CN103369823B - 印刷电路板及其制造方法 - Google Patents

印刷电路板及其制造方法 Download PDF

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CN103369823B
CN103369823B CN201210592954.7A CN201210592954A CN103369823B CN 103369823 B CN103369823 B CN 103369823B CN 201210592954 A CN201210592954 A CN 201210592954A CN 103369823 B CN103369823 B CN 103369823B
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resin material
solder resist
mounting panel
circuit board
printed circuit
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CN103369823A (zh
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竹居成和
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Fujitsu Ltd
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Fujitsu Ltd
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Abstract

本发明涉及印刷电路板及其制造方法，该印刷电路板包括：安装板，其正面上有阻焊剂；安装在所述安装板上的部件；将所述部件固定到所述安装板上的底层填充材料；以及点布在所述阻焊剂与所述底层填充材料之间的树脂材料。

Description

印刷电路板及其制造方法
技术领域
本发明涉及印刷电路板及其制造方法。
背景技术
近年来，在大安装板例如母板（主机板）上越来越多地安装部件，例如具有球状矩阵排列（BGA）、具有封装和多个引脚的半导体芯片。通常，在安装后，使用底部填充材料将这些部件固定于安装板上。在部件包含的大规模集成电路中有时会发生错误，在这种情况下需要更换部件。
但是，在替换部件时，不仅需要移除部件和底部填充材料，而且形成在安装板正面上的阻焊剂也会被剥离。此外，随着阻焊剂的剥离，位于安装板正面上的凸起会与之分离开。这种情况下，使用安装板是困难的。
专利文件1：日本特开平8-32199号公报
专利文件2：日本特开2004-186287号公报
专利文件3：日本特开2001-7488号公报
发明内容
本发明的目的是提供一种能够在移除部件时抑制阻焊剂剥离的印刷电路板及其制造方法。
根据本发明的一个方面，一种印刷电路板包括：安装板，其正面上有阻焊剂；安装在所述安装板上的部件；将所述部件固定到所述安装板上的底层填充材料；点布（dot）在所述阻焊剂与所述底层填充材料之间的树脂材料。
根据本发明的另一个方面，一种印刷电路板的制造方法包括以下步骤：将树脂材料点布在安装板正面的阻焊剂上；在所述安装板上安装部件；以及在所述安装板与所述部件之间的间隙中以及所述树脂材料与所述部件之间的间隙中提供将所述部件固定到所述安装板上的底层填充材料。
附图说明
图1A和1B是示出根据本发明第一实施方式的印刷电路板的构造的示意图；
图2A和2B是示出已经移除了部件30的状态的示意图；
图3A至3C是示出参考示例的示意图；
图4A至4L是按步骤顺序示出根据本发明第一实施方式的印刷电路板的制造方法的截面图；
图5A和5B是示出焊盘11的布局示例的示意图；
图6是示出根据本发明第二实施方式的印刷电路板的构造的示意图。
具体实施方式
以下结合附图标记详细说明本发明的优选实施方式。
（第一实施方式）
首先说明本发明的第一实施方式。图1A和1B是示出根据本发明第一实施方式的印刷电路板的构造的示意图。图1A是平面示意图；图1B是截面图。
在第一实施方式中，如图1A和1B所示，部件30被安装到安装板10上。利用底部填充材料20将部件30固定到安装板10上。焊盘（电极）11被布置在安装板10的正面，并且围绕着焊盘11形成有阻焊剂12。换句话说，安装板10的正面大部分被阻焊剂12覆盖，焊盘11布置在没有覆盖阻焊剂12的部分。例如是BGA半导体芯片的部件和焊盘（电极）31以面向焊盘11的方式被布置在部件30的面向安装板10的表面上。此外，焊盘11和焊盘31用连接材料23进行连接。连接材料23例如可以是焊接材料。此外，树脂材料21点布在阻焊剂12上。底部填充材料20被形成为填充安装板10与部件30之间的间隙。因此，底部填充材料20以覆盖树脂材料21的方式被设置在安装板10上放，并且树脂材料21被点布在阻焊剂12与底部填充材料20之间。此外，阻焊剂12的没有被树脂材料21覆盖的区域与底部填充材料20接触。
树脂材料21粘结到阻焊剂12的强度在温度升高的情况下开始降低时的温度可能低于底部填充材料20粘结到阻焊剂12的强度在温度升高的情况下开始降低的温度。
表面安装型印刷电路板如上所述地被配置。为了替换由于出现故障或类似情况的部件30，印刷电路板的温度升高。随着印刷电路板的温度升高，底部填充材料20和树脂材料21的温度升高。因为树脂材料21粘结到阻焊剂12的强度开始降低时的温度低于底部填充材料20粘结到阻焊剂12的强度开始降低时的温度，所以树脂材料21比底部填充材料20更容易提早剥离。随着温度的继续升高，底部填充材料20粘结到阻焊剂12的强度开始降低。此时，由于树脂材料21已经变得容易从阻焊剂12剥离，所以将底部填充材料20从阻焊剂12剥离开的现象扩展到树脂材料21周围的区域。因此，如图2A和2B所示，不需要将阻焊剂12从安装板10上剥离就可以将底部填充材料20从安装板10上剥离。此外，由于阻焊剂12没有从安装板10上被剥离，所以焊盘11也不可能从安装板10上被剥离。图2A是截面图，图2B示出了已经将部件30从其上移除的安装板10的上表面。如图2B所示，各种配线例如连接焊盘11的配线16被形成在安装板10的阻焊剂12的下方，并且由于阻焊剂12没有被剥离，因此能够保持阻焊剂对这些配线的保护。
另一方面，如果在如图3A所示的参考示例一样没有提供树脂材料21的情况下印刷电路板由于替换部件而温度升高，那么除非底部填充材料20粘附到阻焊剂12的强度明显降低，否则就会如图3B和3C所示出现阻焊剂12的剥离。此外，也可能随着阻焊剂12的剥离而发生焊盘11的分离。在阻焊剂12已经被剥离的情况下，如果在阻焊剂12下方有配线，例如配线16，那么将会暴露出配线。在安装完用来替换的新部件后，暴露的配线会引起短路。
