JP3955302B2 - フリップチップ実装体の製造方法 - Google Patents

フリップチップ実装体の製造方法 Download PDF

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Publication number
JP3955302B2
JP3955302B2 JP2005091347A JP2005091347A JP3955302B2 JP 3955302 B2 JP3955302 B2 JP 3955302B2 JP 2005091347 A JP2005091347 A JP 2005091347A JP 2005091347 A JP2005091347 A JP 2005091347A JP 3955302 B2 JP3955302 B2 JP 3955302B2
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JP
Japan
Prior art keywords
resin
solder powder
chip mounting
semiconductor chip
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005091347A
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English (en)
Japanese (ja)
Other versions
JP2006114865A5 (https=
JP2006114865A (ja
Inventor
靖治 辛島
嘉久 山下
悟 留河
孝史 北江
誠一 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005091347A priority Critical patent/JP3955302B2/ja
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to US11/662,286 priority patent/US7759162B2/en
Priority to PCT/JP2005/016423 priority patent/WO2006030674A1/ja
Priority to KR1020077005769A priority patent/KR101179744B1/ko
Priority to EP05782249.6A priority patent/EP1796156B1/en
Publication of JP2006114865A publication Critical patent/JP2006114865A/ja
Publication of JP2006114865A5 publication Critical patent/JP2006114865A5/ja
Application granted granted Critical
Publication of JP3955302B2 publication Critical patent/JP3955302B2/ja
Priority to US12/717,433 priority patent/US8012801B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
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    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
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    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
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    • H10W72/225—Bumps having a filler embedded in a matrix
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    • H10W72/00—Interconnections or connectors in packages
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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    • Y10T428/31678—Of metal
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2005091347A 2004-09-15 2005-03-28 フリップチップ実装体の製造方法 Expired - Lifetime JP3955302B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005091347A JP3955302B2 (ja) 2004-09-15 2005-03-28 フリップチップ実装体の製造方法
PCT/JP2005/016423 WO2006030674A1 (ja) 2004-09-15 2005-09-07 フリップチップ実装方法及びフリップチップ実装体
KR1020077005769A KR101179744B1 (ko) 2004-09-15 2005-09-07 플립 칩 실장 방법 및 플립 칩 실장체
EP05782249.6A EP1796156B1 (en) 2004-09-15 2005-09-07 Flip chip mounting method
US11/662,286 US7759162B2 (en) 2004-09-15 2005-09-07 Flip chip mounting process and flip chip assembly
US12/717,433 US8012801B2 (en) 2004-09-15 2010-03-04 Flip chip mounting process and flip chip assembly

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147968A (ja) * 2004-11-24 2006-06-08 Matsushita Electric Ind Co Ltd フリップチップ実装方法およびフリップチップ実装装置
US8304338B2 (en) 2009-03-24 2012-11-06 Panasonic Corporation Method of joining electronic component and the electronic component
US8673688B2 (en) 2010-10-20 2014-03-18 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4287475B2 (ja) * 2004-12-17 2009-07-01 パナソニック株式会社 樹脂組成物
JP4405554B2 (ja) * 2005-03-24 2010-01-27 パナソニック株式会社 電子部品の実装方法
CN100495677C (zh) * 2005-03-29 2009-06-03 松下电器产业株式会社 倒装芯片封装方法及其焊锡点形成方法
JP4084835B2 (ja) * 2005-03-29 2008-04-30 松下電器産業株式会社 フリップチップ実装方法および基板間接続方法
EP1873819A4 (en) * 2005-04-06 2012-07-11 Panasonic Corp FLIP-CHIP ATTACHING METHOD AND ASSEMBLY PROCESSING
JP4402718B2 (ja) * 2005-05-17 2010-01-20 パナソニック株式会社 フリップチップ実装方法
KR101257977B1 (ko) * 2006-03-16 2013-04-24 파나소닉 주식회사 범프형성방법 및 범프형성장치
US7537961B2 (en) * 2006-03-17 2009-05-26 Panasonic Corporation Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
US20070238222A1 (en) * 2006-03-28 2007-10-11 Harries Richard J Apparatuses and methods to enhance passivation and ILD reliability
WO2007122868A1 (ja) * 2006-03-28 2007-11-01 Matsushita Electric Industrial Co., Ltd. バンプ形成方法およびバンプ形成装置
DE102006016275B4 (de) * 2006-03-31 2013-12-19 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger
KR100793078B1 (ko) * 2006-06-15 2008-01-10 한국전자통신연구원 플립 칩 패키지 및 그 제조방법
JP5329028B2 (ja) * 2006-09-15 2013-10-30 パナソニック株式会社 電子部品実装構造体の製造方法
WO2008139701A1 (ja) 2007-04-27 2008-11-20 Panasonic Corporation 電子部品実装体及びハンダバンプ付き電子部品並びにそれらの製造方法
US7977155B2 (en) * 2007-05-04 2011-07-12 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer-level flip-chip assembly methods
KR100872711B1 (ko) * 2007-06-29 2008-12-05 주식회사 동부하이텍 칩적층 구조물 및 이의 제조 방법
US20090057378A1 (en) * 2007-08-27 2009-03-05 Chi-Won Hwang In-situ chip attachment using self-organizing solder
JP2009186707A (ja) * 2008-02-06 2009-08-20 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置
JP5247571B2 (ja) * 2008-04-24 2013-07-24 パナソニック株式会社 配線基板と配線基板の接続方法
KR101208028B1 (ko) 2009-06-22 2012-12-04 한국전자통신연구원 반도체 패키지의 제조 방법 및 이에 의해 제조된 반도체 패키지
KR101234597B1 (ko) 2009-10-15 2013-02-22 한국전자통신연구원 플립 칩 본딩 방법 및 그의 구조
JP6008475B2 (ja) * 2010-07-16 2016-10-19 大日本印刷株式会社 太陽電池モジュールの製造方法
US8476115B2 (en) 2011-05-03 2013-07-02 Stats Chippac, Ltd. Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
TWI612591B (zh) * 2011-10-26 2018-01-21 日立化成股份有限公司 迴焊薄膜、焊料凸塊形成方法、焊料接合的形成方法及半導體裝置
JP6112797B2 (ja) * 2012-07-30 2017-04-12 国立大学法人大阪大学 電子部品の実装方法、回路基板の作製方法及び電子部品のはんだ接合部の形成方法、並びに、接続層付きプリント配線板及びシート状接合部材
KR101988890B1 (ko) * 2012-10-30 2019-10-01 한국전자통신연구원 솔더 온 패드의 제조방법 및 그를 이용한 플립 칩 본딩 방법
US9437566B2 (en) 2014-05-12 2016-09-06 Invensas Corporation Conductive connections, structures with such connections, and methods of manufacture
US9793198B2 (en) 2014-05-12 2017-10-17 Invensas Corporation Conductive connections, structures with such connections, and methods of manufacture
KR102411356B1 (ko) 2014-09-18 2022-06-22 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
US10002843B2 (en) * 2015-03-24 2018-06-19 Advanced Semiconductor Engineering, Inc. Semiconductor substrate structure, semiconductor package and method of manufacturing the same
JP6769740B2 (ja) * 2015-05-25 2020-10-14 積水化学工業株式会社 接続構造体の製造方法
KR102569944B1 (ko) 2015-05-25 2023-08-24 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP7220558B2 (ja) * 2018-12-26 2023-02-10 エルジー ディスプレイ カンパニー リミテッド 表示装置及び表示装置の製造方法
US11166384B2 (en) * 2019-03-20 2021-11-02 Konica Minolta Laboratory U.S.A., Inc. Fabrication process for flip chip bump bonds using nano-LEDs and conductive resin
KR20210001630A (ko) * 2019-06-28 2021-01-06 주식회사 노피온 자가 조립 및 정렬이 가능한 솔더페이스트를 이용한 마이크로소자 접합방법
JP7145839B2 (ja) * 2019-12-18 2022-10-03 株式会社オリジン はんだ付け基板の製造方法及びはんだ付け装置
TW202214806A (zh) * 2020-09-30 2022-04-16 日商太陽油墨製造股份有限公司 各向異性導電連接材料及使用各向異性導電連接材料之電子元件的安裝方法
JPWO2024071266A1 (https=) * 2022-09-30 2024-04-04

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4611192A (en) * 1985-01-25 1986-09-09 Eagle Electric Mfg. Co., Inc. Heavy-duty time-delay fuse
JPH0747233B2 (ja) 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
JPH02251145A (ja) * 1989-03-24 1990-10-08 Citizen Watch Co Ltd 突起電極形成方法
JPH06125169A (ja) 1992-10-13 1994-05-06 Fujitsu Ltd 予備はんだ法
JPH0927516A (ja) * 1995-07-12 1997-01-28 Nippondenso Co Ltd 電子部品の接続構造
AU738424B2 (en) * 1997-11-19 2001-09-20 Matsushita Electric Industrial Co., Ltd. Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member
JPH11186334A (ja) * 1997-12-25 1999-07-09 Toshiba Corp 半導体実装装置及びその製造方法及び異方性導電材料
JP3996276B2 (ja) 1998-09-22 2007-10-24 ハリマ化成株式会社 ソルダペースト及びその製造方法並びにはんだプリコート方法
JP2000332055A (ja) 1999-05-17 2000-11-30 Sony Corp フリップチップ実装構造及び実装方法
JP2001093938A (ja) * 1999-09-20 2001-04-06 Nec Kansai Ltd 半導体装置及びその製造方法
JP2001329048A (ja) 2000-03-15 2001-11-27 Harima Chem Inc 封止充填剤用液状エポキシ樹脂組成物
JP2002026070A (ja) 2000-07-04 2002-01-25 Toshiba Corp 半導体装置およびその製造方法
JP3866591B2 (ja) 2001-10-29 2007-01-10 富士通株式会社 電極間接続構造体の形成方法および電極間接続構造体
JP3996802B2 (ja) * 2002-05-15 2007-10-24 太陽インキ製造株式会社 低放射線性の光硬化性・熱硬化性樹脂組成物及びその硬化被膜
US20040084206A1 (en) 2002-11-06 2004-05-06 I-Chung Tung Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
EP1615263A4 (en) 2003-02-05 2006-10-18 Senju Metal Industry Co METHOD FOR CONNECTING CONNECTIONS AND METHOD FOR ATTACHING A SEMICONDUCTOR CONSTRUCTION ELEMENT
JP3964911B2 (ja) * 2004-09-03 2007-08-22 松下電器産業株式会社 バンプ付き基板の製造方法
JP4287475B2 (ja) * 2004-12-17 2009-07-01 パナソニック株式会社 樹脂組成物
CN100495677C (zh) * 2005-03-29 2009-06-03 松下电器产业株式会社 倒装芯片封装方法及其焊锡点形成方法
JP4084835B2 (ja) 2005-03-29 2008-04-30 松下電器産業株式会社 フリップチップ実装方法および基板間接続方法
EP1873819A4 (en) * 2005-04-06 2012-07-11 Panasonic Corp FLIP-CHIP ATTACHING METHOD AND ASSEMBLY PROCESSING

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147968A (ja) * 2004-11-24 2006-06-08 Matsushita Electric Ind Co Ltd フリップチップ実装方法およびフリップチップ実装装置
US8304338B2 (en) 2009-03-24 2012-11-06 Panasonic Corporation Method of joining electronic component and the electronic component
US8673688B2 (en) 2010-10-20 2014-03-18 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same

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KR20070052791A (ko) 2007-05-22
US8012801B2 (en) 2011-09-06
EP1796156B1 (en) 2017-11-29
WO2006030674A1 (ja) 2006-03-23
US7759162B2 (en) 2010-07-20
EP1796156A4 (en) 2009-10-14
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