JP3969808B2 - 電気部品供給方法および装置ならびに電気部品装着装置 - Google Patents

電気部品供給方法および装置ならびに電気部品装着装置 Download PDF

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Publication number
JP3969808B2
JP3969808B2 JP29753397A JP29753397A JP3969808B2 JP 3969808 B2 JP3969808 B2 JP 3969808B2 JP 29753397 A JP29753397 A JP 29753397A JP 29753397 A JP29753397 A JP 29753397A JP 3969808 B2 JP3969808 B2 JP 3969808B2
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JP
Japan
Prior art keywords
component
component supply
drive
driven
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP29753397A
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English (en)
Japanese (ja)
Other versions
JPH11135985A (ja
JPH11135985A5 (enExample
Inventor
信介 須原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP29753397A priority Critical patent/JP3969808B2/ja
Priority to US09/179,931 priority patent/US6260260B1/en
Publication of JPH11135985A publication Critical patent/JPH11135985A/ja
Priority to US09/771,996 priority patent/US6665928B2/en
Publication of JPH11135985A5 publication Critical patent/JPH11135985A5/ja
Application granted granted Critical
Publication of JP3969808B2 publication Critical patent/JP3969808B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
JP29753397A 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置 Expired - Lifetime JP3969808B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP29753397A JP3969808B2 (ja) 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置
US09/179,931 US6260260B1 (en) 1997-10-29 1998-10-28 Apparatus for supplying electronic components to a circuit board manufacturing apparatus
US09/771,996 US6665928B2 (en) 1997-10-29 2001-01-30 Method for mounting electric components with a mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29753397A JP3969808B2 (ja) 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置

Publications (3)

Publication Number Publication Date
JPH11135985A JPH11135985A (ja) 1999-05-21
JPH11135985A5 JPH11135985A5 (enExample) 2005-07-07
JP3969808B2 true JP3969808B2 (ja) 2007-09-05

Family

ID=17847775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29753397A Expired - Lifetime JP3969808B2 (ja) 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置

Country Status (2)

Country Link
US (2) US6260260B1 (enExample)
JP (1) JP3969808B2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3969808B2 (ja) * 1997-10-29 2007-09-05 富士機械製造株式会社 電気部品供給方法および装置ならびに電気部品装着装置
JP3739218B2 (ja) * 1998-04-02 2006-01-25 松下電器産業株式会社 部品装着方法及び装置
JP3978910B2 (ja) * 1998-12-07 2007-09-19 松下電器産業株式会社 電子部品の実装装置
JP3441696B2 (ja) * 1999-04-22 2003-09-02 日本サーボ株式会社 チップマウンター用チップフィーダ
JP4399088B2 (ja) * 2000-06-01 2010-01-13 富士機械製造株式会社 電気部品装着装置
US6739036B2 (en) * 2000-09-13 2004-05-25 Fuji Machine Mfg., Co., Ltd. Electric-component mounting system
US20020133940A1 (en) * 2001-03-26 2002-09-26 Fuji Machine Mfg. Co., Ltd Electric-component supplying method and device, and electric-component mounting method and system
KR100538288B1 (ko) * 2002-01-17 2005-12-21 미쓰비시덴키 가부시키가이샤 수치제어방법 및 그 장치
US20040035747A1 (en) * 2002-08-21 2004-02-26 Butler Michael S. Temporary electronic component-carrying tape with weakened areas and related methods
US20070220741A1 (en) * 2002-10-17 2007-09-27 Ui Holding Co. Cabeless interconnect system for pick and place machine
DE10302802A1 (de) * 2003-01-24 2004-08-26 Siemens Ag Mehrfach-Bestückkopf
JP3966189B2 (ja) * 2003-02-27 2007-08-29 オムロン株式会社 基板検査方法およびこの方法を用いた基板検査装置
US7322981B2 (en) * 2003-08-28 2008-01-29 Jackson Roger P Polyaxial bone screw with split retainer ring
CN100488348C (zh) * 2003-07-03 2009-05-13 阿森姆布里昂股份有限公司 一种元件定位装置
JP5022576B2 (ja) * 2005-07-08 2012-09-12 株式会社ジャパンディスプレイイースト 表示パネルおよび表示装置
KR20080060415A (ko) * 2006-12-27 2008-07-02 미래산업 주식회사 핸들러의 전자부품 픽커
CN101750417B (zh) * 2008-12-12 2012-03-14 鸿富锦精密工业（深圳）有限公司 检测装置
TWI365023B (en) * 2009-07-23 2012-05-21 Wistron Corp Method for assembling componets on a circuit board and related assembling system
KR101519602B1 (ko) * 2010-03-03 2015-05-14 삼성테크윈 주식회사 헤드 노즐 유닛, 전자 부품 실장 장치 및 전자 부품 실장 방법
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
JP6146266B2 (ja) * 2013-11-07 2017-06-14 富士通株式会社 電力供給機構及びラック型装置
EP3223593B1 (en) * 2014-11-17 2020-07-22 FUJI Corporation Tape feeder and component mounting apparatus
US10712729B2 (en) * 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
CN112740851B (zh) * 2018-10-22 2022-11-22 松下知识产权经营株式会社 部件安装系统
CN117835576B (zh) * 2024-01-17 2024-08-23 赣州市超跃科技股份有限公司 一种pcb多料号防焊前处理分流装置及分流方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097265B2 (ja) 1992-02-05 2000-10-10 松下電器産業株式会社 部品供給装置
JP3338719B2 (ja) 1993-06-01 2002-10-28 富士機械製造株式会社 電子部品装着装置
JP3404431B2 (ja) 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP3469652B2 (ja) 1994-09-26 2003-11-25 富士機械製造株式会社 電子部品装着装置
JPH08316690A (ja) * 1995-05-18 1996-11-29 Fuji Mach Mfg Co Ltd 電子部品取外し装置
JP3459499B2 (ja) * 1995-06-22 2003-10-20 株式会社日立ハイテクインスツルメンツ テープ送出装置
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
JPH09237997A (ja) 1995-12-28 1997-09-09 Fuji Mach Mfg Co Ltd 電子部品搬送装置，方法および電子部品装着システム
JP3677108B2 (ja) * 1996-01-29 2005-07-27 三星テクウィン株式会社 部品搭載装置
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
JP3809251B2 (ja) * 1997-07-09 2006-08-16 富士機械製造株式会社 回路部品供給方法および供給システム
JP3969808B2 (ja) * 1997-10-29 2007-09-05 富士機械製造株式会社 電気部品供給方法および装置ならびに電気部品装着装置
SG83785A1 (en) * 1999-04-30 2001-10-16 Esec Trading Sa Apparatus and method for mounting semiconductor chips on a substrate

Also Published As

Publication number Publication date
JPH11135985A (ja) 1999-05-21
US6260260B1 (en) 2001-07-17
US20010002509A1 (en) 2001-06-07
US6665928B2 (en) 2003-12-23

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