JP4126052B2 - プリント基板の製造方法および薄型プリント基板 - Google Patents
プリント基板の製造方法および薄型プリント基板 Download PDFInfo
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- JP4126052B2 JP4126052B2 JP2005117108A JP2005117108A JP4126052B2 JP 4126052 B2 JP4126052 B2 JP 4126052B2 JP 2005117108 A JP2005117108 A JP 2005117108A JP 2005117108 A JP2005117108 A JP 2005117108A JP 4126052 B2 JP4126052 B2 JP 4126052B2
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- Prior art keywords
- insulating layer
- circuit board
- printed circuit
- release film
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
前記ベース基板の上下面にソルダレジストを形成する工程と、
前記ベース基板の上下面に回路層および絶縁層を順次積層する工程と、
前記離型フィルムを取り囲む絶縁材を含む部分を除去するため、前記ベース基板の端部を切断する工程と、
前記離型フィルムを分離し、前記ベース基板を、前記コア絶縁層を中心に2枚の基板に分離する工程と、
前記分離された各基板の片面に露出した銅箔を除去する工程とを含むことを特徴とするプリント基板の製造方法を提供する。
201 コア絶縁層
202 離型フィルム
203 絶縁材
204a、204b 銅箔
205 ソルダレジスト
206 無電解鍍金層
207 鍍金レジスト
208 回路パターン
209 絶縁層
210 ビアホール
211 無電解鍍金層
212 回路パターン
213 ソルダレジスト
214 電極パッド
Claims (4)
- コア絶縁層、前記コア絶縁層上に接着された離型フィルム、前記離型フィルムの周囲を取り囲むように積層された絶縁材、および前記離型フィルムの上下面に積層された銅箔を備えるベース基板であって、前記離型フィルムが前記コア絶縁層および前記銅箔と直接接しており、前記絶縁材の厚さは前記離型フィルムの厚さと同一であるようにしたベース基板を用意する工程と、
前記ベース基板の上下面にソルダレジストを形成する工程と、
前記ベース基板の上下面に回路層および絶縁層を順次積層する工程と、
前記離型フィルムを取り囲む絶縁材を含む部分を除去するため、前記ベース基板の端部を切断する工程と、
前記離型フィルムを分離し、前記ベース基板を、前記コア絶縁層を中心に2枚の基板に分離する工程と、
前記分離された各基板の片面に露出した銅箔を除去する工程とを含むことを特徴とするプリント基板の製造方法。 - 前記ベース基板の上下面に回路層および絶縁層を順次積層する工程は、
前記上下面に層間絶縁のための絶縁層を積層する工程と、
前記絶縁層上にビアホールおよび回路パターンを形成する工程と、
絶縁性ソルダレジストを塗布する工程と、
電極パッドを形成する工程とを含むことを特徴とする請求項1に記載のプリント基板の製造方法。 - 前記ベース基板を用意する工程は、
コア絶縁層の上下面に離型フィルムを接着する工程と、
前記離型フィルムの周囲を取り囲むように絶縁材を積層する工程と、
前記離型フィルムおよび前記絶縁材の上下面に銅箔を積層する工程と、
前記ベース基板を圧着する工程とを含むことを特徴とする請求項1に記載のプリント基板の製造方法。 - 請求項1〜3のいずれかに記載のプリント基板の製造方法を用いて得られる薄型プリント基板であって、
絶縁性インクの硬化によって形成され、複数のビアホールを有する第1絶縁層と、
前記第1絶縁層上に形成された第1回路層と、
前記回路層上に形成され、絶縁性インクの硬化によって形成され、複数のビアホールを有する第2絶縁層と、
前記第2絶縁層上に積層され、回路パターンが形成された第2回路層とを含むことを特徴とする薄型プリント基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040100585A KR100674319B1 (ko) | 2004-12-02 | 2004-12-02 | 얇은 코어층을 갖는 인쇄회로기판 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006165494A JP2006165494A (ja) | 2006-06-22 |
JP4126052B2 true JP4126052B2 (ja) | 2008-07-30 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005117108A Expired - Fee Related JP4126052B2 (ja) | 2004-12-02 | 2005-04-14 | プリント基板の製造方法および薄型プリント基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7346982B2 (ja) |
JP (1) | JP4126052B2 (ja) |
KR (1) | KR100674319B1 (ja) |
CN (1) | CN100508692C (ja) |
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2004
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CN101182448B (zh) * | 2007-11-23 | 2011-05-25 | 大连工业大学 | 无毒河豚鱼鱼鳍酒的制备方法 |
US11486473B2 (en) | 2018-01-31 | 2022-11-01 | Borgwarner Inc. | Variable force tensioner arm with cap disk spring |
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CN1784121A (zh) | 2006-06-07 |
CN100508692C (zh) | 2009-07-01 |
US7346982B2 (en) | 2008-03-25 |
KR20060061953A (ko) | 2006-06-09 |
KR100674319B1 (ko) | 2007-01-24 |
JP2006165494A (ja) | 2006-06-22 |
US20060121256A1 (en) | 2006-06-08 |
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