JP3972902B2 - 回路基板の製造方法および製造装置 - Google Patents

回路基板の製造方法および製造装置 Download PDF

Info

Publication number
JP3972902B2
JP3972902B2 JP2003433147A JP2003433147A JP3972902B2 JP 3972902 B2 JP3972902 B2 JP 3972902B2 JP 2003433147 A JP2003433147 A JP 2003433147A JP 2003433147 A JP2003433147 A JP 2003433147A JP 3972902 B2 JP3972902 B2 JP 3972902B2
Authority
JP
Japan
Prior art keywords
circuit board
manufacturing
mask film
squeegee
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003433147A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005191410A (ja
Inventor
敏昭 竹中
俊和 近藤
幸弘 平石
邦雄 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003433147A priority Critical patent/JP3972902B2/ja
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to CNB2004800021657A priority patent/CN100482045C/zh
Priority to KR1020057013177A priority patent/KR100655731B1/ko
Priority to EP04807052A priority patent/EP1587351A4/en
Priority to PCT/JP2004/018693 priority patent/WO2005065001A1/ja
Priority to US10/540,606 priority patent/US8211494B2/en
Priority to TW093139192A priority patent/TW200526101A/zh
Publication of JP2005191410A publication Critical patent/JP2005191410A/ja
Application granted granted Critical
Publication of JP3972902B2 publication Critical patent/JP3972902B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2003433147A 2003-12-26 2003-12-26 回路基板の製造方法および製造装置 Expired - Fee Related JP3972902B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003433147A JP3972902B2 (ja) 2003-12-26 2003-12-26 回路基板の製造方法および製造装置
KR1020057013177A KR100655731B1 (ko) 2003-12-26 2004-12-15 회로 기판의 제조 방법 및 제조 장치
EP04807052A EP1587351A4 (en) 2003-12-26 2004-12-15 METHOD AND DEVICE FOR PRODUCING A CONDUCTOR PLATE
PCT/JP2004/018693 WO2005065001A1 (ja) 2003-12-26 2004-12-15 回路基板の製造方法および製造装置
CNB2004800021657A CN100482045C (zh) 2003-12-26 2004-12-15 电路基板的制造方法以及制造装置
US10/540,606 US8211494B2 (en) 2003-12-26 2004-12-15 Method and apparatus for manufacturing circuit board
TW093139192A TW200526101A (en) 2003-12-26 2004-12-16 Method and apparatus for manufacturing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003433147A JP3972902B2 (ja) 2003-12-26 2003-12-26 回路基板の製造方法および製造装置

Publications (2)

Publication Number Publication Date
JP2005191410A JP2005191410A (ja) 2005-07-14
JP3972902B2 true JP3972902B2 (ja) 2007-09-05

Family

ID=34736504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003433147A Expired - Fee Related JP3972902B2 (ja) 2003-12-26 2003-12-26 回路基板の製造方法および製造装置

Country Status (7)

Country Link
US (1) US8211494B2 (cg-RX-API-DMAC7.html)
EP (1) EP1587351A4 (cg-RX-API-DMAC7.html)
JP (1) JP3972902B2 (cg-RX-API-DMAC7.html)
KR (1) KR100655731B1 (cg-RX-API-DMAC7.html)
CN (1) CN100482045C (cg-RX-API-DMAC7.html)
TW (1) TW200526101A (cg-RX-API-DMAC7.html)
WO (1) WO2005065001A1 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005011545A1 (de) * 2005-03-10 2006-09-21 Lpkf Laser & Electronics Ag Verfahren zur Kontaktierung von Leiterbahnen einer Leiterplatte
JP2011049664A (ja) * 2009-08-25 2011-03-10 Seiko Instruments Inc パッケージの製造方法、圧電振動子の製造方法、発振器、電子機器および電波時計
NL2003627C2 (en) * 2009-10-12 2011-04-13 Stork Prints Bv Screen printing.
CN103517558B (zh) * 2012-06-20 2017-03-22 碁鼎科技秦皇岛有限公司 封装基板制作方法
KR101527941B1 (ko) * 2015-03-17 2015-06-11 김창열 다층 구조의 반도체 디바이스 테스트 보드의 수리방법
CN107264008B (zh) * 2017-07-05 2019-07-16 京东方科技集团股份有限公司 一种印刷掩膜板及胶液图案的印刷方法
US20230142411A1 (en) * 2020-04-23 2023-05-11 Lg Innotek Co., Ltd. Deposition mask made of metal for oled pixel deposition and method for manufacturing deposition mask
CN111629519B (zh) * 2020-05-18 2021-04-09 微智医疗器械有限公司 芯片与电路板的连接方法、电路板组件及电子设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103862U (cg-RX-API-DMAC7.html) 1980-12-19 1982-06-26
JPS57103862A (en) * 1980-12-19 1982-06-28 Fuji Xerox Co Ltd Heat sensitive recording head
JP2629067B2 (ja) 1990-10-11 1997-07-09 東洋インキ製造株式会社 モノアゾレーキ顔料および印刷インキ組成物
JPH05177811A (ja) * 1992-01-06 1993-07-20 Furukawa Electric Co Ltd:The 印刷マスクのクリーニング方法およびその装置
JP2601128B2 (ja) 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
JPH05338370A (ja) * 1992-06-10 1993-12-21 Dainippon Screen Mfg Co Ltd スクリーン印刷用メタルマスク版
JP2768236B2 (ja) 1993-10-08 1998-06-25 松下電器産業株式会社 多層基板の製造方法
US6395335B2 (en) * 1996-12-10 2002-05-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for printing solder paste
JP3533596B2 (ja) 1999-06-25 2004-05-31 日本特殊陶業株式会社 配線基板の製造方法
JP3459380B2 (ja) 1999-06-30 2003-10-20 日本特殊陶業株式会社 プリント配線板の製造方法及びマスク
JP3292194B2 (ja) 2000-02-01 2002-06-17 松下電器産業株式会社 印刷用版およびそれを用いた印刷方法
US6638363B2 (en) * 2000-11-22 2003-10-28 Gunter Erdmann Method of cleaning solder paste
JP3721982B2 (ja) * 2000-12-04 2005-11-30 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造装置
JP2003033967A (ja) 2001-07-23 2003-02-04 Pearl Kogyo Kk 樹脂材の加工方法及び加工装置
WO2004028823A1 (ja) * 2002-09-24 2004-04-08 Matsushita Electric Industrial Co., Ltd. 印刷用版、回路基板および回路基板への印刷方法

Also Published As

Publication number Publication date
WO2005065001A1 (ja) 2005-07-14
US20060115583A1 (en) 2006-06-01
KR100655731B1 (ko) 2006-12-11
TW200526101A (en) 2005-08-01
TWI335196B (cg-RX-API-DMAC7.html) 2010-12-21
KR20060006998A (ko) 2006-01-23
US8211494B2 (en) 2012-07-03
JP2005191410A (ja) 2005-07-14
CN1739322A (zh) 2006-02-22
EP1587351A4 (en) 2009-04-01
CN100482045C (zh) 2009-04-22
EP1587351A1 (en) 2005-10-19

Similar Documents

Publication Publication Date Title
JP3292194B2 (ja) 印刷用版およびそれを用いた印刷方法
JP3972902B2 (ja) 回路基板の製造方法および製造装置
CN1318228C (zh) 印刷用版、电路基板以及对电路基板的印刷方法
JP2768236B2 (ja) 多層基板の製造方法
KR100748208B1 (ko) 연성회로기판의 라미네이팅 장치 및 그 방법
CN101048031B (zh) 印刷用版、电路基板以及对电路基板的印刷方法
JP3654279B2 (ja) 回路基板および回路基板への印刷方法
JP3732905B2 (ja) 回路基板の製造装置
CN1698403B (zh) 基板的制造方法
JP4395741B2 (ja) 多層基板の製造方法
JP5124977B2 (ja) ペースト充填方法
CN119562452B (zh) 一种电路板台阶槽处理方法
JP4465962B2 (ja) 基板の製造方法
JP5011784B2 (ja) 印刷用版およびそれを用いた印刷方法
JPH11238958A (ja) 回路基板の製造方法及び製造装置
JP4151416B2 (ja) 基板の製造装置およびそれを用いた基板の製造方法
KR20250092667A (ko) 전자파 흡수 복합소재 제조장치
JP2009234223A (ja) 銅張積層板およびこれを用いた配線基板の製造方法ならびに銅張積層板の端面処理方法およびこれに用いる端面処理装置
JP2003158366A (ja) 回路形成基板の製造装置とそれを用いた回路形成基板の製造方法
JP2015002311A (ja) プリント配線板の製造方法およびプリント配線板用ペースト充填機
JPH0473147A (ja) 積層板の製造装置
JPH0473146A (ja) 積層板の製造装置

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050708

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070424

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070522

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070604

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100622

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100622

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110622

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120622

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120622

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130622

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees