TW200644144A - Mechanism for adjusting probe card, and probe device - Google Patents

Mechanism for adjusting probe card, and probe device

Info

Publication number
TW200644144A
TW200644144A TW095116594A TW95116594A TW200644144A TW 200644144 A TW200644144 A TW 200644144A TW 095116594 A TW095116594 A TW 095116594A TW 95116594 A TW95116594 A TW 95116594A TW 200644144 A TW200644144 A TW 200644144A
Authority
TW
Taiwan
Prior art keywords
probe card
adjusting
probe
insert ring
head plate
Prior art date
Application number
TW095116594A
Other languages
Chinese (zh)
Other versions
TWI389229B (en
Inventor
Munetoshi Nagasaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200644144A publication Critical patent/TW200644144A/en
Application granted granted Critical
Publication of TWI389229B publication Critical patent/TWI389229B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Abstract

To simply and smoothly adjust a parallelism between a probe card and an object to be tested for a short time, and to surely maintain the accuracy after adjusting it during a test. A probe system 10 is equipped with: the probe card 11; an insert ring 13 for supporting the probe card 11; a head plate 14 for supporting the insert ring 13; and an adjusting mechanism 16 which is interposed between the insert ring 13 and the head plate 14, and has first and second support mechanisms 161, 162 for adjusting the parallelism between the probe card 11 and a wafer W set on a wafer chuck 15. The second support mechanism 162 has a wedge member 162A which is disposed above the head plate 14 and moves the insert ring 13 up and down.
TW095116594A 2005-05-13 2006-05-10 Probe card adjustment mechanism and probe device TWI389229B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005140662A JP4102884B2 (en) 2005-05-13 2005-05-13 Probe card adjustment mechanism and probe device

Publications (2)

Publication Number Publication Date
TW200644144A true TW200644144A (en) 2006-12-16
TWI389229B TWI389229B (en) 2013-03-11

Family

ID=37538106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116594A TWI389229B (en) 2005-05-13 2006-05-10 Probe card adjustment mechanism and probe device

Country Status (3)

Country Link
JP (1) JP4102884B2 (en)
KR (1) KR100787400B1 (en)
TW (1) TWI389229B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102298079A (en) * 2010-06-25 2011-12-28 东京毅力科创株式会社 Parallel adjusting mechanism and inspecting device of probe card
TWI458983B (en) * 2006-12-29 2014-11-01 Formfactor Inc Stiffener for use with testing devices and probe card assembly
TWI658533B (en) * 2016-12-26 2019-05-01 南韓商愛思開矽得榮股份有限公司 Wafer stage including rotary shaft

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100851392B1 (en) * 2007-03-16 2008-08-11 (주)엠투엔 Probe card having planarization means
JP4209457B1 (en) 2008-02-29 2009-01-14 三菱重工業株式会社 Room temperature bonding equipment
JP5074974B2 (en) * 2008-03-25 2012-11-14 東京エレクトロン株式会社 PROBE METHOD AND PROGRAM RECORDING MEDIUM CONTAINING PROBE METHOD
JP4875676B2 (en) * 2008-09-01 2012-02-15 三菱重工業株式会社 Room temperature bonding equipment
JP4875678B2 (en) * 2008-09-01 2012-02-15 三菱重工業株式会社 Room temperature bonding equipment
JP2011064467A (en) * 2009-09-15 2011-03-31 Tokyo Electron Ltd Leveling mechanism for head plate and probe device
JP5196334B2 (en) * 2010-11-29 2013-05-15 ワイアイケー株式会社 Probe card fixing unit
CN103869270B (en) * 2012-12-12 2016-09-28 颀中科技（苏州）有限公司 The automatic maintenance of equipment of probe card and method
KR102115179B1 (en) * 2018-11-20 2020-06-08 주식회사 탑 엔지니어링 Probe device and method for calibrating probe
CN114019334A (en) * 2020-07-16 2022-02-08 京元电子股份有限公司 Test equipment with horizontal adjustment module
KR102272994B1 (en) * 2021-02-23 2021-07-05 주식회사 프로이천 Slip Fastening General Purpose Pinboard Assembly
CN114352945B (en) * 2021-12-31 2023-11-21 核动力运行研究所 CANDU stacks fuel passage pressure pipe inspection end part butt joint embraces card structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163221B2 (en) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 Probe device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458983B (en) * 2006-12-29 2014-11-01 Formfactor Inc Stiffener for use with testing devices and probe card assembly
CN102298079A (en) * 2010-06-25 2011-12-28 东京毅力科创株式会社 Parallel adjusting mechanism and inspecting device of probe card
TWI658533B (en) * 2016-12-26 2019-05-01 南韓商愛思開矽得榮股份有限公司 Wafer stage including rotary shaft

Also Published As

Publication number Publication date
JP4102884B2 (en) 2008-06-18
JP2006317302A (en) 2006-11-24
KR20060117238A (en) 2006-11-16
KR100787400B1 (en) 2007-12-21
TWI389229B (en) 2013-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees