JP4159246B2 - 密着印刷性接着剤組成物および前記組成物を製造する方法 - Google Patents

密着印刷性接着剤組成物および前記組成物を製造する方法 Download PDF

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Publication number
JP4159246B2
JP4159246B2 JP2000508744A JP2000508744A JP4159246B2 JP 4159246 B2 JP4159246 B2 JP 4159246B2 JP 2000508744 A JP2000508744 A JP 2000508744A JP 2000508744 A JP2000508744 A JP 2000508744A JP 4159246 B2 JP4159246 B2 JP 4159246B2
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Prior art keywords
adhesive
microspheres
acrylate
composition
printable
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Expired - Fee Related
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JP2000508744A
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Japanese (ja)
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JP2001515090A (ja
JP2001515090A5 (https=
Inventor
ジョン・ピー・バノベッツ
スペンサー・エフ・シルバー
ホアキン・デルガド
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3M Co
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3M Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F263/00—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00
    • C08F263/02—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00 on to polymers of vinyl esters with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/02—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/903—Interpenetrating network
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
    • Y10T428/249995—Constituent is in liquid form
    • Y10T428/249997—Encapsulated liquid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Graft Or Block Polymers (AREA)
JP2000508744A 1997-08-29 1997-12-17 密着印刷性接着剤組成物および前記組成物を製造する方法 Expired - Fee Related JP4159246B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/920,795 US6444305B2 (en) 1997-08-29 1997-08-29 Contact printable adhesive composition and methods of making thereof
US08/920,795 1997-08-29
PCT/US1997/023418 WO1999011727A1 (en) 1997-08-29 1997-12-17 Printable adhesive composition and methods of preparation

Publications (3)

Publication Number Publication Date
JP2001515090A JP2001515090A (ja) 2001-09-18
JP2001515090A5 JP2001515090A5 (https=) 2005-12-22
JP4159246B2 true JP4159246B2 (ja) 2008-10-01

Family

ID=25444415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000508744A Expired - Fee Related JP4159246B2 (ja) 1997-08-29 1997-12-17 密着印刷性接着剤組成物および前記組成物を製造する方法

Country Status (6)

Country Link
US (1) US6444305B2 (https=)
EP (1) EP1007596B1 (https=)
JP (1) JP4159246B2 (https=)
AU (1) AU5708398A (https=)
DE (1) DE69721582T2 (https=)
WO (1) WO1999011727A1 (https=)

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US6874421B2 (en) 2001-04-20 2005-04-05 3M Innovative Properties Company Ink jet transfer printing process
US7275548B2 (en) * 2001-06-27 2007-10-02 R.J. Reynolds Tobacco Company Equipment for manufacturing cigarettes
US20040238136A1 (en) * 2003-05-16 2004-12-02 Pankaj Patel Materials and methods for manufacturing cigarettes
US20030089613A1 (en) * 2001-11-15 2003-05-15 Ching Chang Yu Method of selectively electroplating by screen-plating technology
US20030095388A1 (en) * 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US7234471B2 (en) * 2003-10-09 2007-06-26 R. J. Reynolds Tobacco Company Cigarette and wrapping materials therefor
US7281540B2 (en) * 2002-12-20 2007-10-16 R.J. Reynolds Tobacco Company Equipment and methods for manufacturing cigarettes
US20040158008A1 (en) * 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
US7473753B2 (en) * 2004-08-06 2009-01-06 Oatey Co. Adhesive compositions and methods of using the same
JP5034206B2 (ja) * 2005-10-03 2012-09-26 株式会社デンソー 導電性接着剤
KR101175728B1 (ko) * 2006-01-20 2012-08-22 삼성전자주식회사 디스플레이 모듈의 전자파 차폐장치 및 그 제조방법
EP2250227A4 (en) 2008-02-25 2013-08-21 Henkel Ag & Co Kgaa OUT OF THEIR PUNCHING CHIP FIXING PASTE
US8870436B2 (en) * 2008-09-17 2014-10-28 3M Innovative Properties Company Patterned adhesives for reflectors
US8765217B2 (en) 2008-11-04 2014-07-01 Entrotech, Inc. Method for continuous production of (meth)acrylate syrup and adhesives therefrom
US8329079B2 (en) 2009-04-20 2012-12-11 Entrochem, Inc. Method and apparatus for continuous production of partially polymerized compositions and polymers therefrom
EP2459605B1 (en) * 2009-07-31 2013-06-12 Prysmian S.p.A. Low and medium voltage cable joint filled with cold thermosetting resin and kit for the deployment thereof
US9371148B1 (en) * 2009-08-14 2016-06-21 Nucoat, Inc. Methods and articles for image transfer
EP2567257B1 (en) * 2010-05-06 2021-03-24 Immunolight, Llc. Adhesive bonding composition and method of use
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KR101479658B1 (ko) * 2011-11-18 2015-01-06 제일모직 주식회사 가압착 공정성이 개선된 이방성 도전 필름
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Also Published As

Publication number Publication date
US6444305B2 (en) 2002-09-03
DE69721582T2 (de) 2004-03-25
JP2001515090A (ja) 2001-09-18
EP1007596B1 (en) 2003-05-02
EP1007596A1 (en) 2000-06-14
AU5708398A (en) 1999-03-22
DE69721582D1 (de) 2003-06-05
WO1999011727A1 (en) 1999-03-11
US20020004132A1 (en) 2002-01-10

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