JPH11135985A5 - - Google Patents

Info

Publication number
JPH11135985A5
JPH11135985A5 JP1997297533A JP29753397A JPH11135985A5 JP H11135985 A5 JPH11135985 A5 JP H11135985A5 JP 1997297533 A JP1997297533 A JP 1997297533A JP 29753397 A JP29753397 A JP 29753397A JP H11135985 A5 JPH11135985 A5 JP H11135985A5
Authority
JP
Japan
Prior art keywords
component
drive
tape
supply
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997297533A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11135985A (ja
JP3969808B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP29753397A priority Critical patent/JP3969808B2/ja
Priority claimed from JP29753397A external-priority patent/JP3969808B2/ja
Priority to US09/179,931 priority patent/US6260260B1/en
Publication of JPH11135985A publication Critical patent/JPH11135985A/ja
Priority to US09/771,996 priority patent/US6665928B2/en
Publication of JPH11135985A5 publication Critical patent/JPH11135985A5/ja
Application granted granted Critical
Publication of JP3969808B2 publication Critical patent/JP3969808B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP29753397A 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置 Expired - Lifetime JP3969808B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP29753397A JP3969808B2 (ja) 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置
US09/179,931 US6260260B1 (en) 1997-10-29 1998-10-28 Apparatus for supplying electronic components to a circuit board manufacturing apparatus
US09/771,996 US6665928B2 (en) 1997-10-29 2001-01-30 Method for mounting electric components with a mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29753397A JP3969808B2 (ja) 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置

Publications (3)

Publication Number Publication Date
JPH11135985A JPH11135985A (ja) 1999-05-21
JPH11135985A5 true JPH11135985A5 (enExample) 2005-07-07
JP3969808B2 JP3969808B2 (ja) 2007-09-05

Family

ID=17847775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29753397A Expired - Lifetime JP3969808B2 (ja) 1997-10-29 1997-10-29 電気部品供給方法および装置ならびに電気部品装着装置

Country Status (2)

Country Link
US (2) US6260260B1 (enExample)
JP (1) JP3969808B2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3969808B2 (ja) * 1997-10-29 2007-09-05 富士機械製造株式会社 電気部品供給方法および装置ならびに電気部品装着装置
JP3739218B2 (ja) * 1998-04-02 2006-01-25 松下電器産業株式会社 部品装着方法及び装置
JP3978910B2 (ja) * 1998-12-07 2007-09-19 松下電器産業株式会社 電子部品の実装装置
JP3441696B2 (ja) * 1999-04-22 2003-09-02 日本サーボ株式会社 チップマウンター用チップフィーダ
JP4399088B2 (ja) * 2000-06-01 2010-01-13 富士機械製造株式会社 電気部品装着装置
US6739036B2 (en) * 2000-09-13 2004-05-25 Fuji Machine Mfg., Co., Ltd. Electric-component mounting system
US20020133940A1 (en) * 2001-03-26 2002-09-26 Fuji Machine Mfg. Co., Ltd Electric-component supplying method and device, and electric-component mounting method and system
WO2003060616A1 (en) * 2002-01-17 2003-07-24 Mitsubishi Denki Kabushiki Kaisha Method and device for numerical control
US20040035747A1 (en) * 2002-08-21 2004-02-26 Butler Michael S. Temporary electronic component-carrying tape with weakened areas and related methods
US20070220741A1 (en) * 2002-10-17 2007-09-27 Ui Holding Co. Cabeless interconnect system for pick and place machine
DE10302802A1 (de) * 2003-01-24 2004-08-26 Siemens Ag Mehrfach-Bestückkopf
JP3966189B2 (ja) * 2003-02-27 2007-08-29 オムロン株式会社 基板検査方法およびこの方法を用いた基板検査装置
US7322981B2 (en) * 2003-08-28 2008-01-29 Jackson Roger P Polyaxial bone screw with split retainer ring
US7761977B2 (en) * 2003-07-03 2010-07-27 Assembleon N.V. Component placement device
JP5022576B2 (ja) * 2005-07-08 2012-09-12 株式会社ジャパンディスプレイイースト 表示パネルおよび表示装置
KR20080060415A (ko) * 2006-12-27 2008-07-02 미래산업 주식회사 핸들러의 전자부품 픽커
CN101750417B (zh) * 2008-12-12 2012-03-14 鸿富锦精密工业（深圳）有限公司 检测装置
TWI365023B (en) * 2009-07-23 2012-05-21 Wistron Corp Method for assembling componets on a circuit board and related assembling system
KR101519602B1 (ko) * 2010-03-03 2015-05-14 삼성테크윈 주식회사 헤드 노즐 유닛, 전자 부품 실장 장치 및 전자 부품 실장 방법
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
JP6146266B2 (ja) * 2013-11-07 2017-06-14 富士通株式会社 電力供給機構及びラック型装置
US10743446B2 (en) * 2014-11-17 2020-08-11 Fuji Corporation Component tape feeder with reel displacing mechanism
US10712729B2 (en) * 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
CN112740851B (zh) * 2018-10-22 2022-11-22 松下知识产权经营株式会社 部件安装系统
CN117835576B (zh) * 2024-01-17 2024-08-23 赣州市超跃科技股份有限公司 一种pcb多料号防焊前处理分流装置及分流方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097265B2 (ja) 1992-02-05 2000-10-10 松下電器産業株式会社 部品供給装置
JP3338719B2 (ja) 1993-06-01 2002-10-28 富士機械製造株式会社 電子部品装着装置
JP3404431B2 (ja) 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP3469652B2 (ja) 1994-09-26 2003-11-25 富士機械製造株式会社 電子部品装着装置
JPH08316690A (ja) * 1995-05-18 1996-11-29 Fuji Mach Mfg Co Ltd 電子部品取外し装置
JP3459499B2 (ja) * 1995-06-22 2003-10-20 株式会社日立ハイテクインスツルメンツ テープ送出装置
JPH09237997A (ja) 1995-12-28 1997-09-09 Fuji Mach Mfg Co Ltd 電子部品搬送装置，方法および電子部品装着システム
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
JP3677108B2 (ja) * 1996-01-29 2005-07-27 三星テクウィン株式会社 部品搭載装置
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
JP3809251B2 (ja) * 1997-07-09 2006-08-16 富士機械製造株式会社 回路部品供給方法および供給システム
JP3969808B2 (ja) * 1997-10-29 2007-09-05 富士機械製造株式会社 電気部品供給方法および装置ならびに電気部品装着装置
SG83785A1 (en) * 1999-04-30 2001-10-16 Esec Trading Sa Apparatus and method for mounting semiconductor chips on a substrate

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