JPWO2024071266A1 - - Google Patents
Info
- Publication number
- JPWO2024071266A1 JPWO2024071266A1 JP2024550431A JP2024550431A JPWO2024071266A1 JP WO2024071266 A1 JPWO2024071266 A1 JP WO2024071266A1 JP 2024550431 A JP2024550431 A JP 2024550431A JP 2024550431 A JP2024550431 A JP 2024550431A JP WO2024071266 A1 JPWO2024071266 A1 JP WO2024071266A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3468—Application of molten solder, e.g. dip soldering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022158535 | 2022-09-30 | ||
| PCT/JP2023/035304 WO2024071266A1 (ja) | 2022-09-30 | 2023-09-27 | バンプ付き基板の製造方法および積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024071266A1 true JPWO2024071266A1 (https=) | 2024-04-04 |
Family
ID=90478008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550431A Pending JPWO2024071266A1 (https=) | 2022-09-30 | 2023-09-27 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024071266A1 (https=) |
| KR (1) | KR20250077470A (https=) |
| TW (1) | TW202431449A (https=) |
| WO (1) | WO2024071266A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3955302B2 (ja) * | 2004-09-15 | 2007-08-08 | 松下電器産業株式会社 | フリップチップ実装体の製造方法 |
| JP2013110402A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
| KR102006637B1 (ko) * | 2013-03-20 | 2019-10-01 | 한국전자통신연구원 | 범프의 형성 방법 및 이를 포함하는 반도체 소자의 형성방법 |
| KR20150128310A (ko) | 2014-05-09 | 2015-11-18 | 삼성전기주식회사 | 솔더 페이스트용 플럭스, 솔더 페이스트 및 솔더 범프의 제조 방법 |
| KR102354906B1 (ko) * | 2019-12-16 | 2022-01-25 | 주식회사 노피온 | 열가소성 수지인 폴리우레탄 수지를 포함하는 이방성 도전 접착제, 이를 이용한 솔더범프의 형성 방법 및 접합구조체의 제조방법 |
| KR102922752B1 (ko) * | 2021-02-03 | 2026-02-03 | 가부시끼가이샤 레조낙 | 땜납 페이스트, 땜납 범프의 형성 방법 및 땜납 범프 부착 부재의 제조 방법 |
-
2023
- 2023-09-27 JP JP2024550431A patent/JPWO2024071266A1/ja active Pending
- 2023-09-27 KR KR1020257007644A patent/KR20250077470A/ko active Pending
- 2023-09-27 WO PCT/JP2023/035304 patent/WO2024071266A1/ja not_active Ceased
- 2023-09-28 TW TW112137417A patent/TW202431449A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250077470A (ko) | 2025-05-30 |
| WO2024071266A1 (ja) | 2024-04-04 |
| TW202431449A (zh) | 2024-08-01 |