JP4167599B2 - 硬化性樹脂及びそれを含有する硬化性樹脂組成物 - Google Patents
硬化性樹脂及びそれを含有する硬化性樹脂組成物 Download PDFInfo
- Publication number
- JP4167599B2 JP4167599B2 JP2003569704A JP2003569704A JP4167599B2 JP 4167599 B2 JP4167599 B2 JP 4167599B2 JP 2003569704 A JP2003569704 A JP 2003569704A JP 2003569704 A JP2003569704 A JP 2003569704A JP 4167599 B2 JP4167599 B2 JP 4167599B2
- Authority
- JP
- Japan
- Prior art keywords
- curable resin
- acid
- compound
- group
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002041508 | 2002-02-19 | ||
JP2002041523 | 2002-02-19 | ||
JP2002041523 | 2002-02-19 | ||
JP2002041508 | 2002-02-19 | ||
PCT/JP2003/001495 WO2003070800A1 (fr) | 2002-02-19 | 2003-02-13 | Resine durcissable et composition contenant la resine durcissable |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2003070800A1 JPWO2003070800A1 (ja) | 2005-06-09 |
JP4167599B2 true JP4167599B2 (ja) | 2008-10-15 |
Family
ID=27759638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003569704A Expired - Lifetime JP4167599B2 (ja) | 2002-02-19 | 2003-02-13 | 硬化性樹脂及びそれを含有する硬化性樹脂組成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4167599B2 (fr) |
AU (1) | AU2003211957A1 (fr) |
TW (1) | TW200304451A (fr) |
WO (1) | WO2003070800A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5237692B2 (ja) * | 2008-05-21 | 2013-07-17 | 昭和電工株式会社 | モノマー、ポリマー、感光性樹脂組成物及びレジストパターンの形成方法 |
JP5382846B2 (ja) * | 2008-06-10 | 2014-01-08 | 日本化薬株式会社 | 感光性化合物、それを含む組成物及びその硬化物 |
CN104470962B (zh) * | 2012-07-13 | 2017-09-12 | 日本化药株式会社 | 碱显影型树脂、使用该树脂的感光性树脂组合物 |
JP6717566B2 (ja) * | 2015-04-08 | 2020-07-01 | 昭和電工株式会社 | 感光性樹脂、感光性樹脂組成物、硬化物及びカラーフィルター |
JP6986340B2 (ja) * | 2016-08-29 | 2021-12-22 | 株式会社タムラ製作所 | プリント配線板及びプリント配線板の製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS3916276B1 (fr) * | 1962-10-09 | 1964-08-10 | ||
CA1015490A (en) * | 1973-08-28 | 1977-08-09 | Uniroyal Ltd. | Chemically resistant thermosetting polymers based on acrylate esters of modified phenolic resins |
JPS56123939A (en) * | 1980-03-06 | 1981-09-29 | Mitsubishi Petrochem Co Ltd | Novel (meth)acrylic acid ester |
JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
JPS63289014A (ja) * | 1987-05-21 | 1988-11-25 | Tamura Kaken Kk | 感光性皮膜組成物 |
JPH0192281A (ja) * | 1987-10-02 | 1989-04-11 | Mitsubishi Paper Mills Ltd | 平版印刷用インキ添加物 |
JPH026517A (ja) * | 1988-06-24 | 1990-01-10 | Toagosei Chem Ind Co Ltd | ポリエステル(メタ)アクリレートの製造方法 |
JPH07103213B2 (ja) * | 1988-10-04 | 1995-11-08 | 日本化薬株式会社 | 不飽和基含有ポリカルボン酸樹脂を含む樹脂組成物及びソルダーレジスト樹脂組成物 |
JPH04136018A (ja) * | 1990-09-28 | 1992-05-11 | Sumitomo Durez Co Ltd | 光硬化性樹脂組成物 |
JPH1090887A (ja) * | 1996-09-13 | 1998-04-10 | Nippon Steel Chem Co Ltd | 感光性樹脂組成物 |
JP4344894B2 (ja) * | 1999-05-28 | 2009-10-14 | 三菱瓦斯化学株式会社 | エポキシアクリレート化合物 |
JP4889850B2 (ja) * | 2000-10-31 | 2012-03-07 | 昭和電工株式会社 | 硬化性樹脂、感光性樹脂組成物及び硬化塗膜の形成方法 |
JP2003076009A (ja) * | 2001-08-27 | 2003-03-14 | Nan Ya Plast Corp | 感光性熱硬化性樹脂組成物 |
-
2003
- 2003-02-13 AU AU2003211957A patent/AU2003211957A1/en not_active Abandoned
- 2003-02-13 WO PCT/JP2003/001495 patent/WO2003070800A1/fr active Application Filing
- 2003-02-13 JP JP2003569704A patent/JP4167599B2/ja not_active Expired - Lifetime
- 2003-02-18 TW TW92103333A patent/TW200304451A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW200304451A (en) | 2003-10-01 |
AU2003211957A1 (en) | 2003-09-09 |
WO2003070800A1 (fr) | 2003-08-28 |
JPWO2003070800A1 (ja) | 2005-06-09 |
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