AU2003211957A1 - Curable resin and curable resin composition containing the same - Google Patents

Curable resin and curable resin composition containing the same

Info

Publication number
AU2003211957A1
AU2003211957A1 AU2003211957A AU2003211957A AU2003211957A1 AU 2003211957 A1 AU2003211957 A1 AU 2003211957A1 AU 2003211957 A AU2003211957 A AU 2003211957A AU 2003211957 A AU2003211957 A AU 2003211957A AU 2003211957 A1 AU2003211957 A1 AU 2003211957A1
Authority
AU
Australia
Prior art keywords
curable resin
same
composition containing
resin composition
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003211957A
Other languages
English (en)
Inventor
Yuichi Kamayachi
Noboru Kohiyama
Satoshi Ozawa
Shigeru Ushiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of AU2003211957A1 publication Critical patent/AU2003211957A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
AU2003211957A 2002-02-19 2003-02-13 Curable resin and curable resin composition containing the same Abandoned AU2003211957A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002-41508 2002-02-19
JP2002041508 2002-02-19
JP2002041523 2002-02-19
JP2002-41523 2002-02-19
PCT/JP2003/001495 WO2003070800A1 (fr) 2002-02-19 2003-02-13 Resine durcissable et composition contenant la resine durcissable

Publications (1)

Publication Number Publication Date
AU2003211957A1 true AU2003211957A1 (en) 2003-09-09

Family

ID=27759638

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003211957A Abandoned AU2003211957A1 (en) 2002-02-19 2003-02-13 Curable resin and curable resin composition containing the same

Country Status (4)

Country Link
JP (1) JP4167599B2 (fr)
AU (1) AU2003211957A1 (fr)
TW (1) TW200304451A (fr)
WO (1) WO2003070800A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5237692B2 (ja) * 2008-05-21 2013-07-17 昭和電工株式会社 モノマー、ポリマー、感光性樹脂組成物及びレジストパターンの形成方法
JP5382846B2 (ja) * 2008-06-10 2014-01-08 日本化薬株式会社 感光性化合物、それを含む組成物及びその硬化物
CN104470962B (zh) * 2012-07-13 2017-09-12 日本化药株式会社 碱显影型树脂、使用该树脂的感光性树脂组合物
JP6717566B2 (ja) * 2015-04-08 2020-07-01 昭和電工株式会社 感光性樹脂、感光性樹脂組成物、硬化物及びカラーフィルター
JP6986340B2 (ja) * 2016-08-29 2021-12-22 株式会社タムラ製作所 プリント配線板及びプリント配線板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3916276B1 (fr) * 1962-10-09 1964-08-10
CA1015490A (en) * 1973-08-28 1977-08-09 Uniroyal Ltd. Chemically resistant thermosetting polymers based on acrylate esters of modified phenolic resins
JPS56123939A (en) * 1980-03-06 1981-09-29 Mitsubishi Petrochem Co Ltd Novel (meth)acrylic acid ester
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS63289014A (ja) * 1987-05-21 1988-11-25 Tamura Kaken Kk 感光性皮膜組成物
JPH0192281A (ja) * 1987-10-02 1989-04-11 Mitsubishi Paper Mills Ltd 平版印刷用インキ添加物
JPH026517A (ja) * 1988-06-24 1990-01-10 Toagosei Chem Ind Co Ltd ポリエステル（メタ）アクリレートの製造方法
JPH07103213B2 (ja) * 1988-10-04 1995-11-08 日本化薬株式会社 不飽和基含有ポリカルボン酸樹脂を含む樹脂組成物及びソルダーレジスト樹脂組成物
JPH04136018A (ja) * 1990-09-28 1992-05-11 Sumitomo Durez Co Ltd 光硬化性樹脂組成物
JPH1090887A (ja) * 1996-09-13 1998-04-10 Nippon Steel Chem Co Ltd 感光性樹脂組成物
JP4344894B2 (ja) * 1999-05-28 2009-10-14 三菱瓦斯化学株式会社 エポキシアクリレート化合物
JP4889850B2 (ja) * 2000-10-31 2012-03-07 昭和電工株式会社 硬化性樹脂、感光性樹脂組成物及び硬化塗膜の形成方法
JP2003076009A (ja) * 2001-08-27 2003-03-14 Nan Ya Plast Corp 感光性熱硬化性樹脂組成物

Also Published As

Publication number Publication date
TW200304451A (en) 2003-10-01
WO2003070800A1 (fr) 2003-08-28
JP4167599B2 (ja) 2008-10-15
JPWO2003070800A1 (ja) 2005-06-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase