JP4199781B2 - 不揮発性半導体記憶装置 - Google Patents
不揮発性半導体記憶装置 Download PDFInfo
- Publication number
- JP4199781B2 JP4199781B2 JP2006109909A JP2006109909A JP4199781B2 JP 4199781 B2 JP4199781 B2 JP 4199781B2 JP 2006109909 A JP2006109909 A JP 2006109909A JP 2006109909 A JP2006109909 A JP 2006109909A JP 4199781 B2 JP4199781 B2 JP 4199781B2
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- bit line
- circuit
- memory cell
- nonvolatile semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 230000001629 suppression Effects 0.000 claims description 30
- 239000003990 capacitor Substances 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- -1 chalcogenide compound Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910004121 SrRuO Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005292 diamagnetic effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/12—Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0023—Address circuits or decoders
- G11C13/0026—Bit-line or column circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/18—Bit line organisation; Bit line lay-out
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
- G11C2013/0057—Read done in two steps, e.g. wherein the cell is read twice and one of the two read values serving as a reference value
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/002—Isolation gates, i.e. gates coupling bit lines to the sense amplifier
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/31—Material having complex metal oxide, e.g. perovskite structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/32—Material having simple binary metal oxide structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/34—Material includes an oxide or a nitride
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
Description
IB0L / IB0H = 5
Vbiasc = V2−V1
Vbiasc1 = V2−V1−5ΔVH
Vbiasc2 = V2−V1−ΔVH
Vbiasc2−Vbiasc1=V2−V1−ΔVH−(V2−V1−5ΔVH)
=4ΔVH
VN2 ≒ VNG0 ≒ VPG0
Vbiasc1 = V2+5ΔVH−(V1+5ΔVH) = V2−V1
Vbiasc2 = V2+ΔVH−(V1+ΔVH) = V2−V1
〈1〉上記実施形態では、本発明装置をバンク構造のメモリセルアレイに適用する場合について説明したが、バンク構造ではなく、単体のメモリセルアレイにも当然に適用できる。
11 :ワード線ドライブ回路
12 :ビット線ドライブ回路
13 :センスアンプ
14 :データ出力回路
15 :電流増幅器
16 :VNG記憶回路
17 :電流増幅器
18 :VPG記憶回路
19 :バンク選択トランジスタ
20 :メモリセルアレイ
21 :行デコーダ
22 :列デコーダ
23 :アドレス回路
24 :制御回路
30 :行読み出し電圧供給回路
31 :電圧抑制回路
32 :NMOS
33 :インバータ
34 :PMOS
35 :ダイオード接続トランジスタ
36 :インバータ
40 :列読み出し電圧供給回路
41 :電圧抑制回路
42 :PMOS
43 :CMOS転送ゲート
44 :CMOS転送ゲート
45 :NMOS
46 :NMOS
47 :列選択回路
48 :検出回路
C1 :キャパシタ
C2 :キャパシタ
GBL:グローバルビット線
GWL:グローバルワード線
Claims (7)
- 電気抵抗の変化により情報を記憶する可変抵抗素子を備えてなる2端子構造のメモリセルを行方向及び列方向に夫々複数配列し、行方向に延伸する複数のワード線と列方向に延伸する複数のビット線を備え、同一行の前記メモリセルの夫々が、前記メモリセルの一端側を同じ前記ワード線に接続し、同一列の前記メモリセルの夫々が、前記メモリセルの他端側を同じ前記ビット線に接続してなるメモリセルアレイを備え、第1電圧を読み出し対象の選択メモリセルに接続する選択ビット線に印加し、第2電圧を前記選択ビット線以外の非選択ビット線と前記ワード線に印加し、前記選択メモリセルにかかる電圧差に基づいて前記選択メモリセルに流れる電流を前記選択メモリセルに接続する選択ワード線側から読み出す不揮発性半導体記憶装置において、
前記第2電圧を供給する回路に、前記ワード線及び前記ビット線の各別に前記第2電圧の変動を抑制する電圧抑制回路が設けられ、
前記選択メモリセルを流れる電流を検出する読み出し期間の前に設定されたプリセット期間中に、前記選択ビット線に所定の電圧を印加し、前記非選択ビット線と前記ワード線に前記プリセット期間用の第2電圧を印加し、前記メモリセルアレイに記憶されたデータパターンに依存して前記選択ビット線の電圧が変動するのを検出し、検出した前記変動の方向に前記第2電圧が変動するように、前記電圧抑制回路を前記読み出し期間において制御する第2電圧制御回路を備えることを特徴とする不揮発性半導体記憶装置。 - 前記第2電圧制御回路が、前記メモリセルアレイに記憶されたデータパターンに依存して変動する前記選択ビット線の電圧の変動幅を検出する検出回路を備えていることを特徴とする請求項1に記載の不揮発性半導体記憶装置。
- 前記第2電圧制御回路が、前記検出回路によって前記プリセット期間中に検出された前記変動幅を保存する記憶回路を備え、前記記憶回路に保存された変動幅に基づいて前記電圧抑制回路を制御することを特徴とする請求項2に記載の不揮発性半導体記憶装置。
- 前記記憶回路が、前記変動幅に応じた電圧レベルを保持する前記キャパシタを備えてなることを特徴とする請求項3に記載の不揮発性半導体記憶装置。
- 前記電圧レベルが前記選択ビット線の電圧の変動方向とは逆方向に変化することを特徴とする請求項4に記載の不揮発性半導体記憶装置。
- 前記第2電圧制御回路が、前記電圧レベルを電流増幅して出力する電流増幅器を備えて構成されることを特徴とする請求項4または5に記載の不揮発性半導体記憶装置。
- 前記電圧抑制回路は、一方端が前記ビット線に接続され他方端が前記第2電圧の供給側に接続されたMOSトランジスタと、入力側が前記ビット線に接続され出力側が前記MOSトランジスタのゲートに接続されたインバータ回路からなり、前記キャパシタに保持された電圧レベルに応じて前記インバータ回路の反転レベルを制御することを特徴とする請求項4〜6の何れか1項に記載の不揮発性半導体記憶装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006109909A JP4199781B2 (ja) | 2006-04-12 | 2006-04-12 | 不揮発性半導体記憶装置 |
US11/730,675 US7606086B2 (en) | 2006-04-12 | 2007-04-03 | Nonvolatile semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006109909A JP4199781B2 (ja) | 2006-04-12 | 2006-04-12 | 不揮発性半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007287192A JP2007287192A (ja) | 2007-11-01 |
JP4199781B2 true JP4199781B2 (ja) | 2008-12-17 |
Family
ID=38604701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006109909A Active JP4199781B2 (ja) | 2006-04-12 | 2006-04-12 | 不揮発性半導体記憶装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7606086B2 (ja) |
JP (1) | JP4199781B2 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7884349B2 (en) * | 2002-08-02 | 2011-02-08 | Unity Semiconductor Corporation | Selection device for re-writable memory |
US8031509B2 (en) * | 2008-12-19 | 2011-10-04 | Unity Semiconductor Corporation | Conductive metal oxide structures in non-volatile re-writable memory devices |
US8314024B2 (en) | 2008-12-19 | 2012-11-20 | Unity Semiconductor Corporation | Device fabrication |
US20130082232A1 (en) | 2011-09-30 | 2013-04-04 | Unity Semiconductor Corporation | Multi Layered Conductive Metal Oxide Structures And Methods For Facilitating Enhanced Performance Characteristics Of Two Terminal Memory Cells |
US7995371B2 (en) * | 2007-07-26 | 2011-08-09 | Unity Semiconductor Corporation | Threshold device for a memory array |
JP5100292B2 (ja) | 2007-10-05 | 2012-12-19 | 株式会社東芝 | 抵抗変化メモリ装置 |
US7813157B2 (en) * | 2007-10-29 | 2010-10-12 | Contour Semiconductor, Inc. | Non-linear conductor memory |
US8208284B2 (en) * | 2008-03-07 | 2012-06-26 | Unity Semiconductor Corporation | Data retention structure for non-volatile memory |
US8027215B2 (en) | 2008-12-19 | 2011-09-27 | Unity Semiconductor Corporation | Array operation using a schottky diode as a non-ohmic isolation device |
JP4856202B2 (ja) * | 2009-03-12 | 2012-01-18 | 株式会社東芝 | 半導体記憶装置 |
JP4774109B2 (ja) * | 2009-03-13 | 2011-09-14 | シャープ株式会社 | 不揮発性可変抵抗素子のフォーミング処理の制御回路、並びにフォーミング処理の制御方法 |
JP4806046B2 (ja) | 2009-03-16 | 2011-11-02 | 株式会社東芝 | 半導体記憶装置 |
WO2011045886A1 (ja) * | 2009-10-15 | 2011-04-21 | パナソニック株式会社 | 抵抗変化型不揮発性記憶装置 |
US8045364B2 (en) * | 2009-12-18 | 2011-10-25 | Unity Semiconductor Corporation | Non-volatile memory device ion barrier |
JP2011204302A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 半導体記憶装置 |
CN102473458B (zh) * | 2010-06-03 | 2014-11-05 | 松下电器产业株式会社 | 交叉点型电阻变化非易失性存储装置 |
JP2012018718A (ja) * | 2010-07-07 | 2012-01-26 | Toshiba Corp | 半導体記憶装置 |
JP5214693B2 (ja) * | 2010-09-21 | 2013-06-19 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JP2012069216A (ja) * | 2010-09-24 | 2012-04-05 | Toshiba Corp | 不揮発性半導体記憶装置 |
JP5380510B2 (ja) * | 2011-09-30 | 2014-01-08 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JP2014078302A (ja) | 2012-10-11 | 2014-05-01 | Panasonic Corp | クロスポイント型抵抗変化不揮発性記憶装置及びクロスポイント型抵抗変化不揮発性記憶装置の読み出し方法 |
KR102136846B1 (ko) | 2014-09-29 | 2020-07-22 | 삼성전자 주식회사 | 저항성 메모리 장치 및 저항성 메모리 장치의 동작 방법 |
US9633710B2 (en) * | 2015-01-23 | 2017-04-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for operating semiconductor device |
KR20160107566A (ko) * | 2015-03-04 | 2016-09-19 | 에스케이하이닉스 주식회사 | 저항변화 메모리 장치 및 그 동작 방법 |
CN105895152B (zh) * | 2016-04-01 | 2019-05-21 | 北京大学 | 一种基于单相导通存储单元的存储阵列读取方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6259644B1 (en) | 1997-11-20 | 2001-07-10 | Hewlett-Packard Co | Equipotential sense methods for resistive cross point memory cell arrays |
US6836422B1 (en) * | 2003-07-07 | 2004-12-28 | Hewlett-Packard Development Company, L.P. | System and method for reading a memory cell |
US6970387B2 (en) | 2003-09-15 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | System and method for determining the value of a memory element |
EP1560221B1 (en) * | 2004-01-29 | 2008-09-03 | Sharp Kabushiki Kaisha | Semiconductor memory device |
US7042757B2 (en) | 2004-03-04 | 2006-05-09 | Hewlett-Packard Development Company, L.P. | 1R1D MRAM block architecture |
JP4153901B2 (ja) * | 2004-06-15 | 2008-09-24 | シャープ株式会社 | 半導体記憶装置 |
JP4295680B2 (ja) | 2004-06-15 | 2009-07-15 | シャープ株式会社 | 半導体記憶装置 |
-
2006
- 2006-04-12 JP JP2006109909A patent/JP4199781B2/ja active Active
-
2007
- 2007-04-03 US US11/730,675 patent/US7606086B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7606086B2 (en) | 2009-10-20 |
US20070242528A1 (en) | 2007-10-18 |
JP2007287192A (ja) | 2007-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4199781B2 (ja) | 不揮発性半導体記憶装置 | |
KR100843144B1 (ko) | 저항체를 이용한 비휘발성 메모리 장치 및 그 구동 방법 | |
US7668001B2 (en) | Semiconductor memory device | |
JP4625510B2 (ja) | 半導体記憶装置 | |
KR101517675B1 (ko) | 자기저항 랜덤 액세스 메모리에서 비트 라인 및 소스 라인 저항들의 밸런스 조절 | |
US8654595B2 (en) | Nonvolatile memory device with a clamping voltage generation circuit for compensating the variations in memory cell parameters | |
US10269404B2 (en) | Resistance change memory | |
US7933148B2 (en) | Memory | |
US9312000B1 (en) | Semiconductor apparatus | |
WO2011045886A1 (ja) | 抵抗変化型不揮発性記憶装置 | |
JP2010067332A (ja) | 相補型相変化メモリセル及びメモリ回路 | |
US7184296B2 (en) | Memory device | |
JP4177818B2 (ja) | 半導体記憶装置 | |
US7535781B2 (en) | Semiconductor memory | |
US8134858B2 (en) | Semiconductor device for supplying stable voltage to control electrode of transistor | |
TWI828276B (zh) | 記憶體裝置及降低記憶體裝置的操作電壓的方法 | |
JP2011023046A (ja) | 抵抗変化型メモリデバイス | |
KR101010175B1 (ko) | 센스앰프 및 그 센스앰프를 이용한 불휘발성 상 변환메모리 장치 | |
US9472276B1 (en) | Semiconductor apparatus for reading stored information of a resistor or cell | |
JP2006294182A (ja) | 不揮発性半導体記憶装置 | |
KR100583114B1 (ko) | 하이브리드 스위치 셀 및 이를 이용한 메모리 장치 | |
KR100924206B1 (ko) | 상 변화 메모리 장치 | |
KR100672170B1 (ko) | 비트 라인 프리차지 전압 발생회로를 구비한 반도체 메모리소자 및 그 비트라인 프리차지 방법 | |
JP4762720B2 (ja) | 磁気半導体記憶装置の読出し回路 | |
JP2023038600A (ja) | センス回路、センス方法及び抵抗変化型メモリ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080523 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080610 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080909 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081003 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111010 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4199781 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121010 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131010 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131010 Year of fee payment: 5 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131010 Year of fee payment: 5 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131010 Year of fee payment: 5 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |