JP3973864B2 - 冷却装置付きプリント基板ユニットおよび電子機器 - Google Patents

冷却装置付きプリント基板ユニットおよび電子機器 Download PDF

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Publication number
JP3973864B2
JP3973864B2 JP2001281683A JP2001281683A JP3973864B2 JP 3973864 B2 JP3973864 B2 JP 3973864B2 JP 2001281683 A JP2001281683 A JP 2001281683A JP 2001281683 A JP2001281683 A JP 2001281683A JP 3973864 B2 JP3973864 B2 JP 3973864B2
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JP
Japan
Prior art keywords
circuit board
printed circuit
fan
fan case
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001281683A
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English (en)
Japanese (ja)
Other versions
JP2003092483A (ja
JP2003092483A5 (https=
Inventor
敦子 田中
益生 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2001281683A priority Critical patent/JP3973864B2/ja
Priority to US10/096,509 priority patent/US6665181B2/en
Publication of JP2003092483A publication Critical patent/JP2003092483A/ja
Priority to US10/664,933 priority patent/US6909604B2/en
Priority to US11/120,979 priority patent/US7019970B2/en
Publication of JP2003092483A5 publication Critical patent/JP2003092483A5/ja
Priority to US11/369,840 priority patent/US7298616B2/en
Application granted granted Critical
Publication of JP3973864B2 publication Critical patent/JP3973864B2/ja
Priority to US11/905,895 priority patent/US7474533B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2001281683A 2001-09-17 2001-09-17 冷却装置付きプリント基板ユニットおよび電子機器 Expired - Fee Related JP3973864B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001281683A JP3973864B2 (ja) 2001-09-17 2001-09-17 冷却装置付きプリント基板ユニットおよび電子機器
US10/096,509 US6665181B2 (en) 2001-09-17 2002-03-13 Cooling device capable of reducing thickness of electronic apparatus
US10/664,933 US6909604B2 (en) 2001-09-17 2003-09-22 Cooling device capable of reducing thickness of electronic apparatus
US11/120,979 US7019970B2 (en) 2001-09-17 2005-05-04 Cooling device capable of reducing thickness of electronic apparatus
US11/369,840 US7298616B2 (en) 2001-09-17 2006-03-08 Cooling device capable of reducing thickness of electronic apparatus
US11/905,895 US7474533B2 (en) 2001-09-17 2007-10-05 Cooling device capable of reducing thickness of electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001281683A JP3973864B2 (ja) 2001-09-17 2001-09-17 冷却装置付きプリント基板ユニットおよび電子機器

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006201126A Division JP4588672B2 (ja) 2006-07-24 2006-07-24 冷却装置付きプリント基板ユニットおよび電子機器
JP2007127413A Division JP4588741B2 (ja) 2007-05-11 2007-05-11 冷却装置付きプリント基板ユニットおよび電子機器

Publications (3)

Publication Number Publication Date
JP2003092483A JP2003092483A (ja) 2003-03-28
JP2003092483A5 JP2003092483A5 (https=) 2005-10-20
JP3973864B2 true JP3973864B2 (ja) 2007-09-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001281683A Expired - Fee Related JP3973864B2 (ja) 2001-09-17 2001-09-17 冷却装置付きプリント基板ユニットおよび電子機器

Country Status (2)

Country Link
US (4) US6665181B2 (https=)
JP (1) JP3973864B2 (https=)

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WO2009144823A1 (ja) * 2008-05-30 2009-12-03 富士通株式会社 電子機器の放熱構造およびこれを備えた電子機器
JP5071275B2 (ja) * 2008-06-27 2012-11-14 富士通株式会社 電子機器
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CN101968670A (zh) * 2009-07-27 2011-02-09 鸿富锦精密工业（深圳）有限公司 电脑一体机
JP4865020B2 (ja) * 2009-09-11 2012-02-01 株式会社東芝 電子機器
CN102023690A (zh) * 2009-09-15 2011-04-20 鸿富锦精密工业（深圳）有限公司 电子设备
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JP4982590B2 (ja) * 2010-06-18 2012-07-25 株式会社東芝 表示装置及び電子機器
JP4818452B2 (ja) * 2010-07-23 2011-11-16 株式会社東芝 電子機器
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JP4922467B2 (ja) * 2011-08-26 2012-04-25 株式会社東芝 電子機器
US8593809B2 (en) * 2012-03-15 2013-11-26 Google Inc. Active cooling fan
JP5066294B2 (ja) * 2012-04-13 2012-11-07 株式会社東芝 電子機器
JP2013251721A (ja) * 2012-05-31 2013-12-12 Toshiba Corp テレビジョン受像機および電子機器
JP5991125B2 (ja) * 2012-09-28 2016-09-14 富士通株式会社 電子機器
KR101474616B1 (ko) * 2012-11-02 2014-12-18 삼성전기주식회사 전력반도체장치의 방열시스템
JP6204210B2 (ja) * 2014-01-28 2017-09-27 株式会社ミツバ モータユニット、減速機構付モータ、およびスライドドア自動開閉装置
CN104007803A (zh) * 2014-06-09 2014-08-27 常州市武进翔宇电子元器件有限公司 电源适配器
CN104254195A (zh) * 2014-09-17 2014-12-31 苏州合欣美电子科技有限公司 一种主动散热式pcb板
CN104656861B (zh) * 2015-03-02 2017-10-10 朱金凤 高密封抽风式散热器
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CN106211709A (zh) * 2016-06-30 2016-12-07 铜陵海源超微粉体有限公司 粉体干燥方法
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Also Published As

Publication number Publication date
US6665181B2 (en) 2003-12-16
JP2003092483A (ja) 2003-03-28
US20060146495A1 (en) 2006-07-06
US7019970B2 (en) 2006-03-28
US20050207113A1 (en) 2005-09-22
US7298616B2 (en) 2007-11-20
US20030053296A1 (en) 2003-03-20
US20040095725A1 (en) 2004-05-20
US6909604B2 (en) 2005-06-21

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