CN1784121A - 制造具有薄核心层的印刷电路板的方法 - Google Patents
制造具有薄核心层的印刷电路板的方法 Download PDFInfo
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Abstract
所公开的是一种制造PCB的方法。在该方法中,离型膜和半固化片上形成有铜箔的衬底用作基础衬底,并且在制造PCB之后移除核心绝缘层,从而减少最终产品的厚度。
Description
技术领域
本发明涉及制造印刷电路板(PCB)的方法。更具体来说,本发明涉及制造PCB的方法,其中离型膜和半固化片上形成有铜箔的衬底用作基础衬底,并且在制造PCB之后移除核心绝缘层,从而减少最终产品的厚度。
背景技术
根据电子产品的微型化和减重的趋势,封装尺寸趋向于减小。这样,总封装尺寸就依赖于封装所用衬底的尺寸。
图1a-1m为说明以传统叠加方式分步制造六层PCB的截面图。在本发明的说明书中,术语“叠加方式”指包括形成内层并且在内层上依次叠合外层的工艺。
图1a为未加工的覆铜层压板(CCL)101截面图。铜箔102被涂覆在绝缘层103上。通常,覆铜层压板用作PCB的衬底,指由其上薄薄地镀覆铜的绝缘层组成的薄层压板。
根据其用途,覆铜层压板分为玻纤/环氧树脂CCL、耐热树脂CCL、纸/酚醛树脂CCL、高频CCL、柔性CCL(聚酰亚胺膜)、复合CCL等。其中,玻纤/环氧树脂CCL最常用来制造双面PCB和多层PCB。
玻纤/环氧树脂CCL包括增强基础衬底和铜箔,其中环氧树脂(树脂和固化剂的组合物)渗入玻璃纤维中。如国家电子制造协会(NEMA)根据增强基础衬底的类型和耐热性所规定的,玻纤/环氧树脂CCL被分级为FR-1-FR-5。传统上,最常用的是FR-4级的玻纤/环氧树脂CCL,但近来,对提高玻璃化转变温度(Tg)的FR-5级玻纤/环氧树脂CCL的需求正在增加。
在图1b中,覆铜层压板101被打孔以形成用于层间连接的通孔104。
图1c中,进行化学镀铜和电镀铜工艺。这里,化学镀铜工艺在电镀铜工艺之前进行。在电镀铜工艺之前进行化学镀铜工艺的原因在于使用电的电镀铜工艺不可能在绝缘层上进行。换句话说,化学镀铜工艺作为预处理工艺进行以形成进行电镀铜工艺所需的薄导电膜。由于难以进行化学镀铜工艺并保证经济效率,因此优选采用电镀铜工艺来形成电路的导电部分。
接着,将浆料106填入通孔104中,以保护形成在通孔104侧壁上的化学和电镀铜层105。浆料通常由绝缘油墨材料制成,但也可以根据PCB的预期应用由导电浆料制成。导电浆料包括作为主要组分的任意一种金属和有机粘合剂的混合物,所述金属选自Cu、Ag、Au、Sn、Pb、或其合金。然而,根据MLB的用途,用浆料填塞通孔104的工艺可以省略。
图1c中,为便于理解,化学和电镀铜层105被图示为一层,而不相互区分为两层。
图1d中,构建抗蚀图案107以形成用于内部电路的电路图案。
印刷在布线图膜上的电路图案必须转录到衬底上,从而形成抗蚀图案。可通过各种方法进行转录,但最常用的方法为采用紫外线将印刷在布线图膜上的电路图案转录到光敏干膜上。近来,有时会采用液体光敏剂(LPR)来代替干膜。
将转移了电路图案的干膜或LPR作为抗蚀层107,并且当衬底如图1e所示浸入蚀刻液体中时,就形成了电路图案。
形成电路图案之后,使用自动光学检测(AOI)设备观察电路图案外观,从而评估内部电路是否正确形成,并将所得衬底进行表面处理,例如黑氧化物处理。
使用AOI设备自动检测PCB的外观。该设备采用图像传感器并使用计算机的图案识别技术来自动检测PCB的外观。当使用图像传感器读入关于目标电路的信息之后,AOI设备将该信息与对照数据进行比较以评估是否产生缺陷。
可以通过使用AOI设备来检测焊接区(在其上安装部件的PCB区域)圆环的最小值和电源接地状态。此外,可以测量电路图案的宽度并且可以检测孔洞的遗漏。然而,没有可能检测孔洞的内部状态。
