TWI323145B - - Google Patents
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- Publication number
- TWI323145B TWI323145B TW96108432A TW96108432A TWI323145B TW I323145 B TWI323145 B TW I323145B TW 96108432 A TW96108432 A TW 96108432A TW 96108432 A TW96108432 A TW 96108432A TW I323145 B TWI323145 B TW I323145B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed wiring
- wiring board
- axis moving
- multilayer printed
- perforating
- Prior art date
Links
- 238000004080 punching Methods 0.000 claims description 13
- 238000003384 imaging method Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006150707A JP4210692B2 (ja) | 2006-05-30 | 2006-05-30 | 穿孔装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200810634A TW200810634A (en) | 2008-02-16 |
| TWI323145B true TWI323145B (enrdf_load_stackoverflow) | 2010-04-01 |
Family
ID=38853173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96108432A TW200810634A (en) | 2006-05-30 | 2007-03-12 | Perforating device for printed circuit wiring board and reference perforating method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4210692B2 (enrdf_load_stackoverflow) |
| CN (1) | CN101083875B (enrdf_load_stackoverflow) |
| TW (1) | TW200810634A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642066B (zh) * | 2016-07-12 | 2018-11-21 | 南韓商Ｈｂ技術有限公司 | 具有兩端支臂結構的超高速重複檢測裝置 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343507A (zh) * | 2010-07-30 | 2012-02-08 | 信义汽车玻璃(深圳)有限公司 | 汽车玻璃附件安装定位方法 |
| CN103228107B (zh) * | 2012-01-31 | 2016-03-23 | 王锦燕 | 位置校正装置及使用该位置校正装置的位置校正方法 |
| JP5952052B2 (ja) * | 2012-03-29 | 2016-07-13 | セイコープレシジョン株式会社 | 穴開け装置 |
| JP5952053B2 (ja) * | 2012-03-29 | 2016-07-13 | セイコープレシジョン株式会社 | 穴開け装置 |
| CN103557793A (zh) * | 2013-11-14 | 2014-02-05 | 成都金大立科技有限公司 | 一种pcb孔位、孔径检测系统及检测方法 |
| CN103752882B (zh) * | 2013-12-27 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | 线路板的钻孔方法 |
| TW201605315A (zh) * | 2014-02-21 | 2016-02-01 | 維亞機械股份有限公司 | 背鑽加工方法以及背鑽加工裝置 |
| CN107803878B (zh) * | 2017-11-28 | 2023-12-15 | 江苏华神电子有限公司 | 用以加工菲林定位孔的ccd钻靶机 |
| JP7575360B2 (ja) | 2021-08-20 | 2024-10-29 | ビアメカニクス株式会社 | 多層プリント配線基板の加工方法 |
| TWI772188B (zh) * | 2021-09-24 | 2022-07-21 | 健鼎科技股份有限公司 | 多層電路板的穿孔成形方法、多層電路板製造方法、多層電路板及多層電路板製造系統 |
| CN116100791A (zh) * | 2023-02-23 | 2023-05-12 | 飞尔德航空器材制造(上海)有限公司 | 螺栓安装结构航空透明件的热压装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3569548B2 (ja) * | 1994-05-25 | 2004-09-22 | セイコープレシジョン株式会社 | 板状ワークの多軸穴明け装置 |
| JP2873439B2 (ja) * | 1995-09-22 | 1999-03-24 | セイコープレシジョン株式会社 | プリント基板の穴明け装置及び穴明け方法 |
| JP3248092B2 (ja) * | 1996-03-29 | 2002-01-21 | セイコープレシジョン株式会社 | プリント基板の方向性判別方法及び穴明け方法及びその装置 |
| JP3011101B2 (ja) * | 1996-07-18 | 2000-02-21 | 皆見電子工業株式会社 | 基板の前処理システム |
-
2006
- 2006-05-30 JP JP2006150707A patent/JP4210692B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-12 TW TW96108432A patent/TW200810634A/zh not_active IP Right Cessation
- 2007-05-30 CN CN2007101058457A patent/CN101083875B/zh not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642066B (zh) * | 2016-07-12 | 2018-11-21 | 南韓商Ｈｂ技術有限公司 | 具有兩端支臂結構的超高速重複檢測裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101083875A (zh) | 2007-12-05 |
| TW200810634A (en) | 2008-02-16 |
| JP4210692B2 (ja) | 2009-01-21 |
| CN101083875B (zh) | 2010-06-02 |
| JP2007319956A (ja) | 2007-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |