B2 (ja) | 2008-12-22 | 2011-12-14 | Tdk株式会社 | 積層コンデンサ |
US8198547B2 (en) | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed pass-through components for printed circuit boards |
US20110017502A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Components for Printed Circuit Boards |
US8735734B2 (en) | 2009-07-23 | 2014-05-27 | Lexmark International, Inc. | Z-directed delay line components for printed circuit boards |
US20110017504A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Ferrite Bead Components for Printed Circuit Boards |
US9078374B2 (en) | 2011-08-31 | 2015-07-07 | Lexmark International, Inc. | Screening process for manufacturing a Z-directed component for a printed circuit board |
US8790520B2 (en) | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US8752280B2 (en) * | 2011-09-30 | 2014-06-17 | Lexmark International, Inc. | Extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8658245B2 (en) | 2011-08-31 | 2014-02-25 | Lexmark International, Inc. | Spin coat process for manufacturing a Z-directed component for a printed circuit board |
US8943684B2 (en) * | 2011-08-31 | 2015-02-03 | Lexmark International, Inc. | Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
US8830692B2 (en) | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
JP6633829B2 (ja) * | 2014-11-21 | 2020-01-22 | 株式会社クリエイティブコーティングス | 電子部品の製造方法及び装置 |
JP6378122B2 (ja) * | 2014-12-05 | 2018-08-22 | 太陽誘電株式会社 | 積層セラミック電子部品 |
JP7398122B2 (ja) * | 2021-06-03 | 2023-12-14 | 株式会社クリエイティブコーティングス | 電子部品の製造方法及びペースト塗布装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6048230U (ja) * | 1983-09-11 | 1985-04-04 | 株式会社村田製作所 | 積層コンデンサ |
JPS60109204A (ja) * | 1983-11-17 | 1985-06-14 | 株式会社村田製作所 | チップ部品の外部電極形成方法 |
JPH0677099A (ja) | 1992-08-22 | 1994-03-18 | Taiyo Yuden Co Ltd | 電子部品の外部電極形成方法 |
JPH0922815A (ja) | 1995-07-07 | 1997-01-21 | Taiyo Yuden Co Ltd | チップ部品の外部電極形成方法 |
US5753299A (en) * | 1996-08-26 | 1998-05-19 | Electro Scientific Industries, Inc. | Method and apparatus for forming termination stripes |
JP3240963B2 (ja) * | 1997-07-24 | 2001-12-25 | 株式会社村田製作所 | チップ状電子部品の電極形成方法およびチップ状電子部品用ホルダ |
JP2000030916A (ja) | 1998-07-16 | 2000-01-28 | Murata Mfg Co Ltd | 電子部品の電極塗布方法および装置 |
JP2001060532A (ja) | 1999-08-19 | 2001-03-06 | Tdk Corp | 積層セラミック電子部品の外部電極形成方法 |
TW429169B (en) * | 1999-11-19 | 2001-04-11 | Schmidt Scient Taiwan Ltd | Method for forming electrode with dipping end used for long-shaped surface mounted device that needs coated conduction metal on both ends and the apparatus for performing this method |
JP3918083B2 (ja) | 2000-11-13 | 2007-05-23 | 株式会社村田製作所 | 電子部品の製造装置および電子部品の製造方法 |
JP2004088068A (ja) | 2002-06-27 | 2004-03-18 | Kyocera Corp | チップ型電子部品の外部電極形成方法及び装置 |
JP3744505B2 (ja) | 2003-04-08 | 2006-02-15 | 松下電器産業株式会社 | チップ型電子部品の外部電極形成方法 |
-
2004
- 2004-11-30 JP JP2004347049A patent/JP4220460B2/ja active Active
-
2005
- 2005-11-29 US US11/288,203 patent/US7458151B2/en not_active Expired - Fee Related
- 2005-11-29 TW TW094141941A patent/TWI284064B/zh active
- 2005-11-30 CN CNB2005101258435A patent/CN100492593C/zh active Active
- 2005-11-30 KR KR1020050115567A patent/KR100688929B1/ko active IP Right Grant
-
2006
- 2006-10-20 HK HK06111582.5A patent/HK1091032A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100688929B1 (ko) | 2007-03-02 |
KR20060060819A (ko) | 2006-06-05 |
TW200626253A (en) | 2006-08-01 |
CN1808696A (zh) | 2006-07-26 |
JP2006156811A (ja) | 2006-06-15 |
CN100492593C (zh) | 2009-05-27 |
JP4220460B2 (ja) | 2009-02-04 |
TWI284064B (en) | 2007-07-21 |
US7458151B2 (en) | 2008-12-02 |
US20060112546A1 (en) | 2006-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20121130 |