KR20250077470A - 범프 구비 기판의 제조 방법 및 적층체 - Google Patents

범프 구비 기판의 제조 방법 및 적층체 Download PDF

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Publication number
KR20250077470A
KR20250077470A KR1020257007644A KR20257007644A KR20250077470A KR 20250077470 A KR20250077470 A KR 20250077470A KR 1020257007644 A KR1020257007644 A KR 1020257007644A KR 20257007644 A KR20257007644 A KR 20257007644A KR 20250077470 A KR20250077470 A KR 20250077470A
Authority
KR
South Korea
Prior art keywords
substrate
self
anisotropic conductive
conductive adhesive
solder particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257007644A
Other languages
English (en)
Korean (ko)
Inventor
츠바사 오무라
마사토시 가토
나오후미 고사카
유이치로 시시도
다쿠지 오케유이
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20250077470A publication Critical patent/KR20250077470A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H01L21/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H01L2021/60007—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020257007644A 2022-09-30 2023-09-27 범프 구비 기판의 제조 방법 및 적층체 Pending KR20250077470A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022158535 2022-09-30
JPJP-P-2022-158535 2022-09-30
PCT/JP2023/035304 WO2024071266A1 (ja) 2022-09-30 2023-09-27 バンプ付き基板の製造方法および積層体

Publications (1)

Publication Number Publication Date
KR20250077470A true KR20250077470A (ko) 2025-05-30

Family

ID=90478008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257007644A Pending KR20250077470A (ko) 2022-09-30 2023-09-27 범프 구비 기판의 제조 방법 및 적층체

Country Status (4)

Country Link
JP (1) JPWO2024071266A1 (https=)
KR (1) KR20250077470A (https=)
TW (1) TW202431449A (https=)
WO (1) WO2024071266A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015213956A (ja) 2014-05-09 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． 半田ペースト用フラックス、半田ペースト及び半田バンプの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3955302B2 (ja) * 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
JP2013110402A (ja) * 2011-10-26 2013-06-06 Hitachi Chemical Co Ltd リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置
KR102006637B1 (ko) * 2013-03-20 2019-10-01 한국전자통신연구원 범프의 형성 방법 및 이를 포함하는 반도체 소자의 형성방법
KR102354906B1 (ko) * 2019-12-16 2022-01-25 주식회사 노피온 열가소성 수지인 폴리우레탄 수지를 포함하는 이방성 도전 접착제, 이를 이용한 솔더범프의 형성 방법 및 접합구조체의 제조방법
KR102922752B1 (ko) * 2021-02-03 2026-02-03 가부시끼가이샤 레조낙 땜납 페이스트, 땜납 범프의 형성 방법 및 땜납 범프 부착 부재의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015213956A (ja) 2014-05-09 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． 半田ペースト用フラックス、半田ペースト及び半田バンプの製造方法

Also Published As

Publication number Publication date
JPWO2024071266A1 (https=) 2024-04-04
WO2024071266A1 (ja) 2024-04-04
TW202431449A (zh) 2024-08-01

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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000