CN1310088C - Photosensitive resin composition and use thereof - Google Patents
Photosensitive resin composition and use thereof Download PDFInfo
- Publication number
- CN1310088C CN1310088C CNB038057654A CN03805765A CN1310088C CN 1310088 C CN1310088 C CN 1310088C CN B038057654 A CNB038057654 A CN B038057654A CN 03805765 A CN03805765 A CN 03805765A CN 1310088 C CN1310088 C CN 1310088C
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- China
- Prior art keywords
- weight
- methyl
- photosensitive
- formula
- integer
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- Expired - Lifetime
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- 239000011342 resin composition Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 24
- 239000000178 monomer Substances 0.000 claims abstract description 22
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 238000003475 lamination Methods 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 239000000975 dye Substances 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 238000000016 photochemical curing Methods 0.000 claims description 7
- 239000005977 Ethylene Substances 0.000 claims description 6
- 238000012644 addition polymerization Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 235000003642 hunger Nutrition 0.000 claims 1
- -1 2-(o-chlorophenyl)-4,5-diphenylimidazolyl Chemical class 0.000 abstract description 41
- 230000035945 sensitivity Effects 0.000 abstract description 10
- NNBFNNNWANBMTI-UHFFFAOYSA-M brilliant green Chemical compound OS([O-])(=O)=O.C1=CC(N(CC)CC)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](CC)CC)C=C1 NNBFNNNWANBMTI-UHFFFAOYSA-M 0.000 abstract description 8
- 239000000539 dimer Substances 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000003999 initiator Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 21
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- 238000011161 development Methods 0.000 description 13
- 230000018109 developmental process Effects 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 10
- 239000002585 base Substances 0.000 description 9
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000004040 coloring Methods 0.000 description 8
- 229920001451 polypropylene glycol Polymers 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 229960004194 lidocaine Drugs 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- MZGMQAMKOBOIDR-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCCOCCOCCO MZGMQAMKOBOIDR-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 241000692870 Inachis io Species 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- NNJVILVZKWQKPM-UHFFFAOYSA-N Lidocaine Chemical compound CCN(CC)CC(=O)NC1=C(C)C=CC=C1C NNJVILVZKWQKPM-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 230000001066 destructive effect Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- GILMNGUTRWPWSY-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(O)COC(=O)C=C GILMNGUTRWPWSY-UHFFFAOYSA-N 0.000 description 2
- RWBSUKLDWBBECA-UHFFFAOYSA-N 3-(aminomethyl)-N,N,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C(CN)=C1 RWBSUKLDWBBECA-UHFFFAOYSA-N 0.000 description 2
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- CSCGRSSBEBRMOA-UHFFFAOYSA-N ClOC1=C(C=CC=C1)C=1NC(=C(N1)C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound ClOC1=C(C=CC=C1)C=1NC(=C(N1)C1=CC=CC=C1)C1=CC=CC=C1 CSCGRSSBEBRMOA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- NKKMVIVFRUYPLQ-UHFFFAOYSA-N but-2-enenitrile Chemical group CC=CC#N NKKMVIVFRUYPLQ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- RNQBLUNNAYFBIW-NPULLEENSA-M hexadecyl(trimethyl)azanium (2S)-2-(6-methoxynaphthalen-2-yl)propanoate Chemical compound COc1ccc2cc(ccc2c1)[C@H](C)C([O-])=O.CCCCCCCCCCCCCCCC[N+](C)(C)C RNQBLUNNAYFBIW-NPULLEENSA-M 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000151 polyglycol Polymers 0.000 description 2
- 239000010695 polyglycol Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- NHOWDZOIZKMVAI-UHFFFAOYSA-N (2-chlorophenyl)(4-chlorophenyl)pyrimidin-5-ylmethanol Chemical compound C=1N=CN=CC=1C(C=1C(=CC=CC=1)Cl)(O)C1=CC=C(Cl)C=C1 NHOWDZOIZKMVAI-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- OTKCEEWUXHVZQI-UHFFFAOYSA-N 1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)CC1=CC=CC=C1 OTKCEEWUXHVZQI-UHFFFAOYSA-N 0.000 description 1
- YXZFFTJAHVMMLF-UHFFFAOYSA-N 1-bromo-3-methylbutane Chemical compound CC(C)CCBr YXZFFTJAHVMMLF-UHFFFAOYSA-N 0.000 description 1
- YZWKKMVJZFACSU-UHFFFAOYSA-N 1-bromopentane Chemical compound CCCCCBr YZWKKMVJZFACSU-UHFFFAOYSA-N 0.000 description 1
- FEWDXGMBVQULLN-UHFFFAOYSA-N 1-hydroxy-2-phenyl-1,5,6,7-tetrahydro-4H-benzimidazol-4-one Chemical compound ON1C=2CCCC(=O)C=2N=C1C1=CC=CC=C1 FEWDXGMBVQULLN-UHFFFAOYSA-N 0.000 description 1
- BTUGGGLMQBJCBN-UHFFFAOYSA-N 1-iodo-2-methylpropane Chemical compound CC(C)CI BTUGGGLMQBJCBN-UHFFFAOYSA-N 0.000 description 1
- BLXSFCHWMBESKV-UHFFFAOYSA-N 1-iodopentane Chemical compound CCCCCI BLXSFCHWMBESKV-UHFFFAOYSA-N 0.000 description 1
- UPQQXPKAYZYUKO-UHFFFAOYSA-N 2,2,2-trichloroacetamide Chemical compound OC(=N)C(Cl)(Cl)Cl UPQQXPKAYZYUKO-UHFFFAOYSA-N 0.000 description 1
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical class C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JECYNCQXXKQDJN-UHFFFAOYSA-N 2-(2-methylhexan-2-yloxymethyl)oxirane Chemical compound CCCCC(C)(C)OCC1CO1 JECYNCQXXKQDJN-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- CRBAESRLGGRIKR-UHFFFAOYSA-N 2-(hydroxymethyl)-2-pentan-2-ylpropane-1,3-diol Chemical compound CCCC(C)C(CO)(CO)CO CRBAESRLGGRIKR-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- YCMLQMDWSXFTIF-UHFFFAOYSA-N 2-methylbenzenesulfonimidic acid Chemical compound CC1=CC=CC=C1S(N)(=O)=O YCMLQMDWSXFTIF-UHFFFAOYSA-N 0.000 description 1
- RVYBHNVKBNBMLE-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2-diol Chemical class CC(O)CO.CC(=C)C(O)=O RVYBHNVKBNBMLE-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- MTJGVAJYTOXFJH-UHFFFAOYSA-N 3-aminonaphthalene-1,5-disulfonic acid Chemical compound C1=CC=C(S(O)(=O)=O)C2=CC(N)=CC(S(O)(=O)=O)=C21 MTJGVAJYTOXFJH-UHFFFAOYSA-N 0.000 description 1
- USEGQJLHQSTGHW-UHFFFAOYSA-N 3-bromo-2-methylprop-1-ene Chemical group CC(=C)CBr USEGQJLHQSTGHW-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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Abstract
A photosensitive resin composition which has high sensitivity while retaining properties such as suitability for tinting, resistance to plating, and removability; and a layered product. The photosensitive resin composition comprises (a) a carboxylated thermoplastic polymer, (b) an ethylenic addition-polymerizable monomer having a specific structure, (c) a photopolymerization initiator comprising a 2-(o-chlorophenyl)-4,5-diphenylimidazolyl dimer, and (d) a dye comprising Diamond Green. A layer of the composition is formed on a support layer. Also provided are a method of forming a resist pattern with the layered photosensitive-resin product and a process for producing a printed wiring board, lead frame, or semiconductor package.
Description
Technical field
The present invention relates to photosensitive polymer combination and layered product, use its formation method of corrosion-resisting pattern and the manufacture method of printing distributing board, lead frame or semiconductor packages.
Background technology
In e-machines such as word processor or portable machine, use as the actual installation of part or semiconductor etc., use printing distributing board always.
As the resist that these printing distributing boards etc. manufacturing is used, used the so-called dry film photoresist (hereinafter to be referred as DFR) that constitutes by support and photo-sensitive resin and protective seam in the past.DFR is usually by being laminated to photo-sensitive resin on the support, then lamination protective seam and preparing on this photo-sensitive resin.As photo-sensitive resin used herein, be generally now and use the photo-sensitive resin of weak base aqueous solution as the alkali-developable of developer solution.
As this photo-sensitive resin, use usually and contain the thermoplastic polymer with carboxyl, the addition polymerization monomer that contains at least one terminal ethylene type unsaturated group and the composition of Photoepolymerizationinitiater initiater.
When using this DFR to make printing distributing board, at first protective seam is peeled off, used laminating machine etc. that DFR is laminated to permanent circuit such as copper plate pressing plate or flexible substrate then and make, expose by Wiring pattern mask etc. of on the substrate.Secondly, peel off support as required,, or decompose and remove, on substrate, form corrosion-resisting pattern with the photo-sensitive resin dissolving of developer solution with unexposed portion.
After corrosion-resisting pattern formed, the method that forms circuit roughly was divided into two methods.First method is that the copper face etching of the copper plate pressing plate that will do not covered by corrosion-resisting pattern etc. is removed, and uses the alkaline aqueous solution stronger than developer solution that corrosion-resisting pattern is partly removed then.Second method is after plating that the copper face to the copper plate pressing plate that is not covered by above-mentioned corrosion-resisting pattern etc. carries out copper, scolding tin, nickel and tin etc. is handled, in the same manner corrosion-resisting pattern is partly removed with first method, further to carrying out etching by the copper face of removing copper plate pressing plate of appearing etc.Cupric chloride, iron chloride, cupric ammine complex solution etc. are used in etching.
As the characteristic of DFR used herein,, require high exploring clarity, high painted characteristic or anti-plating, good fissility etc. from productivity, yield aspect.
In the past; the present inventor has the monomer of the carbamic acid ester structure of ad hoc structure by use, finds that elching resistant or anti-plating, coloring (for the permanance of the expulsion pressure of the development of DFR after the exposure of close and protect through hole, etching solution etc.) etc. are improved (opening clear 63-184744 communique with reference to the spy) greatly.
The inventor is on the other hand by using the monofunctional monomer of ad hoc structure, finds anti-plating, fissility improve (opening flat 6-161103 communique with reference to the spy).
But,,, wish further to improve from the viewpoint of sensitivity, resolution or coloring for these DFR in the past.
Problem of the present invention is, by also using multiple monomer with ad hoc structure, when being provided at characteristics such as keeping coloring, anti-plating, fissility, sensitive photosensitive polymer combination and layered product, the formation method of corrosion-resisting pattern of using this photosensitive-resin layered product and the manufacture method of printing distributing board, lead frame or semiconductor packages.
Summary of the invention
That is, the application provides following invention.
(1) photosensitive polymer combination, it contains:
(a) has the thermoplastic polymer of carboxyl;
(b) comprise the unsaturated addition polymerization monomer of ethylene type of compound shown in compound shown in compound, the following general formula 2 shown in the following general formula 1 and the following general formula 3,
General formula 1:
In the formula, W is C
2～C
20Divalent alkyl, R
1And R
4Be hydrogen or methyl, R
2, R
3Be the residue shown in the following formula (a),
Formula (a):
In the formula, m is 2～25 integer, and n is 0～15 integer, and these groups can be in random form, also can be in the form of block,
General formula 2
In the formula, R
5Be C
1～C
20Alkyl, R
6Be hydrogen or methyl, p is 0～20 integer, and q is 0～20 integer, and p and q add up to 2～20 integer, and in addition, these groups can be in the form of block, also can be in random form,
General formula 3:
In the formula, R
8And R
9Be hydrogen or methyl, they can be identical, also can be different, and s is 3～20 integer, r and t are 1～10 integer;
(c) contain 2-(Chloro-O-Phenyl)-4, the dimeric Photoepolymerizationinitiater initiater of 5-diphenyl-imidazole base; With
(d) contain the dyestuff of compound shown in the following formula 4,
Formula 4:
(2) photosensitive-resin layered product, it comprises the layer of support and above-mentioned (1) the described photosensitive polymer combination on it.
(3) the formation method of corrosion-resisting pattern, its surperficial upper strata that is included in sheet metal or coating metal insulcrete presses states (2) described photosensitive-resin layered product, by developing unexposed portion is removed behind ultraviolet exposure.
(4) manufacture method of printing distributing board, it comprises following operation:
The described photosensitive-resin layered product of lamination (2) makes the layer of photosensitive polymer combination adhere to circuit formation with on the substrate;
With image shape irradiation active ray, make the exposed portion photocuring;
By developing thereby unexposed portion is removed formation and solidify corrosion-resisting pattern;
Carry out etching or plating then.