在将具有电路图案的内层贴到外层之前,进行黑色氧化物处理以改善粘结强度和耐热性。
图1f中,将覆树脂的铜(RCC)贴到所得衬底的两侧。RCC包括其中铜箔109仅形成在树脂层108单侧的衬底,以及用作电路层之间的绝缘体的树脂层108。
图1g中,形成盲通孔110以将内层和外层相互电连接。盲通孔可机械打孔。然而,有必要比贯通孔的加工更精确地进行打孔,因此,优选采用钇铝石榴石(YAG)激光器或CO2激光器。YAG激光器能够穿孔铜箔和绝缘层,而CO2激光器仅能够穿孔绝缘层。
图1h中,按照镀覆工艺层压外层111。
图1i中,如图1h所形成的外层111按照形成内层电路图案的相同步骤形成图案。然后检测形成图案的外层111的电路,并进行表面处理,如同内层电路图案的情况一样。
图1j中,将附加的RCC贴到所得衬底的两侧。该RCC包括树脂层112和涂覆在树脂层112一侧的铜箔层113,并且树脂层112用作绝缘体。
图1k中,采用上述激光器形成盲通孔114来将外层相互连接。
图1l中,按照镀覆工艺层压附加外层115。
图1m中,根据外层111的相同步骤使附加外层115形成图案,然后检测形成图案的外层115的电路,并将该层进行表面处理。
构成多层PCB的层数可以通过重复层压层、构建电路图案、检测电路图案和表面处理所得结构来连续增加。
接着,在所得电路图案上形成阻焊层和Ni/Au层,从而制造六层PCB。
在制造衬底(PCB)的传统方法中,使用有机树脂作为绝缘层以形成在其两侧镀有Cu的覆铜层压板(CCL)。在此,有机树脂也用作支撑产品以保持其形状的骨架。因此,有必要使产品的厚度为50μm或更多以保持形状。换言之,当厚度为上述极限或更少时,就不可能使用传统有机树脂来制造产品。
相对于此,美国专利No.6,696,764公开了一种在构建PCB之后通过用机械工艺来切割PCB的中心部位来制造两块PCB的方法。然而,由于切割是以机械方法进行,这就限制了制造精确PCB的应用。此外,切割后的留存的核心绝缘层使PCB变厚。
因此,需要提出更根本的替代方案来减少PCB的厚度。
发明内容
因此,本发明针对现有技术中产生的上述缺点,并且本发明的目的在于,提供制造纤薄PCB的方法,其中将传统使用的核心绝缘层从最终产品中移除,从而减少PCB的总厚度。
上述目的可通过提供制造PCB的方法来实现,该方法包括制备基础衬底,所述基础衬底包括核心绝缘层、贴附在核心绝缘层上的离型膜、包围离型膜的层压绝缘体和层压在所得结构上侧和下侧的铜箔;在基础衬底的上侧和下侧形成阻焊层;随后,在所得基础衬底的上侧和下侧依次层压电路层和绝缘层;切割所得衬底的边缘部分,从而移除含有包围离型膜的绝缘体的边缘部分;剥离离型膜以将所得衬底分成两块衬底,从而使该两块衬底从核心绝缘层分离;以及从分离的衬底侧移除暴露的铜箔。
附图说明
结合附图,从以下详细说明可以更清楚地理解的本发明的上述和其他目的、特征和其他优点,其中:
图1a-1m为分步说明以传统叠加方式制造六层PCB的截面图;和
图2a-2n为分步说明根据本发明制造PCB的截面图。
具体实施方式
图2a-2n为分步说明根据本发明制造PCB的截面图。
首先,如图2a所示形成基础衬底200。
离型膜202粘附在核心绝缘层201的上侧和下侧,并且层压绝缘体203从而包围离型膜202。接着,层压铜箔204以覆盖离型膜202和绝缘体203。施加合适的压力和温度到所得衬底的上侧和下侧以压紧所得衬底。
可使用引入到玻璃纤维中构成传统CCL中心层的环氧树脂作为核心绝缘层201。可使用传统PCB制造期间常用作层间绝缘层的半固化片作为绝缘体203。
离型膜202层压在核心绝缘层201上,并且绝缘体203包围离型膜。将铜箔204层压在离型膜202和绝缘体203上。每层铜箔204的厚度约为10μm。
绝缘体203用来物理支撑铜箔204,从而防止铜箔204在PCB制造期间碎裂或撕裂。
