JP4210692B2 - 穿孔装置 - Google Patents

穿孔装置 Download PDF

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Publication number
JP4210692B2
JP4210692B2 JP2006150707A JP2006150707A JP4210692B2 JP 4210692 B2 JP4210692 B2 JP 4210692B2 JP 2006150707 A JP2006150707 A JP 2006150707A JP 2006150707 A JP2006150707 A JP 2006150707A JP 4210692 B2 JP4210692 B2 JP 4210692B2
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
unit
axis moving
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006150707A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007319956A (ja
Inventor
努 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Precision Inc
Original Assignee
Seiko Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Inc filed Critical Seiko Precision Inc
Priority to JP2006150707A priority Critical patent/JP4210692B2/ja
Priority to TW96108432A priority patent/TW200810634A/zh
Priority to CN2007101058457A priority patent/CN101083875B/zh
Publication of JP2007319956A publication Critical patent/JP2007319956A/ja
Application granted granted Critical
Publication of JP4210692B2 publication Critical patent/JP4210692B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
JP2006150707A 2006-05-30 2006-05-30 穿孔装置 Expired - Fee Related JP4210692B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006150707A JP4210692B2 (ja) 2006-05-30 2006-05-30 穿孔装置
TW96108432A TW200810634A (en) 2006-05-30 2007-03-12 Perforating device for printed circuit wiring board and reference perforating method
CN2007101058457A CN101083875B (zh) 2006-05-30 2007-05-30 印刷电路布线板用穿孔装置及基准孔穿孔方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006150707A JP4210692B2 (ja) 2006-05-30 2006-05-30 穿孔装置

Publications (2)

Publication Number Publication Date
JP2007319956A JP2007319956A (ja) 2007-12-13
JP4210692B2 true JP4210692B2 (ja) 2009-01-21

Family

ID=38853173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006150707A Expired - Fee Related JP4210692B2 (ja) 2006-05-30 2006-05-30 穿孔装置

Country Status (3)

Country Link
JP (1) JP4210692B2 (enrdf_load_stackoverflow)
CN (1) CN101083875B (enrdf_load_stackoverflow)
TW (1) TW200810634A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343507A (zh) * 2010-07-30 2012-02-08 信义汽车玻璃(深圳)有限公司 汽车玻璃附件安装定位方法
CN103228107B (zh) * 2012-01-31 2016-03-23 王锦燕 位置校正装置及使用该位置校正装置的位置校正方法
JP5952052B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
JP5952053B2 (ja) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 穴開け装置
CN103557793A (zh) * 2013-11-14 2014-02-05 成都金大立科技有限公司 一种pcb孔位、孔径检测系统及检测方法
CN103752882B (zh) * 2013-12-27 2016-09-21 广州兴森快捷电路科技有限公司 线路板的钻孔方法
TW201605315A (zh) * 2014-02-21 2016-02-01 維亞機械股份有限公司 背鑽加工方法以及背鑽加工裝置
KR101846385B1 (ko) * 2016-07-12 2018-04-06 주식회사 에이치비테크놀러지 양단지지보 구조의 초고속 리뷰 검사장치
CN107803878B (zh) * 2017-11-28 2023-12-15 江苏华神电子有限公司 用以加工菲林定位孔的ccd钻靶机
JP7575360B2 (ja) 2021-08-20 2024-10-29 ビアメカニクス株式会社 多層プリント配線基板の加工方法
TWI772188B (zh) * 2021-09-24 2022-07-21 健鼎科技股份有限公司 多層電路板的穿孔成形方法、多層電路板製造方法、多層電路板及多層電路板製造系統
CN116100791A (zh) * 2023-02-23 2023-05-12 飞尔德航空器材制造(上海)有限公司 螺栓安装结构航空透明件的热压装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3569548B2 (ja) * 1994-05-25 2004-09-22 セイコープレシジョン株式会社 板状ワークの多軸穴明け装置
JP2873439B2 (ja) * 1995-09-22 1999-03-24 セイコープレシジョン株式会社 プリント基板の穴明け装置及び穴明け方法
JP3248092B2 (ja) * 1996-03-29 2002-01-21 セイコープレシジョン株式会社 プリント基板の方向性判別方法及び穴明け方法及びその装置
JP3011101B2 (ja) * 1996-07-18 2000-02-21 皆見電子工業株式会社 基板の前処理システム

Also Published As

Publication number Publication date
TWI323145B (enrdf_load_stackoverflow) 2010-04-01
CN101083875A (zh) 2007-12-05
TW200810634A (en) 2008-02-16
CN101083875B (zh) 2010-06-02
JP2007319956A (ja) 2007-12-13

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