(5) manufacture method of lead frame, it comprises following operation:
The described photosensitive-resin layered product of lamination (2) makes the layer of photosensitive polymer combination adhere to circuit formation with on the substrate;
With image shape irradiation active ray, make the exposed portion photocuring;
By developing thereby unexposed portion is removed formation and solidify corrosion-resisting pattern;
Carry out etching then.
(6) manufacture method of semiconductor packages, it comprises following operation:
The described photosensitive-resin layered product of lamination (2) makes the layer of photosensitive polymer combination adhere to circuit formation with on the substrate;
With image shape irradiation active ray, make the exposed portion photocuring;
By developing thereby unexposed portion is removed formation and solidify corrosion-resisting pattern;
Carry out etching or plating then.
Embodiment
Below the present invention will be described in detail.
As (a) component of using among the present invention-have the thermoplastic polymer of carboxyl, can enumerate compound, styrene and styrene derivative that at least a kind of the 1st monomer choosing from polymerizable unsaturated carboxylic acids and the hydrogen on (methyl) alkyl acrylate, (methyl) acrylic acid hydroxy alkyl ester, (methyl) acrylamide and nitrogen thereof is substituted by alkyl or alkoxy, (methyl) vinyl cyanide, and (methyl) glycidyl acrylate at least a kind of the 2nd monomer choosing carry out the vinyl copolymerization and the compound that obtains.
As the 1st monomer that is used to make thermoplastic polymer with carboxyl, specifically, can enumerate acrylic acid, methacrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, maleic acid half ester etc., can distinguish separately and use, also can make up more than 2 kinds.
Ratio with the 1st monomer in the thermoplastic polymer of carboxyl, be 15 weight % above, below the 40 weight %, preferred 20 weight % are above, below the 35 weight %.If its ratio less than 15 weight % utilize the development of alkaline aqueous solution to become difficult.In addition, if its ratio surpasses 40 weight %, make the synthetic difficulty that becomes owing to being insoluble to solvent in the polymerization.
As the 2nd monomer that is used to make thermoplastic polymer with carboxyl, can enumerate (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) acrylic acid n-propyl, (methyl) cyclohexyl acrylate, (methyl) n-butyl acrylate, (methyl) 2-EHA, (methyl) acrylic acid 2-hydroxyl ethyl ester, (methyl) acrylic acid 2-hydroxypropyl acrylate, (methyl) acrylic acid 4-hydroxy butyl ester, polyethyleneglycol (methyl) acrylate, polypropylene glycol list (methyl) acrylate, (methyl) acrylamide, N hydroxymethyl acrylamide, the N-butoxymethyl acrylamide, styrene, p-methylstyrene, to chlorostyrene, (methyl) vinyl cyanide, (methyl) glycidyl acrylate etc., can use separately separately, also can be used in combination more than 2 kinds.
Ratio with the 2nd monomer in the thermoplastic polymer of carboxyl, be 60 weight % above, below the 85 weight %, preferred 65 weight % are above, below the 80 weight %.
The ratio of the 2nd monomer is determined automatically according to the ratio of the 1st monomer, if its ratio less than 60 weight %, the then flexible deterioration of cured film.In addition, if its ratio surpasses 85 weight %, then development time increases, and is not preferred.
Weight-average molecular weight with thermoplastic polymer of carboxyl is more than 20,000, below 300,000, and is preferred more than 30,000, below 150,000.The weight-average molecular weight of this moment is by gel permeation chromatography (GPC), uses the weight-average molecular weight of the calibration curve mensuration of polystyrene standard.
If this weight-average molecular weight less than 20,000 is solidified film strength and is reduced.In addition, if this weight-average molecular weight surpasses 300,000, the viscosity of photosensitive polymer combination becomes too high, and coating reduces.
Thermoplastic polymer with carboxyl, be preferably as follows described synthetic: an amount of radical polymerization initiators such as benzoyl peroxide, azoisobutyronitrile that add in the solution that obtains with the potpourri of acetone, methyl ethyl ketone, isopropyl alcohol equal solvent diluting monomer, carried out thermal agitation.Sometimes also the limit splashes in the reactant liquor limit with the part of potpourri and synthesizes.In addition, finish the back in reaction sometimes and further add solvent, product is adjusted into required concentration.As synthesizing mean, except solution polymerization, can also use block polymerization, suspension polymerization and emulsion polymerization.
General assembly (TW) with photosensitive polymer combination is a benchmark, has the scope that the preferred 30 weight % of content are above, 75 weight % are following of the thermoplastic polymer of carboxyl, more preferably 40 weight % above, below the 65 weight %.If this amount less than 30 weight %, unexposed photosensitive polymer combination reduces the development time significant prolongation for the dispersiveness of alkaline-based developer.In addition, if should amount surpass 75 weight %, the photocuring deficiency of photo-sensitive resin is as the patience reduction of resist layer.
Above-mentioned thermoplastic polymer with carboxyl may be used alone, two or more kinds can also be used in combination.
The unsaturated addition polymerization monomer of (b) of the present invention as being used for component-ethylene type contains the compound of following general formula 1, the compound of following general formula 2 and the compound of following general formula 3.
General formula 1
In the formula, W is C
2～C
20Divalent alkyl, R
1And R
4Be hydrogen or methyl, R
2, R
3Be the residue of following formula (a) expression,
Formula (a):
In the formula, m is 2～25 integer, and n is 0～15 integer, and these groups can be in random form, also can be in the form of block,
General formula 2:
In the formula, R
5Be C
1～C
20Alkyl, R
6Be hydrogen or methyl, p is 0～20 integer, and q is 0～20 integer, and p and q add up to 2～20 integer, and these groups can be in the form of block, also can be in random form,
General formula 3:
In the formula, R
8And R
9Be hydrogen or methyl, they can be identical, also can be different, and s is 3～20 integer, r and t are 1～10 integer.
The compound of above-mentioned general formula 1 is 2 isocyanate compounds that replace and the urethane thing with hydroxyl (methyl) acrylate compounds of alkyl oxide repetitive.Here, W is C
2～C
20Divalent alkyl, R
1And R
4Be hydrogen or methyl, R
2And R
3Be the residue of following formula (a) expression, m is 2～25 integer, and n is 0～15 integer, and these groups can be in random form, also can be in the form of block.
As above-mentioned 2 isocyanate compounds that replace, can enumerate hexamethylene diisocyanate, toluene diisocyanate, isophorone diisocyanate etc., but more preferably hexamethylene diisocyanate.As the hydroxyl with alkyl oxide repetitive (methyl) acrylate compounds, can enumerate the compound that epoxide and (methyl) hydroxypropyl acrylate, the addition of (methyl) hydroxy-ethyl acrylate are obtained.As by the epoxide of addition, can enumerate epoxypropane or oxirane, they can use separately, also can use more than 2 kinds with random form, also can use more than 2 kinds with the form of block.As preference, can enumerate the compound that makes epoxypropane and the addition of methacrylic acid 2-hydroxypropyl acrylate, for example Block レ Application マ one PP1000 (NOF Corp's manufacturing).
The compound of above-mentioned general formula 2 is monohydroxy alcohol and methacrylic acid or the acrylic acid carboxylate that oxirane and/or epoxypropane and alkyl-substituted phenols addition are obtained.Here, R
5Be C
1～C
20Alkyl, R
6Be hydrogen or methyl, p is 0～20 integer, and q is 0～20 integer, and p and q add up to 2～20 integer.When making oxirane and epoxypropane and alkyl-substituted phenols addition, they can be in the form of block, also can be in random form.
Wherein, preferred R
5Be C
8～C
15Alkyl, p is 0～5, q is 5～12 compound.
The compound of the compound of above-mentioned general formula 3 for making (methyl) acrylic acid and polyvalent alcohol carry out esterification or synthesize by ester exchange reaction, wherein polyvalent alcohol forms by oxirane being added be formed in polypropyleneoxide.Here, R
8And R
9Be hydrogen or methyl, the number of repeat unit s of epoxypropane is 3～20, preferred 8～15.The number of repeat unit r of oxirane and t are 1～10, preferred 2～5.
Be used for (b) of the present invention component, can contain the compound compound in addition of above-mentioned general formula 1～3.As this compound, can enumerate for example 2-hydroxyl-3-phenoxy propyl acrylate, phenoxy group TEG acrylate, α-hydroxy propyl-Beta-(acryloxy) propyl group phthalic ester, 1,4-butylene glycol two (methyl) acrylate, 1,6-hexanediol two (methyl) acrylate, 1,4-cyclohexanediol two (methyl) acrylate, seven propylene glycol two (methyl) acrylate, glycerine (methyl) acrylate, 2-two (to hydroxyphenyl) propane two (methyl) acrylate, glycerine three (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, polyoxyethyl propyl trimethylolpropane tris (methyl) acrylate, polyoxy ethyl trimethylolpropane tris (methyl) acrylate, dipentaerythritol five (methyl) acrylate, dipentaerythritol six (methyl) acrylate, trihydroxymethylpropanyltri diglycidyl ether three (methyl) acrylate, bisphenol A diglycidyl ether two (methyl) acrylate, diallyl phthalate, polyglycol two (methyl) acrylate, polypropylene glycol two (methyl) acrylate, 4-n-octyl phenoxy group five propylene glycol acrylate, two (triethylene glycol methacrylates), nine propylene glycol, two (TEG methacrylate) polypropylene glycol, two (triethylene glycol methacrylate) polypropylene glycol, two (diethylene glycol acrylate) polypropylene glycol, 4-n-nonyl phenoxy group seven ethylene glycol bisthioglycolate propylene glycol (methyl) acrylate, phenoxy group four propylene glycol TEG (methyl) acrylate, the compound that contains the ethylene oxide chain in bisphenol A-type (methyl) the acrylate monomer molecule, the compound that contains the propylene oxide chain in bisphenol A-type (methyl) the acrylate monomer molecule, contain the compound of ethylene oxide chain and propylene oxide chain etc. in the molecule of bisphenol A-type (methyl) acrylate monomer.
The ratio (weight %) of the compound of the compound of the compound of above-mentioned general formula 1/above-mentioned general formula 2/above-mentioned general formula 3 is 10～80/10～80/10～80, preferred 15～70/15～70/15～70.
General assembly (TW) with photosensitive polymer combination is a benchmark, (b) the preferred 20 weight % of the content of the unsaturated addition polymerization monomer of the ethylene type of component above, below the 65 weight %.More preferably 30 weight % above, below the 60 weight %.If its ratio less than 20 weight %, the curing of photoresist is insufficient, as the undercapacity of resist layer.On the other hand, if its ratio surpasses 65 weight %, when photosensitive-resin layered product is preserved with web-like, begin the chaotic gradually phenomenon of photo-sensitive resin from end face, i.e. end face fusion worsens.
In the present invention, as the Photoepolymerizationinitiater initiater of (c) component, use 2-(Chloro-O-Phenyl)-4,5-diphenyl-imidazole base dimer.The trivial name lophine dimer of this compound is known.
In addition, in the present invention can and with other Photoepolymerizationinitiater initiater.As this Photoepolymerizationinitiater initiater, can enumerate for example benzyl dimethyl ketal, benzyl diethyl ketal, benzyl dipropyl ketal, benzyl diphenyl ketal, benzoin methylether, benzoin ethyl ether, the benzoin propyl ether, the benzoin phenylate, thioxanthones, 2,4-dimethyl thioxanthones, 2, the 4-diethyl thioxanthone, the 2-isopropyl thioxanthone, the 4-isopropyl thioxanthone, 2,4-diisopropyl thioxanthones, 2-fluorine thioxanthones, 4-fluorine thioxanthones, the 2-clopenthixal ketone, the 4-clopenthixal ketone, 1-chloro-4-propoxyl group thioxanthones, benzophenone, 4,4 '-two (dimethylamino) benzophenone [Michler's keton], 4,4 '-two (lignocaine) benzophenone, 2,2-dimethoxy-aromatic series ketones such as 2-phenyl acetophenone; 2-(Chloro-O-Phenyl)-4, diimidazole compounds such as 5-diphenyl-imidazole base dimer; Acridines such as 9-phenylacridine; α, alpha, alpha-dimethyl oxygen base-α-morpholino methylthio phenyl benzoylformaldoxime, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, phenylglycine, N-phenylglycine and 1-phenyl-1,2-propanedione-2-o-benzoyl base oxime, 2, oxime ester classes such as 3-dioxo-3-phenylpropionic acid ethyl ester-2-(o-benzoyl base carbonyl) oxime; P-(dimethylamino)-benzoic acid, to the lignocaine benzoic acid with to the carboxylate of diisopropyl ammonia yl benzoic acid and they and alcohol; P-hydroxybenzoate etc.Wherein, preferred especially 2-(Chloro-O-Phenyl)-4,5-diphenyl-imidazole base dimer and Michler's keton or 4, the combination of 4 '-two (lignocaine) benzophenone.
