AU2003213432A1 - Photosensitive resin composition and use thereof - Google Patents

Photosensitive resin composition and use thereof

Info

Publication number
AU2003213432A1
AU2003213432A1 AU2003213432A AU2003213432A AU2003213432A1 AU 2003213432 A1 AU2003213432 A1 AU 2003213432A1 AU 2003213432 A AU2003213432 A AU 2003213432A AU 2003213432 A AU2003213432 A AU 2003213432A AU 2003213432 A1 AU2003213432 A1 AU 2003213432A1
Authority
AU
Australia
Prior art keywords
resin composition
photosensitive resin
photosensitive
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003213432A
Inventor
Hideki Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp, Asahi Chemical Industry Co Ltd filed Critical Asahi Kasei Corp
Publication of AU2003213432A1 publication Critical patent/AU2003213432A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
AU2003213432A 2002-03-12 2003-03-10 Photosensitive resin composition and use thereof Abandoned AU2003213432A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002067116 2002-03-12
JP2002/67116 2002-03-12
PCT/JP2003/002800 WO2003077035A1 (en) 2002-03-12 2003-03-10 Photosensitive resin composition and use thereof

Publications (1)

Publication Number Publication Date
AU2003213432A1 true AU2003213432A1 (en) 2003-09-22

Family

ID=27800273

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003213432A Abandoned AU2003213432A1 (en) 2002-03-12 2003-03-10 Photosensitive resin composition and use thereof

Country Status (4)

Country Link
JP (1) JP3883540B2 (en)
CN (1) CN1310088C (en)
AU (1) AU2003213432A1 (en)
WO (1) WO2003077035A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100434948C (en) * 2004-11-16 2008-11-19 奇美实业股份有限公司 Photosensitive resin composition for colour filter
CN101401036B (en) * 2006-03-14 2011-12-07 旭化成电子材料株式会社 Photosensitive-resin layered product
CN102754032B (en) * 2010-03-19 2015-07-15 日立化成株式会社 Photosensitive resin composition and photosensitive element using same, resist pattern formation method and printed circuit board manufacturing method
CN103282829B (en) * 2010-12-24 2016-08-17 旭化成株式会社 Photosensitive polymer combination
JP6512532B2 (en) * 2015-06-05 2019-05-15 日油株式会社 Photosensitive resin composition for urethane (meth) acrylate and dry film resist
JP6567952B2 (en) * 2015-10-26 2019-08-28 旭化成株式会社 Photosensitive resin composition, photosensitive resin laminate, and resist pattern forming method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539286A (en) * 1983-06-06 1985-09-03 Dynachem Corporation Flexible, fast processing, photopolymerizable composition
JP2548016B2 (en) * 1986-09-09 1996-10-30 旭化成工業株式会社 Photopolymerizable laminate
JP3267703B2 (en) * 1992-11-19 2002-03-25 旭化成株式会社 New photopolymerizable resin laminate
JP2000214583A (en) * 1999-01-22 2000-08-04 Hitachi Chem Co Ltd Photosensitive resin composition, and photosensitive element using same and manufacture of resist pattern and printed circuit board
AU2824900A (en) * 1999-03-03 2000-09-21 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
JP2001142201A (en) * 1999-11-17 2001-05-25 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element using same and method for producing color filter
JP4475730B2 (en) * 2000-04-06 2010-06-09 ニチゴー・モートン株式会社 Photosensitive resin composition and photosensitive film using the same
JP4716347B2 (en) * 2001-04-05 2011-07-06 旭化成イーマテリアルズ株式会社 Dry film resist

Also Published As

Publication number Publication date
JP3883540B2 (en) 2007-02-21
CN1643451A (en) 2005-07-20
JPWO2003077035A1 (en) 2005-07-07
CN1310088C (en) 2007-04-11
WO2003077035A1 (en) 2003-09-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase