KR100787400B1 - 프로브 카드의 조정 기구 및 프로브 장치 - Google Patents

프로브 카드의 조정 기구 및 프로브 장치 Download PDF

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Publication number
KR100787400B1
KR100787400B1 KR1020060042589A KR20060042589A KR100787400B1 KR 100787400 B1 KR100787400 B1 KR 100787400B1 KR 1020060042589 A KR1020060042589 A KR 1020060042589A KR 20060042589 A KR20060042589 A KR 20060042589A KR 100787400 B1 KR100787400 B1 KR 100787400B1
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KR
South Korea
Prior art keywords
probe card
insertion ring
probe
head plate
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060042589A
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English (en)
Korean (ko)
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KR20060117238A (ko
Inventor
무네토시 나가사카
Original Assignee
동경 엘렉트론 주식회사
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Publication date
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20060117238A publication Critical patent/KR20060117238A/ko
Application granted granted Critical
Publication of KR100787400B1 publication Critical patent/KR100787400B1/ko
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020060042589A 2005-05-13 2006-05-11 프로브 카드의 조정 기구 및 프로브 장치 Expired - Fee Related KR100787400B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005140662A JP4102884B2 (ja) 2005-05-13 2005-05-13 プローブカードの調整機構及びプローブ装置
JPJP-P-2005-00140662 2005-05-13

Publications (2)

Publication Number Publication Date
KR20060117238A KR20060117238A (ko) 2006-11-16
KR100787400B1 true KR100787400B1 (ko) 2007-12-21

Family

ID=37538106

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060042589A Expired - Fee Related KR100787400B1 (ko) 2005-05-13 2006-05-11 프로브 카드의 조정 기구 및 프로브 장치

Country Status (3)

Country Link
JP (1) JP4102884B2 (enExample)
KR (1) KR100787400B1 (enExample)
TW (1) TWI389229B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
KR100851392B1 (ko) * 2007-03-16 2008-08-11 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
JP4209457B1 (ja) 2008-02-29 2009-01-14 三菱重工業株式会社 常温接合装置
JP5074974B2 (ja) * 2008-03-25 2012-11-14 東京エレクトロン株式会社 プローブ方法及びプローブ方法を記録したプログラム記録媒体
JP4875678B2 (ja) * 2008-09-01 2012-02-15 三菱重工業株式会社 常温接合装置
JP4875676B2 (ja) * 2008-09-01 2012-02-15 三菱重工業株式会社 常温接合装置
JP2011064467A (ja) * 2009-09-15 2011-03-31 Tokyo Electron Ltd ヘッドプレートのレベリング機構及びプローブ装置
JP5826466B2 (ja) * 2010-06-25 2015-12-02 東京エレクトロン株式会社 プローブカードの平行調整機構及び検査装置
JP5196334B2 (ja) * 2010-11-29 2013-05-15 ワイアイケー株式会社 プローブカード固着ユニット
CN103869270B (zh) * 2012-12-12 2016-09-28 颀中科技（苏州）有限公司 探针卡自动维修设备及方法
KR20180075021A (ko) * 2016-12-26 2018-07-04 에스케이실트론 주식회사 회전 샤프트를 포함하는 웨이퍼 지지대
KR102115179B1 (ko) * 2018-11-20 2020-06-08 주식회사 탑 엔지니어링 프로브장치 및 프로브 자세 보정 방법
CN112053966B (zh) * 2019-06-06 2025-07-04 盛合晶微半导体(江阴)有限公司 Cp探针机及其调节方法
CN114019334B (zh) * 2020-07-16 2024-09-20 京元电子股份有限公司 具有水平调整模块的测试设备
KR102272994B1 (ko) * 2021-02-23 2021-07-05 주식회사 프로이천 미끄럼 체결식 범용 핀보드 조립체
CN114352945B (zh) * 2021-12-31 2023-11-21 核动力运行研究所 一种candu堆燃料通道压力管检查端部件对接抱卡结构
CN117832152A (zh) * 2023-12-18 2024-04-05 深圳镁伽科技有限公司 调整机构及加工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231018A (ja) * 1993-08-25 1995-08-29 Tokyo Electron Ltd プローブ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231018A (ja) * 1993-08-25 1995-08-29 Tokyo Electron Ltd プローブ装置

Also Published As

Publication number Publication date
JP2006317302A (ja) 2006-11-24
TWI389229B (zh) 2013-03-11
KR20060117238A (ko) 2006-11-16
TW200644144A (en) 2006-12-16
JP4102884B2 (ja) 2008-06-18

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