JP4167599B2 - 硬化性樹脂及びそれを含有する硬化性樹脂組成物 - Google Patents

硬化性樹脂及びそれを含有する硬化性樹脂組成物 Download PDF

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Publication number
JP4167599B2
JP4167599B2 JP2003569704A JP2003569704A JP4167599B2 JP 4167599 B2 JP4167599 B2 JP 4167599B2 JP 2003569704 A JP2003569704 A JP 2003569704A JP 2003569704 A JP2003569704 A JP 2003569704A JP 4167599 B2 JP4167599 B2 JP 4167599B2
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Japan
Prior art keywords
curable resin
acid
compound
group
parts
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English (en)
Japanese (ja)
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JPWO2003070800A1 (ja
Inventor
登 小檜山
滋 宇敷
里志 小澤
裕一 釜萢
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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Publication of JPWO2003070800A1 publication Critical patent/JPWO2003070800A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
JP2003569704A 2002-02-19 2003-02-13 硬化性樹脂及びそれを含有する硬化性樹脂組成物 Expired - Lifetime JP4167599B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002041508 2002-02-19
JP2002041523 2002-02-19
JP2002041523 2002-02-19
JP2002041508 2002-02-19
PCT/JP2003/001495 WO2003070800A1 (fr) 2002-02-19 2003-02-13 Resine durcissable et composition contenant la resine durcissable

Publications (2)

Publication Number Publication Date
JPWO2003070800A1 JPWO2003070800A1 (ja) 2005-06-09
JP4167599B2 true JP4167599B2 (ja) 2008-10-15

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ID=27759638

Family Applications (1)

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JP2003569704A Expired - Lifetime JP4167599B2 (ja) 2002-02-19 2003-02-13 硬化性樹脂及びそれを含有する硬化性樹脂組成物

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Country Link
JP (1) JP4167599B2 (fr)
AU (1) AU2003211957A1 (fr)
TW (1) TW200304451A (fr)
WO (1) WO2003070800A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5237692B2 (ja) * 2008-05-21 2013-07-17 昭和電工株式会社 モノマー、ポリマー、感光性樹脂組成物及びレジストパターンの形成方法
JP5382846B2 (ja) * 2008-06-10 2014-01-08 日本化薬株式会社 感光性化合物、それを含む組成物及びその硬化物
CN104470962B (zh) * 2012-07-13 2017-09-12 日本化药株式会社 碱显影型树脂、使用该树脂的感光性树脂组合物
JP6717566B2 (ja) * 2015-04-08 2020-07-01 昭和電工株式会社 感光性樹脂、感光性樹脂組成物、硬化物及びカラーフィルター
JP6986340B2 (ja) * 2016-08-29 2021-12-22 株式会社タムラ製作所 プリント配線板及びプリント配線板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3916276B1 (fr) * 1962-10-09 1964-08-10
CA1015490A (en) * 1973-08-28 1977-08-09 Uniroyal Ltd. Chemically resistant thermosetting polymers based on acrylate esters of modified phenolic resins
JPS56123939A (en) * 1980-03-06 1981-09-29 Mitsubishi Petrochem Co Ltd Novel (meth)acrylic acid ester
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS63289014A (ja) * 1987-05-21 1988-11-25 Tamura Kaken Kk 感光性皮膜組成物
JPH0192281A (ja) * 1987-10-02 1989-04-11 Mitsubishi Paper Mills Ltd 平版印刷用インキ添加物
JPH026517A (ja) * 1988-06-24 1990-01-10 Toagosei Chem Ind Co Ltd ポリエステル（メタ）アクリレートの製造方法
JPH07103213B2 (ja) * 1988-10-04 1995-11-08 日本化薬株式会社 不飽和基含有ポリカルボン酸樹脂を含む樹脂組成物及びソルダーレジスト樹脂組成物
JPH04136018A (ja) * 1990-09-28 1992-05-11 Sumitomo Durez Co Ltd 光硬化性樹脂組成物
JPH1090887A (ja) * 1996-09-13 1998-04-10 Nippon Steel Chem Co Ltd 感光性樹脂組成物
JP4344894B2 (ja) * 1999-05-28 2009-10-14 三菱瓦斯化学株式会社 エポキシアクリレート化合物
JP4889850B2 (ja) * 2000-10-31 2012-03-07 昭和電工株式会社 硬化性樹脂、感光性樹脂組成物及び硬化塗膜の形成方法
JP2003076009A (ja) * 2001-08-27 2003-03-14 Nan Ya Plast Corp 感光性熱硬化性樹脂組成物

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Publication number Publication date
TW200304451A (en) 2003-10-01
AU2003211957A1 (en) 2003-09-09
WO2003070800A1 (fr) 2003-08-28
JPWO2003070800A1 (ja) 2005-06-09

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