JPH02251145A - Formation of bump electrode - Google Patents

Formation of bump electrode

Info

Publication number
JPH02251145A
JPH02251145A JP7331389A JP7331389A JPH02251145A JP H02251145 A JPH02251145 A JP H02251145A JP 7331389 A JP7331389 A JP 7331389A JP 7331389 A JP7331389 A JP 7331389A JP H02251145 A JPH02251145 A JP H02251145A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
formed
terminal electrode
protective film
electrode parts
bump electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7331389A
Inventor
Hiroyuki Hirasawa
Kazuo Inoue
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/114Manufacturing methods by blanket deposition of the material of the bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/116Manufacturing methods by patterning a pre-deposited material

Abstract

PURPOSE: To form bump electrodes of high density which only requires a simple technique and a low manufacturing cost by supplying solder collectively to a wide region including a plurality of terminal electrode parts that are formed at openings of a protective film and are quite densely in existence or to the whole surface of a substrate.
CONSTITUTION: A protective film 16 is formed at the whole surface of terminal electrode parts 15 that are input/output terminals of a semiconductor integrated circuit and protective film opening 18 are formed on the protective film 16 by photoetching and then, the terminal electrode parts 15 are exposed. Then bump electrode materials are formed on the protective film 16 including the terminal electrode parts 15 and the bump electrode materials 19 are dissolved by treating with heat and then, bump electrodes 20 are formed at the terminal electrode parts 15. The bump electrodes are thus manufactured efficiently with a simple technique and a process is performed at a low cost. Moreover, as the bump electrodes of high density are formed, elements which are disposed with a number of terminals and the terminal electrode parts of high density are packaged.
COPYRIGHT: (C)1990,JPO&Japio
JP7331389A 1989-03-24 1989-03-24 Formation of bump electrode Pending JPH02251145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7331389A JPH02251145A (en) 1989-03-24 1989-03-24 Formation of bump electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7331389A JPH02251145A (en) 1989-03-24 1989-03-24 Formation of bump electrode

Publications (1)

Publication Number Publication Date
JPH02251145A true true JPH02251145A (en) 1990-10-08

Family

ID=13514561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7331389A Pending JPH02251145A (en) 1989-03-24 1989-03-24 Formation of bump electrode

Country Status (1)

Country Link
JP (1) JPH02251145A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006025387A1 (en) * 2004-09-03 2006-03-09 Matsushita Electric Industrial Co., Ltd. Bump forming method and solder bump
WO2006030674A1 (en) * 2004-09-15 2006-03-23 Matsushita Electric Industrial Co., Ltd. Flip chip mounting method and flip chip mounting element
JP2006147968A (en) * 2004-11-24 2006-06-08 Matsushita Electric Ind Co Ltd Method and device for flip chip packaging
JP2008198745A (en) * 2007-02-09 2008-08-28 Sumitomo Bakelite Co Ltd Solder bump forming method, solder bump, semiconductor device and manufacturing method of semiconductor device
JP2009135452A (en) * 2007-10-31 2009-06-18 Sanyo Electric Co Ltd Device mounting board, semiconductor module, and mobile device
US7726545B2 (en) 2005-03-16 2010-06-01 Panasonic Corporation Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
US7910403B2 (en) 2005-03-09 2011-03-22 Panasonic Corporation Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
US8283246B2 (en) 2005-04-06 2012-10-09 Panasonic Corporation Flip chip mounting method and bump forming method
US8709293B2 (en) 2004-12-17 2014-04-29 Panasonic Corporation Flip-chip mounting resin composition and bump forming resin composition

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006025387A1 (en) * 2004-09-03 2006-03-09 Matsushita Electric Industrial Co., Ltd. Bump forming method and solder bump
US7799607B2 (en) 2004-09-03 2010-09-21 Panasonic Corporation Process for forming bumps and solder bump
WO2006030674A1 (en) * 2004-09-15 2006-03-23 Matsushita Electric Industrial Co., Ltd. Flip chip mounting method and flip chip mounting element
US8012801B2 (en) 2004-09-15 2011-09-06 Panasonic Corporation Flip chip mounting process and flip chip assembly
US7759162B2 (en) 2004-09-15 2010-07-20 Panasonic Corporation Flip chip mounting process and flip chip assembly
JP4543899B2 (en) * 2004-11-24 2010-09-15 パナソニック株式会社 Flip chip mounting method and a flip-chip mounting device
JP2006147968A (en) * 2004-11-24 2006-06-08 Matsushita Electric Ind Co Ltd Method and device for flip chip packaging
US8709293B2 (en) 2004-12-17 2014-04-29 Panasonic Corporation Flip-chip mounting resin composition and bump forming resin composition
US7910403B2 (en) 2005-03-09 2011-03-22 Panasonic Corporation Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
US7726545B2 (en) 2005-03-16 2010-06-01 Panasonic Corporation Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
US8283246B2 (en) 2005-04-06 2012-10-09 Panasonic Corporation Flip chip mounting method and bump forming method
JP2008198745A (en) * 2007-02-09 2008-08-28 Sumitomo Bakelite Co Ltd Solder bump forming method, solder bump, semiconductor device and manufacturing method of semiconductor device
JP2009135452A (en) * 2007-10-31 2009-06-18 Sanyo Electric Co Ltd Device mounting board, semiconductor module, and mobile device

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