JP4078163B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4078163B2
JP4078163B2 JP2002269075A JP2002269075A JP4078163B2 JP 4078163 B2 JP4078163 B2 JP 4078163B2 JP 2002269075 A JP2002269075 A JP 2002269075A JP 2002269075 A JP2002269075 A JP 2002269075A JP 4078163 B2 JP4078163 B2 JP 4078163B2
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JP
Japan
Prior art keywords
cleaning liquid
cleaning
substrate
wafer
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002269075A
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English (en)
Japanese (ja)
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JP2004111487A5 (enExample
JP2004111487A (ja
Inventor
勝彦 宮
昭 泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2002269075A priority Critical patent/JP4078163B2/ja
Priority to US10/659,213 priority patent/US7584760B2/en
Publication of JP2004111487A publication Critical patent/JP2004111487A/ja
Publication of JP2004111487A5 publication Critical patent/JP2004111487A5/ja
Application granted granted Critical
Publication of JP4078163B2 publication Critical patent/JP4078163B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2002269075A 2002-09-13 2002-09-13 基板処理装置 Expired - Lifetime JP4078163B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002269075A JP4078163B2 (ja) 2002-09-13 2002-09-13 基板処理装置
US10/659,213 US7584760B2 (en) 2002-09-13 2003-09-10 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002269075A JP4078163B2 (ja) 2002-09-13 2002-09-13 基板処理装置

Publications (3)

Publication Number Publication Date
JP2004111487A JP2004111487A (ja) 2004-04-08
JP2004111487A5 JP2004111487A5 (enExample) 2005-10-27
JP4078163B2 true JP4078163B2 (ja) 2008-04-23

Family

ID=32267117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002269075A Expired - Lifetime JP4078163B2 (ja) 2002-09-13 2002-09-13 基板処理装置

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JP (1) JP4078163B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230067103A1 (en) * 2021-08-24 2023-03-02 Deviceeng Co. Ltd Substrate treatment apparatus having bowl assembly

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7584760B2 (en) 2002-09-13 2009-09-08 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP4146709B2 (ja) * 2002-10-31 2008-09-10 大日本スクリーン製造株式会社 基板処理装置
JP4488506B2 (ja) 2004-08-30 2010-06-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2006114884A (ja) * 2004-09-17 2006-04-27 Ebara Corp 基板洗浄処理装置及び基板処理ユニット
KR100752246B1 (ko) 2005-03-31 2007-08-29 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
KR100637719B1 (ko) 2005-10-05 2006-10-25 세메스 주식회사 기판 처리 장치
KR100637720B1 (ko) 2005-10-26 2006-10-25 세메스 주식회사 기판 처리 장치
KR100727703B1 (ko) 2005-12-06 2007-06-13 동부일렉트로닉스 주식회사 반도체 소자 제조용 케미컬 공급장치
JP4763567B2 (ja) 2006-10-03 2011-08-31 大日本スクリーン製造株式会社 基板処理装置
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
DE202010015018U1 (de) * 2010-11-07 2011-04-14 Bohnet, Hans Anordnung zur Herstellung von strukturierten Substraten
JP5890108B2 (ja) * 2011-04-27 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 洗浄処理方法
US20130255724A1 (en) * 2012-03-30 2013-10-03 Semes Co., Ltd. Apparatus for treating substrate
JP6961362B2 (ja) * 2017-03-03 2021-11-05 東京エレクトロン株式会社 基板処理装置
JP6782185B2 (ja) * 2017-03-21 2020-11-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7337633B2 (ja) * 2019-09-30 2023-09-04 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN112201593B (zh) * 2020-09-23 2024-06-21 北京北方华创微电子装备有限公司 晶圆清洗设备
KR102615758B1 (ko) * 2021-05-10 2023-12-19 세메스 주식회사 기판 처리 장치 및 방법
JP7702831B2 (ja) * 2021-08-18 2025-07-04 株式会社ディスコ 加工装置
CN115050643A (zh) * 2022-08-15 2022-09-13 宁波润华全芯微电子设备有限公司 一种湿法刻蚀装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0434902Y2 (enExample) * 1987-01-13 1992-08-19
JPH05243202A (ja) * 1992-01-07 1993-09-21 Nec Corp 枚葉式半導体製造ウェット処理装置
JPH10137664A (ja) * 1996-11-15 1998-05-26 Dainippon Screen Mfg Co Ltd 回転式基板処理装置および処理方法
JP3731995B2 (ja) * 1997-12-04 2006-01-05 大日本スクリーン製造株式会社 基板処理装置
JP3739225B2 (ja) * 1998-12-22 2006-01-25 大日本スクリーン製造株式会社 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230067103A1 (en) * 2021-08-24 2023-03-02 Deviceeng Co. Ltd Substrate treatment apparatus having bowl assembly
US12308256B2 (en) * 2021-08-24 2025-05-20 Deviceeng Co., Ltd. Substrate treatment apparatus having bowl assembly

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Publication number Publication date
JP2004111487A (ja) 2004-04-08

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