EP1796156A4 - Flip chip mounting method and flip chip mounting element - Google Patents

Flip chip mounting method and flip chip mounting element

Info

Publication number
EP1796156A4
EP1796156A4 EP05782249A EP05782249A EP1796156A4 EP 1796156 A4 EP1796156 A4 EP 1796156A4 EP 05782249 A EP05782249 A EP 05782249A EP 05782249 A EP05782249 A EP 05782249A EP 1796156 A4 EP1796156 A4 EP 1796156A4
Authority
EP
European Patent Office
Prior art keywords
flip chip
chip mounting
wiring substrate
resin
solder powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05782249A
Other languages
German (de)
French (fr)
Other versions
EP1796156B1 (en
EP1796156A1 (en
Inventor
Seiji Karashima
Yoshihisa Yamashita
Satoru Tomekawa
Takashi Kitae
Seiichi Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of EP1796156A1 publication Critical patent/EP1796156A1/en
Publication of EP1796156A4 publication Critical patent/EP1796156A4/en
Application granted granted Critical
Publication of EP1796156B1 publication Critical patent/EP1796156B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Abstract

There is provided a flip chip mounting process which is high in productivity and reliability, and thus can be applicable to the flip chip mounting of the next-generation LSI. This flip chip mounting process comprises the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. This heating step is carried out at a temperature higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).
EP05782249.6A 2004-09-15 2005-09-07 Flip chip mounting method Active EP1796156B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004267919 2004-09-15
JP2005091347A JP3955302B2 (en) 2004-09-15 2005-03-28 Method of manufacturing flip chip mounting body
PCT/JP2005/016423 WO2006030674A1 (en) 2004-09-15 2005-09-07 Flip chip mounting method and flip chip mounting element

Publications (3)

Publication Number Publication Date
EP1796156A1 EP1796156A1 (en) 2007-06-13
EP1796156A4 true EP1796156A4 (en) 2009-10-14
EP1796156B1 EP1796156B1 (en) 2017-11-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP05782249.6A Active EP1796156B1 (en) 2004-09-15 2005-09-07 Flip chip mounting method

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KR101179744B1 (en) 2012-09-04
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US20100148376A1 (en) 2010-06-17
WO2006030674A1 (en) 2006-03-23

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