JP4102884B2 - プローブカードの調整機構及びプローブ装置 - Google Patents
プローブカードの調整機構及びプローブ装置 Download PDFInfo
- Publication number
- JP4102884B2 JP4102884B2 JP2005140662A JP2005140662A JP4102884B2 JP 4102884 B2 JP4102884 B2 JP 4102884B2 JP 2005140662 A JP2005140662 A JP 2005140662A JP 2005140662 A JP2005140662 A JP 2005140662A JP 4102884 B2 JP4102884 B2 JP 4102884B2
- Authority
- JP
- Japan
- Prior art keywords
- insert ring
- probe card
- probe
- support
- wedge member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 162
- 230000007246 mechanism Effects 0.000 title claims description 151
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000012360 testing method Methods 0.000 description 29
- 238000007689 inspection Methods 0.000 description 8
- 238000003032 molecular docking Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005140662A JP4102884B2 (ja) | 2005-05-13 | 2005-05-13 | プローブカードの調整機構及びプローブ装置 |
| TW095116594A TWI389229B (zh) | 2005-05-13 | 2006-05-10 | Probe card adjustment mechanism and probe device |
| KR1020060042589A KR100787400B1 (ko) | 2005-05-13 | 2006-05-11 | 프로브 카드의 조정 기구 및 프로브 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005140662A JP4102884B2 (ja) | 2005-05-13 | 2005-05-13 | プローブカードの調整機構及びプローブ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006317302A JP2006317302A (ja) | 2006-11-24 |
| JP2006317302A5 JP2006317302A5 (enExample) | 2007-10-11 |
| JP4102884B2 true JP4102884B2 (ja) | 2008-06-18 |
Family
ID=37538106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005140662A Expired - Fee Related JP4102884B2 (ja) | 2005-05-13 | 2005-05-13 | プローブカードの調整機構及びプローブ装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4102884B2 (enExample) |
| KR (1) | KR100787400B1 (enExample) |
| TW (1) | TWI389229B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7471078B2 (en) * | 2006-12-29 | 2008-12-30 | Formfactor, Inc. | Stiffener assembly for use with testing devices |
| KR100851392B1 (ko) * | 2007-03-16 | 2008-08-11 | (주)엠투엔 | 평탄화 수단을 구비한 프로브 카드 |
| JP4209457B1 (ja) | 2008-02-29 | 2009-01-14 | 三菱重工業株式会社 | 常温接合装置 |
| JP5074974B2 (ja) * | 2008-03-25 | 2012-11-14 | 東京エレクトロン株式会社 | プローブ方法及びプローブ方法を記録したプログラム記録媒体 |
| JP4875678B2 (ja) * | 2008-09-01 | 2012-02-15 | 三菱重工業株式会社 | 常温接合装置 |
| JP4875676B2 (ja) * | 2008-09-01 | 2012-02-15 | 三菱重工業株式会社 | 常温接合装置 |
| JP2011064467A (ja) * | 2009-09-15 | 2011-03-31 | Tokyo Electron Ltd | ヘッドプレートのレベリング機構及びプローブ装置 |
| JP5826466B2 (ja) * | 2010-06-25 | 2015-12-02 | 東京エレクトロン株式会社 | プローブカードの平行調整機構及び検査装置 |
| JP5196334B2 (ja) * | 2010-11-29 | 2013-05-15 | ワイアイケー株式会社 | プローブカード固着ユニット |
| CN103869270B (zh) * | 2012-12-12 | 2016-09-28 | 颀中科技(苏州)有限公司 | 探针卡自动维修设备及方法 |
| KR20180075021A (ko) * | 2016-12-26 | 2018-07-04 | 에스케이실트론 주식회사 | 회전 샤프트를 포함하는 웨이퍼 지지대 |
| KR102115179B1 (ko) * | 2018-11-20 | 2020-06-08 | 주식회사 탑 엔지니어링 | 프로브장치 및 프로브 자세 보정 방법 |
| CN112053966B (zh) * | 2019-06-06 | 2025-07-04 | 盛合晶微半导体(江阴)有限公司 | Cp探针机及其调节方法 |
| CN114019334B (zh) * | 2020-07-16 | 2024-09-20 | 京元电子股份有限公司 | 具有水平调整模块的测试设备 |
| KR102272994B1 (ko) * | 2021-02-23 | 2021-07-05 | 주식회사 프로이천 | 미끄럼 체결식 범용 핀보드 조립체 |
| CN114352945B (zh) * | 2021-12-31 | 2023-11-21 | 核动力运行研究所 | 一种candu堆燃料通道压力管检查端部件对接抱卡结构 |
| CN117832152A (zh) * | 2023-12-18 | 2024-04-05 | 深圳镁伽科技有限公司 | 调整机构及加工装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3163221B2 (ja) * | 1993-08-25 | 2001-05-08 | 東京エレクトロン株式会社 | プローブ装置 |
-
2005
- 2005-05-13 JP JP2005140662A patent/JP4102884B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-10 TW TW095116594A patent/TWI389229B/zh not_active IP Right Cessation
- 2006-05-11 KR KR1020060042589A patent/KR100787400B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006317302A (ja) | 2006-11-24 |
| TWI389229B (zh) | 2013-03-11 |
| KR100787400B1 (ko) | 2007-12-21 |
| KR20060117238A (ko) | 2006-11-16 |
| TW200644144A (en) | 2006-12-16 |
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