图2b中,使用其上印刷有预定电路图案的掩膜来涂覆、曝光和显影光敏阻焊层205以形成图案。曝光期间,由于光被掩膜阻挡,没有受到光照的部分阻焊剂没有转变。然而,受到光照的阻焊层其他部分被光固化。仅将阻焊层的未转变部分移除来形成图案。使用光阻焊剂作为阻焊层205。
图2c中,进行化学镀铜工艺以形成用作电镀铜工艺的种子层的化学镀层206。可以采用喷镀工艺来代替化学镀工艺。
图2d中,使用预定掩膜图案来涂覆、曝光和显影光敏抗镀层207以形成图案。
图2e中,通过电镀工艺形成电路图案208之后,剥除抗镀层207。化学镀层206用作电镀工艺期间电流流动的通路。通过电镀工艺形成的电路图案208厚度约为7-15μm。剥除抗镀层207之后,保留有厚度约为0.3-0.5μm的化学镀层206,和通过电镀工艺形成的、厚度约为7-15μm的电路图案208。
图2f中,通过闪光(flash)蚀刻工艺除去化学镀层206的曝光部分。
图2g中,层压绝缘层209。油墨型或薄板型绝缘体可用作绝缘层209。当使用油墨型绝缘体时,需要湿态涂覆工艺、固化工艺和涂刷工艺。对于薄片型绝缘体来说,层压和固化工艺就足够了。因此,从可加工性和可靠性上说,优选薄片型绝缘体。半固化片可用作薄片形绝缘体。
图2h中,通过激光器对绝缘层209打孔,以贯穿该层形成通孔210,从而使上层和下层相互电连接。接着,进行化学镀工艺以在通孔210的壁上和衬底表面上形成用作种子层的化学镀层211。
图2i中,涂覆、曝光和显影抗镀层以形成图案,并且通过电镀工艺形成电路图案212。接着,剥除抗镀层,并且通过闪光蚀刻工艺除去其上未形成电路图案的部分化学镀层211。
图2j中,将阻焊层213,例如光阻焊剂,涂覆到PCB的整个表面。
图2k中,通过曝光和显影工艺移除要形成外部电路的连接垫的部分阻焊层213,并且使用Ni和Au进行镀覆工艺以形成用来电连接到外部电路的电极垫214。
图2l中,切割PCB的外部部分以除去含有绝缘体203的核心绝缘层的外部部分。
接着,如图2m所示,将包含层压在离型膜202上的结构的所得双面PCB分成两块PCB,即215a、215b。将具有吸力的吸附板或吸板贴到双面PCB的两侧,然后拉伸,从而完成分割。由于离型膜易于从核心绝缘层201和铜箔层204上分离,因此可以用不损坏PCB的低压力来完成分离。因此,没有必要进行切割来分离。
铜箔201a、201b保留在每个分离的PCB的一侧。
图2n中,通过蚀刻工艺移除铜箔201a、201b,从而制成不包括传统CCL中核心绝缘层的两块PCB。核心绝缘层201用来在制造PCB期间保持物理强度,但从最终产品中移除。
在传统PCB中,最终产品中包括厚度至少为60μm或大致如此的核心绝缘层。然而,如图2m所示,绝缘层209,例如半固化片形成在根据本发明的PCB中心,对于绝缘层209的厚度来说,大约30μm就足够了。
如上所述,根据本发明制造纤薄PCB方法的优点在于:从最终产品中移除了传统上使用的核心绝缘层,从而减少了PCB的总厚度。
本发明以说明性的方式进行描述,应该理解为所用术语只是说明性的,而非限制性的。根据上述教导,对本发明进行大量变动和改变是有可能的。因此,应该理解:在所附权利要求的范围内,本发明可以不同于具体所述的方式实施。
Claims (4)
1.一种制造印刷电路板的方法,包括:
制备基础衬底,其包括核心绝缘层、贴附在核心绝缘层上的离型膜、包围离型膜的层压绝缘体和层压在所得结构上侧和下侧的铜箔;
在基础衬底的上侧和下侧形成阻焊层;
在所得基础衬底的上侧和下侧依次层压电路层和绝缘层;
切割所得衬底的边缘部分,从而移除含有包围离型膜的绝缘体的边缘部分;
剥离离型膜,将所得衬底分成两块衬底,从而使该两块衬底从核心绝缘层分离;以及
从分离的衬底侧移除暴露的铜箔。
2.权利要求1所述的方法,其中依次层压电路层和绝缘层包括:
将用来层间绝缘的绝缘层层压在所得基础衬底的上侧和下侧;
在绝缘层上形成通孔和电路图案;
涂覆绝缘阻焊层;以及
形成电极垫。
3.权利要求1所述的方法,其中制备基础衬底包括:
将离型膜贴附到核心绝缘层的上侧和下侧;
层压绝缘体,从而包围离型膜;
将铜箔层压到离型膜和绝缘体的上侧和下侧;以及
压合基础衬底。
4.一种纤薄印刷电路板,包括:
第一绝缘层,其通过固化绝缘油墨形成,并且贯穿该层形成多个第一通孔;
电路层,其形成在第一绝缘层上;
第二绝缘层,其通过固化其它绝缘油墨形成在电路层上,并且贯穿该层形成多个第二通孔;以及
其他电路层,其层压在第二绝缘层上,并且在其上形成有电路图案。
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CN102837481A (zh) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | Pcb板压合工艺 |
CN103984205A (zh) * | 2011-10-21 | 2014-08-13 | 联胜(中国)科技有限公司 | 薄膜图案的制作方法及基板结构 |
CN103984205B (zh) * | 2011-10-21 | 2018-04-27 | 联胜(中国)科技有限公司 | 薄膜图案的制作方法及基板结构 |
CN104284530B (zh) * | 2013-07-11 | 2018-08-17 | 上海美维科技有限公司 | 无芯板工艺制作印制电路板的方法 |
CN104284530A (zh) * | 2013-07-11 | 2015-01-14 | 上海美维科技有限公司 | 无芯板工艺制作印制电路板或集成电路封装基板的方法 |
CN104582241A (zh) * | 2013-10-14 | 2015-04-29 | 三星电机株式会社 | 印制电路板及其制造方法 |
CN105451430A (zh) * | 2014-09-02 | 2016-03-30 | 富葵精密组件(深圳)有限公司 | 部分内埋式线路结构及其制造方法 |
CN107211527A (zh) * | 2014-12-11 | 2017-09-26 | 奥特斯奥地利科技与系统技术有限公司 | 具有嵌入式部件的半柔性印刷电路板 |
US10306750B2 (en) | 2014-12-11 | 2019-05-28 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board and method for manufacturing a circuit board |
CN107708287A (zh) * | 2016-08-08 | 2018-02-16 | 揖斐电株式会社 | 配线板及其制造方法 |
CN108575056A (zh) * | 2017-03-07 | 2018-09-25 | 宏启胜精密电子(秦皇岛)有限公司 | 柔性电路板制作方法 |
CN113068300A (zh) * | 2021-02-26 | 2021-07-02 | 沪士电子股份有限公司 | 一种用于埋嵌线路的载具 |
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JP2006165494A (ja) | 2006-06-22 |
JP4126052B2 (ja) | 2008-07-30 |
KR100674319B1 (ko) | 2007-01-24 |
KR20060061953A (ko) | 2006-06-09 |
US20060121256A1 (en) | 2006-06-08 |
CN100508692C (zh) | 2009-07-01 |
US7346982B2 (en) | 2008-03-25 |
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