TW202431449A - 附凸塊之基板之製造方法及積層體 - Google Patents

附凸塊之基板之製造方法及積層體 Download PDF

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Publication number
TW202431449A
TW202431449A TW112137417A TW112137417A TW202431449A TW 202431449 A TW202431449 A TW 202431449A TW 112137417 A TW112137417 A TW 112137417A TW 112137417 A TW112137417 A TW 112137417A TW 202431449 A TW202431449 A TW 202431449A
Authority
TW
Taiwan
Prior art keywords
substrate
aggregating
self
solder particles
anisotropic conductive
Prior art date
Application number
TW112137417A
Other languages
English (en)
Chinese (zh)
Inventor
大村翼
加藤雅俊
小坂尚史
宍戶雄一郎
桶結卓司
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202431449A publication Critical patent/TW202431449A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
TW112137417A 2022-09-30 2023-09-28 附凸塊之基板之製造方法及積層體 TW202431449A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022158535 2022-09-30
JP2022-158535 2022-09-30

Publications (1)

Publication Number Publication Date
TW202431449A true TW202431449A (zh) 2024-08-01

Family

ID=90478008

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112137417A TW202431449A (zh) 2022-09-30 2023-09-28 附凸塊之基板之製造方法及積層體

Country Status (4)

Country Link
JP (1) JPWO2024071266A1 (https=)
KR (1) KR20250077470A (https=)
TW (1) TW202431449A (https=)
WO (1) WO2024071266A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3955302B2 (ja) * 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
JP2013110402A (ja) * 2011-10-26 2013-06-06 Hitachi Chemical Co Ltd リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置
KR102006637B1 (ko) * 2013-03-20 2019-10-01 한국전자통신연구원 범프의 형성 방법 및 이를 포함하는 반도체 소자의 형성방법
KR20150128310A (ko) 2014-05-09 2015-11-18 삼성전기주식회사 솔더 페이스트용 플럭스, 솔더 페이스트 및 솔더 범프의 제조 방법
KR102354906B1 (ko) * 2019-12-16 2022-01-25 주식회사 노피온 열가소성 수지인 폴리우레탄 수지를 포함하는 이방성 도전 접착제, 이를 이용한 솔더범프의 형성 방법 및 접합구조체의 제조방법
KR102922752B1 (ko) * 2021-02-03 2026-02-03 가부시끼가이샤 레조낙 땜납 페이스트, 땜납 범프의 형성 방법 및 땜납 범프 부착 부재의 제조 방법

Also Published As

Publication number Publication date
KR20250077470A (ko) 2025-05-30
JPWO2024071266A1 (https=) 2024-04-04
WO2024071266A1 (ja) 2024-04-04

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