Gross mass with photosensitive polymer combination is a benchmark, and the content of the present invention (c) component Photoepolymerizationinitiater initiater is preferably more than the 0.01 quality %, below the 20 quality %.More preferably 1 quality % above, below the 10 quality %.If this amount is lacked than 0.01 quality %, sensitivity is not enough.In addition, if the amount of being somebody's turn to do is more than 20 quality %, absorption of UV increases, the curing deficiency that the photo-sensitive resin bottom is divided.
As the dyestuff of (d) component, photosensitive polymer combination of the present invention contains the compound shown in the following formula 4.
(formula 4)
According to CI (colour index) classification, this compound is called as " Viride Nitens 1 ", and formal chemical name is " two (to a lignocaine phenyl) phenyl carbons sulfate ".
A kind of as this Viride Nitens 1, diamond green (Diamond Green, trade name) is sold on market as Eisen Diamond Green GH (protecting native ケ paddy chemistry (strain) system, goods name).Gross mass with photosensitive polymer combination is a benchmark, and the preferred 0.01 quality % of the addition of diamond green is above, less than 0.1 quality %, and preferred especially 0.03 quality % is above, less than 0.07 quality %.If less than 0.01 quality %, painted little after the development is difficult to check, if surpass 0.1 quality %, cooperates when exposing with mask, is difficult to consistent with the pattern of substrate, not preferred.
If the interpolation dyestuff, the tendency that exists sensitivity to reduce usually, but, therefore can obtain required sensitivity with less exposure because this degree of diamond green is little.
In photosensitive polymer combination of the present invention, can contain coloring materials such as dyestuff beyond the diamond green, pigment.As this coloring material, can enumerate for example magenta, phthalocyanine green, auramine alkali, the green S of カ Le コ キ シ De, para magenta, crystal violet, methyl orange, Nile blue 2B, Victoria blue, peacock green, alkali blue 20 etc.
For thermal stability, the storage stability that improves photosensitive polymer combination of the present invention, preferably make it contain the free radical polymerization polymerization inhibitor.As this free radical polymerization polymerization inhibitor, can enumerate for example p methoxy phenol, quinhydrones, pyrogallol, naphthylamines, tert-butyl catechol, stannous chloride, 2,6-di-t-butyl-paracresol, 2,2 '-methylene two (4-ethyl-6-tert-butyl phenol), 2,2 '-methylene two (4-methyl-6-tert butyl phenol) etc.
In addition, can also contain the color development based dye that utilizes the rayed color development in the photosensitive polymer combination of the present invention.As this color development based dye, know the combination of leuco dye and halogen compounds.As leuco dye, can enumerate for example three (4-dimethylamino-2-aminomethyl phenyl) methane [leuco crystal violet], three (4-dimethylamino-2-aminomethyl phenyl) methane [colourless peacock green] etc.On the other hand, as halogen compounds, can enumerate bromo pentane, bromo isopentane, bromo isobutylene, bromoethylene, diphenyl methyl bromine, benzal bromide, methylene bromide, trisbromomethyl phenyl sulfone, carbon tetrabromide, three (2, the 3-dibromopropyl) phosphate, trichloroacetamide, iodo-pentane, iodo isobutane, 1,1,1-three chloro-2,2-two (rubigan) ethane, carbon trichloride etc.
In addition, can contain adjuvants such as plastifier in the photosensitive polymer combination of the present invention as required.As this adjuvant, can enumerate for example phthalate such as diethyl phthalate, orthotoluene sulfonamide, para toluene sulfonamide, tributyl citrate, triethyl citrate, acetyl triethyl citrate, acetyl tributyl citrate three n-propyls, ATBC, polypropylene glycol, polyglycol, polyethylene glycol alkyl ether, polypropylene glycol alkyl ether etc.
The thickness of photo-sensitive resin is preferably more than the 1 μ m, below the 150 μ m in the photosensitive-resin layered product of the present invention, is preferably especially more than the 3 μ m, below the 80 μ m.From the viewpoint of system film coating, more than the preferred 1 μ m of the thickness of photo-sensitive resin, from resolution, the adhering viewpoint of the back image that develops, below the preferred 150 μ m.
Make the method for photosensitive-resin layered product of the present invention, can adopt present known method to carry out.For example, can make photosensitive polymer combination of the present invention and solvent form uniform solution, use wire bar applicator or print roll coating device with this solution coat to support and carry out drying, thereby preparation on support lamination the photosensitive-resin layered product of the present invention of photo-sensitive resin.
The support that uses in photosensitive-resin layered product of the present invention preferably makes the transparent material of active light transmission.Can enumerate for example polyethylene terephthalate film, poly (ethylene naphthalate) film, polyvinyl alcohol film, polychloroethylene film, vinyl chloride copolymer film, polyvinylidene chlorida film, metachloroethylene copolymer film, polymethyl methacrylate copolymer film, polystyrene film, polyacrylonitrile film, styrol copolymer film, polyamide membrane, cellulose derivative film etc.
The thickness that is used for the support of photosensitive-resin layered product of the present invention be preferably 10 μ m above, below the 40 μ m, more preferably 12 μ m above, below the 30 μ m.From the viewpoint of operation, more than the preferred 10 μ m of the thickness of support, from the viewpoint of resolution, below the preferred 40 μ m.
In addition, also can be on the photoresist of photosensitive-resin layered product of the present invention the lamination protective seam, make the photosensitive-resin layered product of 3-tier architecture.This moment the preferred 15 μ m of thickness of protective seam above, below the 50 μ m, more preferably 25 μ m above, below the 45 μ m.From the yield aspect of end article, be preferably more than the 15 μ m, from the manufacturing cost aspect, be preferably below the 50 μ m.
As the film that is used for protective seam, can enumerate polyolefin film such as polyethylene film or polypropylene screen and polyester film or make polyester film that fissility improves etc. by siloxane treated or pure acid treatment.Special preferably polyethylene film.
Below, method one example of using photosensitive-resin layered product of the present invention to make printing distributing board is described.
Printing distributing board is made through following each operation.
(1) lamination: the protective seam of photosensitive-resin layered product is peelled off on the limit, and the limit uses the hot-roll lamination machine that photosensitive-resin layered product is adhered on the substrates such as copper plate pressing plate or flexible substrate.
(2) exposure process: the mask with required Wiring pattern is adhered on the support, use the active ray source to expose.
(3) developing procedure: support is peeled off the back unexposed portion dissolving or the dispersion of photo-sensitive resin are removed, on substrate, form corrosion-resisting pattern with alkaline-based developer.
(4) blow etching solution from the corrosion-resisting pattern that forms, the etching work procedure of the copper face etching that will be not be covered by corrosion-resisting pattern, or on the copper face that is not covered, carry out the plating operation that the plating of copper, scolding tin, nickel and tin etc. is handled by corrosion-resisting pattern.
(5) stripping process: use alkaline stripper that corrosion-resisting pattern is removed from substrate.
As the active ray source of in above-mentioned exposure process, using, can enumerate high-pressure mercury-vapor lamp, extra-high-pressure mercury vapour lamp, ultraviolet fluorescent lamp, carbon arc lamp, xenon lamp etc.In addition, in order to obtain more fine corrosion-resisting pattern, more preferably use parallel light source.When wanting to do one's utmost to reduce the influencing of dust or foreign matter, can photomask be floated on the support expose under the state more than tens of μ m, below hundreds of μ m (near exposure) sometimes.
In addition, as the alkaline-based developer that uses in the developing procedure, can enumerate aqueous solution such as sodium carbonate, sal tartari.These alkaline aqueous solutions will be chosen with the characteristic fit of photo-sensitive resin, use the aqueous sodium carbonate that 0.5wt% is above, 3wt% is following usually.
Etching work procedure adopts acid etching, alkali etching etc. and the matched method of using of DFR to carry out.
As the alkaline stripper that uses in the stripping process, can enumerate the alkaline aqueous solution stronger, the NaOH that for example 1wt% is above, 5wt% is following, the aqueous solution of potassium hydroxide than the alkaline aqueous solution that uses in the common development.
When adopting the plating operation, after corrosion-resisting pattern is peeled off, the copper face that occurs under the corrosion-resisting pattern is carried out etching sometimes.
In addition, when using photosensitive-resin layered product of the present invention to make lead frame, replace above-mentioned copper plate pressing plate or flexible substrate etc. and photo-sensitive resin is laminated on the two sides of sheet metal of copper, aldary, iron-based alloy etc., after exposing, developing, carry out etching.Be cured peeling off of resist layer at last, obtain required lead frame.
In addition, when making semiconductor packages,, after exposing, developing, implement the column plating of copper, scolding tin etc. at peristome at the silicon chip upper strata pressure sensitivity photosensitiveness resin bed that has formed as the circuit of LSI.Be cured peeling off of resist layer then, the thin metal layer of part beyond the column plating removed, obtain required semiconductor packages by etching.
Below, in conjunction with the embodiments embodiments of the present invention are described in more detail.
＜embodiment 1～7 and comparative example 1～4 〉
Evaluation in embodiment and the comparative example is carried out as follows.
1) the basic manufacturing conditions of sample
(making photosensitive-resin layered product)
The photosensitive polymer combination of forming shown in the table 1 is mixed, use wire bar applicator to be uniformly applied on the polyethylene terephthalate film of thick 16 μ m, drying is 2 minutes in 90 ℃ dryer, forms photo-sensitive resin.The thickness of photo-sensitive resin is 40 μ m.Component is formed the mass parts of expression solid constituent in the table 1.
Do not have the polyethylene film of fitting on the surface of lamination polyethylene terephthalate film at photo-sensitive resin, make photosensitive-resin layered product.
(surface dressing of substrate)
Using the abrasive grains (Japanese カ one リ ッ ト (strain) makes) of サ Network ラ Application ダ system R#220, is the copper plate pressing plate (thickness of slab: 1.6mm) carry out jet cleaning and grind of 35 μ m to copper thickness.
(lamination)
The polyethylene film of photosensitive-resin layered product is peelled off on the limit, and 2 segmentation hot-roll lamination machines (the system AL-700 of Asahi Chemical Industry's (strain)) are used on the limit, are pressed onto on the copper alloy substrate that has carried out pre-treatment in 100 ℃ on leading portion roller, 100 ℃ of lower floors of back segment roller.The roller pressure of laminating machine is represented with barometer, is 0.30MPa, and laminate speed is 2.0m/min.
(exposure)
Do not having mask or passing through to estimate required mask, and the use extra-high-pressure mercury vapour lamp (オ one Network is made made: HMW-801), and with 60mJ/cm
2Photo-sensitive resin is exposed.
(development)
After the polyethylene terephthalate film is peeled off, use the schedule time to spray 30 ℃ 1% aqueous sodium carbonate, the dissolving of photo-sensitive resin unexposed portion is removed.At this moment, the photoresist of unexposed portion is dissolved the required minimum time fully be designated as minimum development time, the predetermined visualization time is its 1.5 times.
2) sensitometry
Use lightness to expose as photomask from transparent to 27 grades of Step tablet of 27 grades of variations of black point (Asahi Chemical Industry's (strain) system, optical concentration D=0.50～1.80, per 1 grade concentration difference=0.05), the back of developing is measured and the laminate copper face exposes the progression of the corresponding Step tablet in position.
If sensitivity is more than 12 grades, it is the practical effective scope that, if be below 11 grades, because the sensitivity deficiency needs further to increase exposure, productivity reduces.
3) resolution test
For 1) the basic manufacturing conditions of sample under proceed to the substrate that lamination finishes, the photomask that line is spaced apart 10/300 μ m～100/300 μ m (5 μ m indentation) is disposed at the polyethylene terephthalate film side as the support of photosensitive-resin layered product, by photomask with 60mJ/cm
2Exposure expose after, the polyethylene terephthalate film is removed, 30 ℃, spray to press and to spray 80 seconds of 1wt% aqueous sodium carbonate under the 0.15MPa, unexposed portion is removed, obtain picture pattern.Separated and the minimum feature such as (promptly do not have crawling of picture pattern, not with the inadhesive part of substrate) that do not have to flow is as resolution with the image of preparation.
4) fissility test
Will be with 60mJ/cm
2The exposure substrate that on the area of 3cm * 5cm, exposes, develop impregnated in the 3wt% sodium hydrate aqueous solution that remains on 50 ℃, will peel off the required time of the photo-sensitive resin of curing as splitting time from base material.
5) anti-plating test
1) the exposure process of basic manufacturing conditions of sample in, use the photomask of circuit pattern shape, with 60mJ/cm
2Exposure substrate is exposed, develops, this substrate is carried out the plating pre-treatment through following operation.
A) dipping 4 minutes in the 10wt% of 40 ℃ acid Network リ one Na one FR (ア ト テ ッ Network society system, trade name), sulfuric acid 20wt% aqueous solution.
B) at room temperature, in the ammonium persulfate aqueous solution of 200g/L, flooded 1 minute.
C) at room temperature, in the 10wt% aqueous sulfuric acid, flooded 2 minutes.
After the plating pre-treatment, in the plating solution of 19wt% sulfuric acid, with 2.5A/dm with 3.6 times of メ Le テ ッ Network ス society's system " copper sulphate コ Application Network " dilutions
2Current density at room temperature carry out copper facing in 30 minutes.In addition, use the scolding tin plating solution (tin/lead=6/4 weight ratio) of マ Network ダ one ミ ッ De society system, with 2.0A/dm
2Current density carry out 10 minutes scolding tin platings.
According to JIS K 5600-5-6 method, sticking glass paper tape on this substrate according to peeling off the state that photo-sensitive resin is solidified in the back, is as described belowly estimated anti-plating.
Zero: do not adhere to resist layer on the adhesive tape fully, or be wire along pattern with the following width of 100 μ m and adhere to.
△: along the pattern resist layer with the width more than the 100 μ m attached on the adhesive tape.
*: whole resist layer almost is stripped from, and is attached on the adhesive tape.
6) coloring test
Use has the copper plate pressing plate of about 1000 diameter 6mm circular holes, one by one photosensitive-resin layered product is laminated on the two sides of substrate, and respectively by patterned mask, be that 13 grades exposure is exposed from the two sides with above-mentioned step tablet progression.
3 times of times with minimum development time are carried out development treatment to it, press 0.3MPa to carry out washing in 1 minute to spray then.Calculate in the round hole part cured film circular hole number that single face at least destroys, rating as described below.
Zero: destructive rate less than 10%
△: destructive rate is more than 10%, less than 30%
*: destructive rate is more than 30%
Embodiment and comparative example the results are shown in table 1.
In addition, form shown in the table 1 (each group component unit: weight portion) and the abbreviation of support as follows.
P-1: have methyl methacrylate/methacrylic acid/n-butyl acrylate (mass ratio=65/25/10) and form, weight-average molecular weight is 30 quality % methyl ethyl ketone solution of 120,000 multipolymer
M-1: the urethane thing of hexamethylene diisocyanate and propylene glycol monomethyl acrylate oligomer (Japanese grease (strain) system PP-1000)
M-2: two (triethylene glycol methacrylates), nine propylene glycol
M-3:4-n-nonyl phenoxy group five ethylene glycol tripropylene glycol acrylate
M-4: nine glycol diacrylates
M-5: phenoxy group TEG acrylate
M-6: three ethyl oxide trimethylolpropane triacrylates
M-7: the urethane thing of hexamethylene diisocyanate and propylene glycol monomethacrylates oligomer (Japanese grease (society) system 70PEP-350P)
M-8:4-n-nonyl phenoxy group eight diethylene glycol monoacrylates
M-9:4-n-nonyl phenoxy group six propylene glycol mono acrylic esters
I-1: Michler's keton
I-2:2-(Chloro-O-Phenyl)-4,5-diphenyl-imidazole base dimer
D-1: diamond green (protecting native ケ paddy chemistry (strain) system)
D-2: peacock green (protecting native ケ paddy chemistry (strain) system)
D-3: leuco crystal violet
Table 1
| Form | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 |
| P-1 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
| M-1 | 15 | 15 | 15 | 10 | 50 | 50 | 15 | 15 | 15 | ||
| M-2 | 15 | 10 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | |
| M-3 | 15 | 15 | 10 | 15 | 15 | 15 | 15 | 15 | |||
| M-4 | 5 | 15 | |||||||||
| M-5 | 5 | 15 | |||||||||
| M-6 | 5 | 15 | |||||||||
| M-7 | 15 | ||||||||||
| M-8 | 15 | ||||||||||
| M-9 | 15 | ||||||||||
| I-1 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| I-2 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 | 0.14 |
| D-1 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | |
| D-2 | 0.05 | ||||||||||
| D-3 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Estimate | |||||||||||
| Sensitivity (level) | 13 | 13 | 13 | 13 | 12 | 13 | 13 | 9 | 13 | 13 | 12 |
| Resolution (μ m) | 45 | 45 | 40 | 45 | 45 | 40 | 45 | 45 | 65 | 65 | 45 |
| Fissility | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | × |
| Anti-plating | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | △ |
| Coloring | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ | × | △ |
Utilize possibility on the industry
Photosensitive polymer combination of the present invention has the fissility of high sensitivity, excellent coloring, anti-plating, cured film, and printing distributing board, lead frame or semiconductor packages are exceedingly useful for making.
Claims (6)
1, photosensitive polymer combination, it contains:
(a) has the thermoplastic polymer of carboxyl;
(b) comprise the unsaturated addition polymerization monomer of ethylene type of compound shown in compound shown in compound, the following general formula 2 shown in the following general formula 1 and the following general formula 3,
In the formula, W is C
2～C
20Divalent alkyl, R
1And R
4Be hydrogen or methyl, R
2, R
3Be the residue of following formula (a) expression,
In the formula, m is 2～25 integer, and n is 0～15 integer, and these groups can be random forms, also can be the form of block,
In the formula, R
5Be C
1～C
20Alkyl, R
6Be hydrogen or methyl, p is 0～20 integer, and q is 0～20 integer, and p and q add up to 2～20 integer, and these groups can be random forms, also can be the forms of block,
In the formula, R
8And R
9Be hydrogen or methyl, they can be identical, also can be different, and s is 3～20 integer, r and t are 1～10 integer;
(c) contain 2-(Chloro-O-Phenyl)-4, the dimeric Photoepolymerizationinitiater initiater of 5-diphenyl-imidazole base; With
(d) contain the dyestuff of compound shown in the following formula 4;
Wherein, general assembly (TW) with photosensitive polymer combination is a benchmark, the content that above-mentioned (a) has the thermoplastic polymer of carboxyl is more than the 30 weight %, below the 75 weight %, (b) contain compound shown in the above-mentioned general formula 1, it is more than the 20 weight % that the content of addition polymerization monomer is closed in the ethylene type insatiable hunger of compound shown in compound and the above-mentioned general formula 3 shown in the above-mentioned general formula 2, below the 65 weight %, (c) contain 2-(Chloro-O-Phenyl)-4, the content of the dimeric Photoepolymerizationinitiater initiater of 5-diphenyl-imidazole base is more than the 0.01 weight %, below the 20 weight %, (d) content that contains the dyestuff of compound shown in the above-mentioned formula 4 is more than the 0.01 weight %, less than 0.1 weight %.
2, photosensitive-resin layered product, it comprises the layer of support and the described photosensitive polymer combination of claim 1 on it.
3, the formation method of corrosion-resisting pattern, it is included in the described photosensitive-resin layered product of lamination claim 2 on the surface of sheet metal or coating metal insulcrete, by developing unexposed portion is removed behind ultraviolet exposure.
4, the manufacture method of printing distributing board, it comprises following operation:
The described photosensitive-resin layered product of lamination claim 2 makes the layer of photosensitive polymer combination adhere to circuit formation with on the substrate;
With image shape irradiation active ray, make the exposed portion photocuring;
By developing thereby unexposed portion is removed formation and solidify corrosion-resisting pattern;
Carry out etching or plating then.
5, the manufacture method of lead frame, it comprises following operation:
The described photosensitive-resin layered product of lamination claim 2 makes the layer of photosensitive polymer combination adhere to circuit formation with on the substrate;
With image shape irradiation active ray, make the exposed portion photocuring;
By developing thereby unexposed portion is removed formation and solidify corrosion-resisting pattern;
Carry out etching then.
6, the manufacture method of semiconductor packages, it comprises following operation:
The described photosensitive-resin layered product of lamination claim 2 makes the layer of photosensitive polymer combination adhere to circuit formation with on the substrate;
With image shape irradiation active ray, make the exposed portion photocuring;
By developing thereby unexposed portion is removed formation and solidify corrosion-resisting pattern;
Carry out etching or plating then.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002067116 | 2002-03-12 | ||
| JP67116/2002 | 2002-03-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1643451A CN1643451A (en) | 2005-07-20 |
| CN1310088C true CN1310088C (en) | 2007-04-11 |
Family
ID=27800273
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038057654A Expired - Lifetime CN1310088C (en) | 2002-03-12 | 2003-03-10 | Photosensitive resin composition and use thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3883540B2 (en) |
| CN (1) | CN1310088C (en) |
| AU (1) | AU2003213432A1 (en) |
| WO (1) | WO2003077035A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100434948C (en) * | 2004-11-16 | 2008-11-19 | 奇美实业股份有限公司 | Photosensitive resin composition for colour filter |
| WO2007105644A1 (en) * | 2006-03-14 | 2007-09-20 | Asahi Kasei Emd Corporation | Photosensitive-resin layered product |
| CN102754032B (en) * | 2010-03-19 | 2015-07-15 | 日立化成株式会社 | Photosensitive resin composition and photosensitive element using same, resist pattern formation method and printed circuit board manufacturing method |
| CN103282829B (en) * | 2010-12-24 | 2016-08-17 | 旭化成株式会社 | Photosensitive polymer combination |
| JP6512532B2 (en) * | 2015-06-05 | 2019-05-15 | 日油株式会社 | Photosensitive resin composition for urethane (meth) acrylate and dry film resist |
| JP6567952B2 (en) * | 2015-10-26 | 2019-08-28 | 旭化成株式会社 | Photosensitive resin composition, photosensitive resin laminate, and resist pattern forming method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
| JPH06161103A (en) * | 1992-11-19 | 1994-06-07 | Asahi Chem Ind Co Ltd | New photo-polymerized resin laminate |
| JP2548016B2 (en) * | 1986-09-09 | 1996-10-30 | 旭化成工業株式会社 | Photopolymerizable laminate |
| JP2000214583A (en) * | 1999-01-22 | 2000-08-04 | Hitachi Chem Co Ltd | Photosensitive resin composition, and photosensitive element using same and manufacture of resist pattern and printed circuit board |
| JP2001142201A (en) * | 1999-11-17 | 2001-05-25 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using same and method for producing color filter |
| JP2001290269A (en) * | 2000-04-06 | 2001-10-19 | Nichigo Morton Co Ltd | Photosensitive resin composition and photosensitive film using the same |
| EP1174767A1 (en) * | 1999-03-03 | 2002-01-23 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4716347B2 (en) * | 2001-04-05 | 2011-07-06 | 旭化成イーマテリアルズ株式会社 | Dry film resist |
-
2003
- 2003-03-10 WO PCT/JP2003/002800 patent/WO2003077035A1/en active Application Filing
- 2003-03-10 JP JP2003575188A patent/JP3883540B2/en not_active Expired - Lifetime
- 2003-03-10 CN CNB038057654A patent/CN1310088C/en not_active Expired - Lifetime
- 2003-03-10 AU AU2003213432A patent/AU2003213432A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
| JP2548016B2 (en) * | 1986-09-09 | 1996-10-30 | 旭化成工業株式会社 | Photopolymerizable laminate |
| JPH06161103A (en) * | 1992-11-19 | 1994-06-07 | Asahi Chem Ind Co Ltd | New photo-polymerized resin laminate |
| JP2000214583A (en) * | 1999-01-22 | 2000-08-04 | Hitachi Chem Co Ltd | Photosensitive resin composition, and photosensitive element using same and manufacture of resist pattern and printed circuit board |
| EP1174767A1 (en) * | 1999-03-03 | 2002-01-23 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board |
| JP2001142201A (en) * | 1999-11-17 | 2001-05-25 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using same and method for producing color filter |
| JP2001290269A (en) * | 2000-04-06 | 2001-10-19 | Nichigo Morton Co Ltd | Photosensitive resin composition and photosensitive film using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3883540B2 (en) | 2007-02-21 |
| AU2003213432A1 (en) | 2003-09-22 |
| JPWO2003077035A1 (en) | 2005-07-07 |
| CN1643451A (en) | 2005-07-20 |
| WO2003077035A1 (en) | 2003-09-18 |
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