注意，在第一实施方式中，如果底部填充材料20粘附到阻焊剂12的强度已经降低到如参考示例所示的程度，那么树脂材料21就能够很容易地从阻焊剂12上剥离，而基本不会出现上述问题。如上所述，根据第一实施方式，能够显著地抑制在移除部件30时阻焊剂的剥离。
此外，在树脂材料21被形成在阻焊剂12与底部填充材料20之间的整个间隙中的情况下，由底部填充材料20来固定部件30是不足的。相比之下，在第一实施方式中，底部填充材料20与阻焊剂12的没有覆盖树脂材料21的区域相接触，这样使得部件30能够通过底部填充材料20充分地固定在安装板10上。
以下将会描述根据第一实施方式的印刷电路板的制造方法。图4A和4L是按步骤顺序示出根据本发明第一实施方式的印刷电路板的制造方法的截面图。
首先，如图4A所示，阻焊剂12被形成在安装板10的形成有配线和焊盘11的正面上。在这种情况下，阻焊剂12的上表面被设置为高于焊盘11的上表面。它们之间的差例如为20μm。接下来，如图4B所示，具有与焊盘11相匹配的开口的掩模13被设置在阻焊剂12上方。例如，金属掩模可用作掩模13。可以根据要施加到焊盘11上的焊膏量来确定掩模13的厚度。之后，如图4C所示，通过使用掩模13的印刷方法将焊膏15设置到焊盘11上。然后移除掩模13。
此外，如图4D所示，将树脂材料21的液体备放在包括具有预定深度的壳体单元45的容器41中。准备了由引脚支撑单元44来支撑引脚43的夹具42。引脚43被设置为与要设置在阻焊剂12上的树脂材料21相同的图案。夹具42例如可以由不锈钢制成。然后，如图4E所示，引脚43浸入到树脂材料21的液体中，并且引脚43的端部与壳体45的底表面接触。之后，如图4F所示，夹具42被拉起。几乎固定量的树脂材料21粘附到每个引脚43的末端。
接下来，如图4G所示，在引脚43的端部粘附有树脂材料21的夹具42被移动到安装板10的上方。如图4H所示，将夹具42降低以使树脂材料21与阻焊剂12接触。此时，引脚43的端部会与阻焊剂12接触。之后，如图4I所示，将夹具42拉起。结果，粘附到引脚43端部的树脂材料21保留在阻焊剂上。也就是说，树脂材料21被转移到阻焊剂12的顶部。由于粘附到每个引脚43末端的树脂材料21的量几乎是一样的，因此，在阻焊剂12上的每个位置所保留的树脂材料的量也几乎是一样的。例如，树脂材料21可以被布置为与焊膏15分离开，并且相比于焊膏15的顶部的位置，树脂材料21的顶部的位置被设置为更靠近安装板10。如果树脂材料21没有与焊膏15分离而是与焊膏15接触，那么随后就可能无法获得良好的连接材料23。此外，底部填充材料20与阻焊剂12的接触面积也许并不足够。如果树脂材料21的顶部的位置相比于焊膏15的顶部的位置更加远离安装板10，也就是说，如果树脂材料21过高，那么树脂材料21很可能流动并粘附到焊膏15。在这种情况下同样有可能无法随后获得良好的连接材料23，从而导致底部填充材料20和阻焊剂12的接触面积不足。
接下来，如图4J所示，在焊盘31上设置有焊锡球32的部件被安装到安装板10上，使得焊锡球32与焊膏15接触。然后，通过加热使焊膏15和焊锡熔化，再通过后续的冷却使熔化的焊膏15和焊锡球32凝固。结果，如图4K所示，连接材料23由焊膏15和焊锡球32构成，部件30被安装到安装板10上。可以考虑焊膏15和焊锡球32的熔点等来确定加热温度和时间。例如，可以维持在150℃或者更高温度3到4分钟。此外，作为加热的结果，树脂材料21根据其材料可成为半硬化状态或全硬化状态。接下来，如图4L所示，使底部填充材料20流入部件30与安装板10之间的间隙中，并通过加热而硬化。可考虑底部填充材料20的硬化温度、连接材料23的熔点等来确定加热温度及时间。例如，可以维持在温度125℃至150℃15至20分钟。可以例如通过施加底部填充材料29的材料来实现底部填充材料20的流动。
因此，就可以制成根据第一实施方式的印刷电路板。
顺便提及，容器41的壳体单元45的深度并不受特别限定，优选地，可根据粘附到阻焊剂12顶部的树脂材料21的量来确定该深度。例如，虽然依赖于树脂材料21的粘度，但该量可被设为粘附到阻焊剂12顶部的树脂材料21的高度的两倍。
底部填充材料20的类型和树脂材料21的类型并不受特别限定。例如，在环氧基树脂用于底部填充材料20的情况下，优选地使用软化点（软化温度）低于底部填充材料20的环氧基树脂或丙烯醛基树脂作为树脂材料21。
此外，引脚43的长度和厚度可根据树脂材料21在底部填充材料20上粘附的位置以及与该位置周围的焊膏15的距离等而不同。例如，在焊膏15被稀疏布置的区域中所设置的树脂材料21可能相对较大，并且根据树脂材料21的尺寸，引脚43可以是厚的。相反，在焊膏15被密集布置的区域中所设置的树脂材料21优选相对较小，并且根据树脂材料21的尺寸，引脚43可以是薄的。
焊盘11的布局并不受特别限制，并且如图5A所示，焊盘11可被相对有规律地布置，或者如图5B所示，相对无规律地布置。对于树脂材料21的形成，如果使用根据焊盘11的布局布置有引脚43的夹具42，那么就能够容易地将树脂材料21设置在期望的位置。
顺便提及，树脂材料21的形成并不限于使用上述的夹具来进行转移，也可以通过丝网印刷或喷墨印刷的方法来进行。然而，考虑到精度、成本等因素，优选地采用夹具进行转移。
（第二实施方式）
接下来描述第二实施方式。图6是示出根据本发明第二实施方式的印刷电路板的构造的示意图。
相比于底部填充材料20被设置在部件30与安装板10之间的整个空隙中的第一实施方式，在第二实施方式中，底部填充材料20仅被设置在矩形平面形状的部件30的四个角部附近。其他构造抖与第一实施方式类似。例如，第一实施方式可称为全浸入涂覆方法，第二实施方式可称为角部绑定方法。
如上所述，除了底部填充材料20所设置的位置不同外，第二实施方式具有与第一实施方式类似的构造。同样，在第二实施方式中也和第一实施方式一样能够抑制当移除部件30时阻焊剂12的剥离。
顺便提及，在第一实施方式和第二实施方式中，优选地树脂材料21的表面与阻焊剂12接触的总面积是阻焊剂12的表面覆盖有底部填充材料20的面积的20%至80%。当上述面积比小于20%时，由于设置树脂材料21而获得的改进了剥离特性的效果可能不足。当上述面积比超过80%时，阻焊剂12与底部填充材料20的接触面积会变小，很难保证足够的粘附强度。此外，上述面积比优选地为50%或者更高，或者优选地为70%或者更低。
根据上述印刷电路板等，在阻焊剂上设置了合适的树脂材料，因此，在移除部件时能够容易地剥离底部填充材料，并且能够抑制阻焊剂的剥离。

