TWI335196B - - Google Patents

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Publication number
TWI335196B
TWI335196B TW093139192A TW93139192A TWI335196B TW I335196 B TWI335196 B TW I335196B TW 093139192 A TW093139192 A TW 093139192A TW 93139192 A TW93139192 A TW 93139192A TW I335196 B TWI335196 B TW I335196B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
board according
blade
squeegee
Prior art date
Application number
TW093139192A
Other languages
English (en)
Chinese (zh)
Other versions
TW200526101A (en
Inventor
Toshiaki Takenaka
Toshikazu Kondo
Yukihiro Hiraishi
Kunio Kishimoto
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW200526101A publication Critical patent/TW200526101A/zh
Application granted granted Critical
Publication of TWI335196B publication Critical patent/TWI335196B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW093139192A 2003-12-26 2004-12-16 Method and apparatus for manufacturing circuit board TW200526101A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003433147A JP3972902B2 (ja) 2003-12-26 2003-12-26 回路基板の製造方法および製造装置

Publications (2)

Publication Number Publication Date
TW200526101A TW200526101A (en) 2005-08-01
TWI335196B true TWI335196B (cg-RX-API-DMAC7.html) 2010-12-21

Family

ID=34736504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139192A TW200526101A (en) 2003-12-26 2004-12-16 Method and apparatus for manufacturing circuit board

Country Status (7)

Country Link
US (1) US8211494B2 (cg-RX-API-DMAC7.html)
EP (1) EP1587351A4 (cg-RX-API-DMAC7.html)
JP (1) JP3972902B2 (cg-RX-API-DMAC7.html)
KR (1) KR100655731B1 (cg-RX-API-DMAC7.html)
CN (1) CN100482045C (cg-RX-API-DMAC7.html)
TW (1) TW200526101A (cg-RX-API-DMAC7.html)
WO (1) WO2005065001A1 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005011545A1 (de) * 2005-03-10 2006-09-21 Lpkf Laser & Electronics Ag Verfahren zur Kontaktierung von Leiterbahnen einer Leiterplatte
JP2011049664A (ja) * 2009-08-25 2011-03-10 Seiko Instruments Inc パッケージの製造方法、圧電振動子の製造方法、発振器、電子機器および電波時計
NL2003627C2 (en) * 2009-10-12 2011-04-13 Stork Prints Bv Screen printing.
CN103517558B (zh) * 2012-06-20 2017-03-22 碁鼎科技秦皇岛有限公司 封装基板制作方法
KR101527941B1 (ko) * 2015-03-17 2015-06-11 김창열 다층 구조의 반도체 디바이스 테스트 보드의 수리방법
CN107264008B (zh) * 2017-07-05 2019-07-16 京东方科技集团股份有限公司 一种印刷掩膜板及胶液图案的印刷方法
US20230142411A1 (en) * 2020-04-23 2023-05-11 Lg Innotek Co., Ltd. Deposition mask made of metal for oled pixel deposition and method for manufacturing deposition mask
CN111629519B (zh) * 2020-05-18 2021-04-09 微智医疗器械有限公司 芯片与电路板的连接方法、电路板组件及电子设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103862U (cg-RX-API-DMAC7.html) 1980-12-19 1982-06-26
JPS57103862A (en) * 1980-12-19 1982-06-28 Fuji Xerox Co Ltd Heat sensitive recording head
JP2629067B2 (ja) 1990-10-11 1997-07-09 東洋インキ製造株式会社 モノアゾレーキ顔料および印刷インキ組成物
JPH05177811A (ja) * 1992-01-06 1993-07-20 Furukawa Electric Co Ltd:The 印刷マスクのクリーニング方法およびその装置
JP2601128B2 (ja) 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
JPH05338370A (ja) * 1992-06-10 1993-12-21 Dainippon Screen Mfg Co Ltd スクリーン印刷用メタルマスク版
JP2768236B2 (ja) 1993-10-08 1998-06-25 松下電器産業株式会社 多層基板の製造方法
US6395335B2 (en) * 1996-12-10 2002-05-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for printing solder paste
JP3533596B2 (ja) 1999-06-25 2004-05-31 日本特殊陶業株式会社 配線基板の製造方法
JP3459380B2 (ja) 1999-06-30 2003-10-20 日本特殊陶業株式会社 プリント配線板の製造方法及びマスク
JP3292194B2 (ja) 2000-02-01 2002-06-17 松下電器産業株式会社 印刷用版およびそれを用いた印刷方法
US6638363B2 (en) * 2000-11-22 2003-10-28 Gunter Erdmann Method of cleaning solder paste
JP3721982B2 (ja) * 2000-12-04 2005-11-30 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造装置
JP2003033967A (ja) 2001-07-23 2003-02-04 Pearl Kogyo Kk 樹脂材の加工方法及び加工装置
WO2004028823A1 (ja) * 2002-09-24 2004-04-08 Matsushita Electric Industrial Co., Ltd. 印刷用版、回路基板および回路基板への印刷方法

Also Published As

Publication number Publication date
JP3972902B2 (ja) 2007-09-05
WO2005065001A1 (ja) 2005-07-14
US20060115583A1 (en) 2006-06-01
KR100655731B1 (ko) 2006-12-11
TW200526101A (en) 2005-08-01
KR20060006998A (ko) 2006-01-23
US8211494B2 (en) 2012-07-03
JP2005191410A (ja) 2005-07-14
CN1739322A (zh) 2006-02-22
EP1587351A4 (en) 2009-04-01
CN100482045C (zh) 2009-04-22
EP1587351A1 (en) 2005-10-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees