JP4163950B2 - セルフティーチングロボット - Google Patents

セルフティーチングロボット Download PDF

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Publication number
JP4163950B2
JP4163950B2 JP2002548748A JP2002548748A JP4163950B2 JP 4163950 B2 JP4163950 B2 JP 4163950B2 JP 2002548748 A JP2002548748 A JP 2002548748A JP 2002548748 A JP2002548748 A JP 2002548748A JP 4163950 B2 JP4163950 B2 JP 4163950B2
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Japan
Prior art keywords
robot
target
sensor
end effector
workpiece
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Expired - Fee Related
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JP2002548748A
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Japanese (ja)
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JP2004536443A5 (https=
JP2004536443A (ja
Inventor
ロジャー ジー ハイン
グラハム エル ハイン
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Asyst Technologies Inc
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Asyst Technologies Inc
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Publication of JP2004536443A5 publication Critical patent/JP2004536443A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
JP2002548748A 2000-12-04 2001-11-28 セルフティーチングロボット Expired - Fee Related JP4163950B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/729,463 US6591160B2 (en) 2000-12-04 2000-12-04 Self teaching robot
PCT/US2001/044393 WO2002047115A2 (en) 2000-12-04 2001-11-28 Self teaching robot

Publications (3)

Publication Number Publication Date
JP2004536443A JP2004536443A (ja) 2004-12-02
JP2004536443A5 JP2004536443A5 (https=) 2005-12-22
JP4163950B2 true JP4163950B2 (ja) 2008-10-08

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JP2002548748A Expired - Fee Related JP4163950B2 (ja) 2000-12-04 2001-11-28 セルフティーチングロボット

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US (1) US6591160B2 (https=)
JP (1) JP4163950B2 (https=)
AU (1) AU2002236492A1 (https=)
TW (1) TW508289B (https=)
WO (1) WO2002047115A2 (https=)

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US8309983B2 (en) 2010-03-25 2012-11-13 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
JP2014165439A (ja) * 2013-02-27 2014-09-08 Tokyo Electron Ltd 基板搬送装置、基板受渡位置確認方法及び基板処理システム

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JP2014165439A (ja) * 2013-02-27 2014-09-08 Tokyo Electron Ltd 基板搬送装置、基板受渡位置確認方法及び基板処理システム

Also Published As

Publication number Publication date
TW508289B (en) 2002-11-01
US20020068992A1 (en) 2002-06-06
WO2002047115A2 (en) 2002-06-13
AU2002236492A1 (en) 2002-06-18
WO2002047115A3 (en) 2003-05-15
US6591160B2 (en) 2003-07-08
JP2004536443A (ja) 2004-12-02

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