Claims (6)

1.一种印刷电路板的制造方法，所述制造方法包括以下步骤：
在位于安装板的正面上的阻焊剂上点布树脂材料；
在所述安装板上安装部件；以及
在所述安装板与所述部件之间的间隙中以及所述树脂材料与所述部件之间的间隙中提供底层填充材料，所述底层填充材料将所述部件固定到所述安装板上，
其中，点布树脂材料的步骤包括：
使树脂材料粘附到设置在夹具处的引脚的末端；
使所述树脂材料与所述阻焊剂接触；以及
将所述夹具拉起，使所述树脂材料留在所述阻焊剂上。
2.根据权利要求1所述的印刷电路板的制造方法，其中，所述树脂材料的软化点低于所述底层填充材料的软化点。
3.根据权利要求1或2所述的印刷电路板的制造方法，其中，所述树脂材料的软化点高于所述部件的工作温度。
4.根据权利要求1或2所述的印刷电路板的制造方法，其中，多个树脂材料与所述阻焊剂接触的总表面积是所述阻焊剂的覆盖有所述底层填充材料的表面积的20％-80％。
5.根据权利要求1或2所述的印刷电路板的制造方法，其中，在点布树脂材料时，所述树脂材料的顶部的位置相比于所述安装板的电极上的焊膏的顶部的位置更接近所述安装板。
6.根据权利要求1或2所述的印刷电路板的制造方法，其中，在点布树脂材料时，所述树脂材料被布置为与所述安装板的电极上的焊膏分离开。
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