TWI389229B - Probe card adjustment mechanism and probe device - Google Patents

Probe card adjustment mechanism and probe device Download PDF

Info

Publication number
TWI389229B
TWI389229B TW095116594A TW95116594A TWI389229B TW I389229 B TWI389229 B TW I389229B TW 095116594 A TW095116594 A TW 095116594A TW 95116594 A TW95116594 A TW 95116594A TW I389229 B TWI389229 B TW I389229B
Authority
TW
Taiwan
Prior art keywords
probe card
insertion ring
probe
support
wedge member
Prior art date
Application number
TW095116594A
Other languages
English (en)
Chinese (zh)
Other versions
TW200644144A (en
Inventor
Munetoshi Nagasaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200644144A publication Critical patent/TW200644144A/zh
Application granted granted Critical
Publication of TWI389229B publication Critical patent/TWI389229B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW095116594A 2005-05-13 2006-05-10 Probe card adjustment mechanism and probe device TWI389229B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005140662A JP4102884B2 (ja) 2005-05-13 2005-05-13 プローブカードの調整機構及びプローブ装置

Publications (2)

Publication Number Publication Date
TW200644144A TW200644144A (en) 2006-12-16
TWI389229B true TWI389229B (zh) 2013-03-11

Family

ID=37538106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116594A TWI389229B (zh) 2005-05-13 2006-05-10 Probe card adjustment mechanism and probe device

Country Status (3)

Country Link
JP (1) JP4102884B2 (enExample)
KR (1) KR100787400B1 (enExample)
TW (1) TWI389229B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
KR100851392B1 (ko) * 2007-03-16 2008-08-11 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
JP4209457B1 (ja) 2008-02-29 2009-01-14 三菱重工業株式会社 常温接合装置
JP5074974B2 (ja) * 2008-03-25 2012-11-14 東京エレクトロン株式会社 プローブ方法及びプローブ方法を記録したプログラム記録媒体
JP4875678B2 (ja) * 2008-09-01 2012-02-15 三菱重工業株式会社 常温接合装置
JP4875676B2 (ja) * 2008-09-01 2012-02-15 三菱重工業株式会社 常温接合装置
JP2011064467A (ja) * 2009-09-15 2011-03-31 Tokyo Electron Ltd ヘッドプレートのレベリング機構及びプローブ装置
JP5826466B2 (ja) * 2010-06-25 2015-12-02 東京エレクトロン株式会社 プローブカードの平行調整機構及び検査装置
JP5196334B2 (ja) * 2010-11-29 2013-05-15 ワイアイケー株式会社 プローブカード固着ユニット
CN103869270B (zh) * 2012-12-12 2016-09-28 颀中科技（苏州）有限公司 探针卡自动维修设备及方法
KR20180075021A (ko) * 2016-12-26 2018-07-04 에스케이실트론 주식회사 회전 샤프트를 포함하는 웨이퍼 지지대
KR102115179B1 (ko) * 2018-11-20 2020-06-08 주식회사 탑 엔지니어링 프로브장치 및 프로브 자세 보정 방법
CN112053966B (zh) * 2019-06-06 2025-07-04 盛合晶微半导体(江阴)有限公司 Cp探针机及其调节方法
CN114019334B (zh) * 2020-07-16 2024-09-20 京元电子股份有限公司 具有水平调整模块的测试设备
KR102272994B1 (ko) * 2021-02-23 2021-07-05 주식회사 프로이천 미끄럼 체결식 범용 핀보드 조립체
CN114352945B (zh) * 2021-12-31 2023-11-21 核动力运行研究所 一种candu堆燃料通道压力管检查端部件对接抱卡结构
CN117832152A (zh) * 2023-12-18 2024-04-05 深圳镁伽科技有限公司 调整机构及加工装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置

Also Published As

Publication number Publication date
JP2006317302A (ja) 2006-11-24
KR100787400B1 (ko) 2007-12-21
KR20060117238A (ko) 2006-11-16
TW200644144A (en) 2006-12-16
JP4102884B2 (ja) 2008-06-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees