JP2006147968A - Method and device for flip chip packaging - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flip chip packaging method and flip chip packaging device which are applicable to the flip chip packaging of a net generation LSI and have a high productivity and reliability. <P>SOLUTION: After a semiconductor chip 20 is arranged in the recess 5 of a mold 1, the mold 1 arranged with the semiconductor chip 20 is disposed on a circuit board 10. Thereafter, after a melted resin 13 containing a melted solder powder is injected into a space 6 formed with the circuit board 10 and the mold 1, the melted resin 13 filled in the space 6 is cured. In the injection process of the melted resin 13, the melted solder powder self-gathers between the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20, whereby a connection body 22 is formed which electrically connects the connection terminal 11 to the electrode terminal 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a flip-chip mounting method and flip-chip mounting apparatus for mounting a semiconductor chip on a circuit board, and more particularly to a highly productive flip-chip mounting method and flip-chip mounting that can be applied to a semiconductor chip with a narrow pitch. Relates to the device.

  In recent years, with the high density and high integration of semiconductor integrated circuits (LSIs) used in electronic devices, the number of pin terminals and the narrow pitch of LSI chip electrode terminals are rapidly increasing. For mounting these LSI chips on a circuit board, flip chip mounting is widely used to reduce wiring delay. In this flip chip mounting, solder bumps are generally formed on the electrode terminals of the LSI chip, and are generally joined together to connection terminals formed on the circuit board via the solder bumps.

  However, in order to mount a next-generation LSI with more than 5,000 electrode terminals on a circuit board, it is necessary to form bumps corresponding to a narrow pitch of 100 μm or less. Difficult to adapt to it. Further, since it is necessary to form a large number of bumps corresponding to the number of electrode terminals, high productivity is also required by shortening the mounting tact per chip in order to reduce the cost.

  Similarly, the semiconductor integrated circuit changes from the peripheral electrode terminal to the area-arranged electrode terminal due to an increase in the electrode terminals. Moreover, it is expected that the semiconductor process will progress from 90 nm to 65 nm and 45 nm due to demands for higher density and higher integration. As a result, the miniaturization of the wiring further progresses, and the capacitance between the wirings increases, so the problems of high speed and power consumption loss become serious, and the dielectric constant (Low-K) of the insulating film between the wiring layers is reduced. There is a growing demand. Realization of such a low-K insulating film is obtained by making the insulating layer material porous (porous), so that the mechanical strength is weak, which is an obstacle to thinning the semiconductor. Further, as described above, when an area-arranged electrode terminal is configured, there is a problem with the strength on the porous film due to Low-K, so that bumps are formed on the area-arranged electrode, and the flip chip mounting itself. Has become difficult. Therefore, there is a demand for a low-load flip chip mounting method suitable for thin and high-density semiconductors corresponding to future progress of semiconductor processes.

  Conventionally, as a bump forming technique, a plating method, a screen printing method, or the like has been developed. Although the plating method is suitable for narrow pitches, the process is complicated and there are problems in productivity. The screen printing method is excellent in productivity, but the mask is used to reduce the pitch. Is not suitable.

  Under these circumstances, recently, several techniques for selectively forming solder bumps on electrodes of an LSI chip or a circuit board have been developed. These technologies are not only suitable for the formation of fine bumps, but also allow for the formation of bumps at a time, so they are excellent in productivity and attract attention as technologies that can be applied to circuit boards for next-generation LSIs. ing.

  One of them is a technique called a solder paste method (see, for example, Patent Document 1). In this technology, solder paste made of a mixture of solder powder and flux is solidly applied onto a substrate with electrodes formed on the surface, and the substrate is heated to melt the solder powder and select a highly wettable electrode. Thus, solder bumps are formed.

  In addition, a technique called a super solder method (see, for example, Patent Document 2) is based on a paste-like composition (chemical reaction deposition solder) mainly composed of an organic acid lead salt and metallic tin on a substrate on which electrodes are formed. The substrate is heated and the substrate is heated to cause a substitution reaction between Pb and Sn, and a Pb / Sn alloy is selectively deposited on the substrate electrode.

  However, both the solder paste method and the super solder method supply the paste-like composition by coating on the substrate, resulting in variations in local thickness and concentration. A bump with a certain height cannot be obtained. Moreover, since these methods supply the paste-like composition by coating on a circuit board having an uneven surface on which electrodes are formed, a sufficient amount of solder cannot be supplied on the electrodes to be convex portions. It is difficult to obtain a desired bump height required in flip chip mounting.

  By the way, the flip chip mounting using the conventional bump forming technique is such that after mounting the semiconductor chip on the circuit board on which the bump is formed, a resin called underfill is used to fix the semiconductor chip to the circuit board. And a step of injecting between the circuit board and the circuit board.

Therefore, flip chip mounting technology using an anisotropic conductive material (for example, patent document) is a method for simultaneously performing electrical connection between opposing electrode terminals of a semiconductor chip and a circuit board and fixing the semiconductor chip to the circuit board. 3) has been developed. This is because a thermosetting resin containing conductive particles is supplied between the circuit board and the semiconductor chip, and the semiconductor chip and the circuit board are heated by simultaneously pressing the semiconductor chip and heating the thermosetting resin. The electrical connection between the electrode terminals and the fixing of the semiconductor chip to the circuit board are realized at the same time.
JP 2000-94179 A Japanese Patent Laid-Open No. 1-157796 JP 2000-332055 A

  However, in the flip-chip mounting using the anisotropic conductive material described above, electrical conduction between the electrodes is obtained by mechanical contact via conductive particles, and it is difficult to obtain a stable conduction state.

  In addition, since the conductive particles sandwiched between the counter electrodes are maintained by the cohesive force due to the thermosetting of the resin, characteristics such as the elastic modulus and thermal expansion coefficient of the thermosetting resin, the particle size distribution of the conductive particles, etc. There is a problem that process control is difficult because it is necessary to align characteristics.

  In other words, flip chip mounting using an anisotropic conductive material is a problem to be solved in terms of productivity and reliability in order to be applied to a next generation LSI chip having more than 5,000 connection terminals. Leaving a lot.

  The present invention has been made in view of such points, and an object of the present invention is to provide a flip chip mounting method and a flip chip mounting body that are applicable to flip chip mounting of next-generation LSIs and have high productivity and reliability. .

  In the flip-chip mounting method of the present invention, a semiconductor chip having a plurality of electrode terminals is arranged facing a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board and the electrode terminals of the semiconductor chip are electrically connected. In the flip-chip mounting method for connecting to each other, the disposing step of disposing the semiconductor chip in the recess of the mold, and the disposing step of disposing the mold on which the semiconductor chip is disposed on the circuit board; An injection step of injecting a molten resin containing molten solder powder into a space formed by the circuit board and the mold, and a curing step of curing the molten resin filled in the space In the molten resin injection step, the molten solder powder is self-assembled between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip, whereby the connection terminal and the Wherein the connecting member for electrically connecting the electrode terminals are formed.

  In the molten resin injecting step, it is preferable that the molten resin filled in the space is discharged from the space while flowing in the space.

  In the step of arranging the mold on the circuit board, the electrode terminals of the semiconductor chip are preferably arranged so as to have a certain distance from the connection terminals of the circuit board.

  In a preferred embodiment, in the semiconductor chip disposing step, the semiconductor chip is disposed in the mold recess by vacuum suction.

  In a preferred embodiment, in the molten resin injection step, the molten resin is injected from a plurality of inlets provided in the mold and discharged from a plurality of outlets provided in the mold. .

  In a preferred embodiment, in the semiconductor chip arranging step, a plurality of semiconductor chips are arranged in the mold recess.

  In a preferred embodiment, in the step of placing the mold on the circuit board, a plurality of molds on which different semiconductor chips are mounted are placed on the circuit board.

  In a preferred embodiment, the semiconductor chip is mounted on an interposer having a plurality of electrodes, and in the molten resin injection step, the molten solder powder is connected to the connection terminals of the circuit board and the electrodes of the interposer. Are self-assembled to each other, whereby the connection terminal and the protruding electrode are electrically connected.

  In another flip chip mounting method of the present invention, a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board, the electrode terminals of the semiconductor chip, In the flip chip mounting method for electrically connecting the semiconductor chip, an arrangement step of arranging the semiconductor chip in the concave portion of the mold, and an arrangement of arranging the mold on which the semiconductor chip is arranged on the circuit board A first injection step of injecting a first molten resin containing molten solder powder into a space formed by the circuit board and the mold, and a first filling of the space A discharging step of discharging the molten resin from the space portion; and a second step of injecting a second molten resin containing no molten solder powder into the space portion after discharging the first molten resin from the space portion. Injection process and said empty A curing step of curing the second molten resin filled in a portion, and in the first injection step of the first molten resin, the molten solder powder is connected to the connection terminals of the circuit board and the semiconductor chip. A connecting body that electrically connects the connection terminal and the electrode terminal is formed by self-assembly between the first molten resin and the first molten resin discharging step. The first injection step is performed after the connection body is formed.

  In the first injection step of the first molten resin, it is preferable that the first molten resin filled in the space portion is discharged from the space portion while flowing in the space portion.

  In a preferred embodiment, the first molten resin discharging step is performed by injecting a gas into the space.

  In a preferred embodiment, the step of discharging the first molten resin is performed by injecting the second molten resin into the space portion in the second injection step of the second molten resin. .

  In another flip chip mounting method of the present invention, a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board, the electrode terminals of the semiconductor chip, In the flip chip mounting method for electrically connecting the semiconductor chip, an arrangement step of arranging the semiconductor chip in the concave portion of the mold, and an arrangement of arranging the mold on which the semiconductor chip is arranged on the circuit board Including a step, an injection step of injecting a molten resin containing solder powder into the space formed by the circuit board and the mold, and a curing step of curing the molten resin filled in the space, In the molten resin injecting step, by heating the mold, the solder powder contained in the molten resin is melted, and the molten solder powder is in contact with the connection terminals of the circuit board and the front. By self-assembly between the electrode terminals of the semiconductor chip, wherein the connecting body for electrically connecting the electrode terminals and the connection terminals are formed.

  In the molten resin injecting step, it is preferable that the molten resin filled in the space is discharged from the space while flowing in the space.

  In a preferred embodiment, the second injection step of the second molten resin includes a first step of injecting a first insulating resin into the space portion, and a second insulating resin into the space portion. In the first step, the side surface of the connection body is covered with the first insulating resin, and in the second step, the side surface of the connection body is covered. The space is filled with the second insulating resin so as to cover the first insulating resin, and the curing process of the second molten resin includes the first insulating resin and the second insulating resin. It consists of a process of curing the functional resin.

  In a preferred embodiment, the method further includes a step of temporarily curing the first insulating resin after the first step.

  In a preferred embodiment, the first insulating resin is coated on a side surface of the connection body by surface tension.

  The first insulating resin is preferably made of a material having a lower elastic modulus than the second insulating resin.

  The bump forming method of the present invention is a bump forming method for a substrate having a plurality of electrodes, wherein a disposing step of disposing a mold having a recess corresponding to a desired bump height on the substrate; An injection step of injecting molten resin containing molten solder powder into the space formed by the mold, and in the injection step of molten resin, the molten solder powder is self-imposed on the electrodes of the substrate. By collecting, bumps are formed on the electrodes.

  In the step of disposing the mold, it is preferable to adjust the bump height by embedding a spacer in the concave portion of the mold.

  In the molten resin injection step, it is preferable that the molten resin filled in the space is discharged from the space while flowing in the space.

  In a preferred embodiment, the substrate is a circuit board, a semiconductor wafer, or a semiconductor chip.

  In another flip chip mounting method of the present invention, a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board, the electrode terminals of the semiconductor chip, In the flip chip mounting method for electrically connecting the semiconductor chip, an arrangement step of arranging the semiconductor chip in the concave portion of the mold, and an arrangement of arranging the mold on which the semiconductor chip is arranged on the circuit board A first injection step of injecting a viscous material containing molten solder powder into a space formed by the circuit board and the mold, and the space filled with the viscous material filled in the space A discharge step of discharging from the space portion, a second injection step of injecting the molten resin into the space portion after discharging the viscous body from the space portion, and a curing for hardening the molten resin filled in the space portion Including processes In the first injection step of the viscous body, the molten solder powder self-assembles between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip, thereby connecting the connection terminal and the electrode terminal. A connecting body that is electrically connected is formed, and the discharging step of the viscous body is performed after the connecting body is formed in the first injection step of the viscous body.

  In a preferred embodiment, the viscous body is made of a molten resin, a high boiling point solvent, or oil.

  Another bump forming method of the present invention is a bump forming method for a substrate having a plurality of electrodes, the disposing step of disposing a mold having a recess on the substrate, and the substrate and the mold. An injection step of injecting a viscous material containing molten solder powder into the space portion, and in the injection step of the viscous material, the molten solder powder self-assembles on the electrode of the substrate, thereby A bump is formed on the electrode.

  In a preferred embodiment, the viscous body is made of a molten resin, a high boiling point solvent, or oil.

  The flip chip mounting apparatus of the present invention is a flip chip mounting apparatus for flip chip mounting a semiconductor chip on a circuit board, and includes a table on which the circuit board is placed, and a mold on which the semiconductor chip is disposed, The mold has a recess in which the semiconductor chip is disposed, a vacuum inlet for vacuum-sucking the semiconductor chip, and at least one inlet and outlet, and the mold is placed on the table. When arranged, a space portion is formed by the circuit board and the mold recess, and a viscous material containing molten solder powder is injected into the space portion from the injection port of the mold. Flip chip mounting is performed by forming a connection body between the connection terminal and the electrode terminal of the semiconductor chip.

  The connection body is preferably formed by self-assembly of the molten solder powder between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip.

  The viscous material injected into the space is preferably discharged from the discharge port of the mold while flowing in the space.

  In a preferred embodiment, the viscous body is made of a molten resin, a high boiling point solvent, or oil.

  In the flip chip mounting method according to the present invention, by injecting molten resin containing molten solder powder into the space formed by the circuit board and the mold recess, the movement of the molten solder powder in the space is promoted, Bonding between the molten solder powders proceeds uniformly in the space filled with the molten resin. As a result, the molten solder powder that has grown uniformly self-assembles between the electrode terminals of the circuit board with high wettability and the connection terminals of the semiconductor chip, thereby electrically connecting the electrode terminals and the connection terminals. The body can be formed uniformly. At the same time, the semiconductor chip can be fixed to the circuit board by curing the molten resin filled in the space. Accordingly, the electrical connection between the semiconductor chip and the electrode terminals of the circuit board and the fixing of the semiconductor chip to the circuit board can be performed simultaneously in a series of steps, and a highly productive flip chip mounting body can be realized.

  In addition, since the molten resin injected into the space formed by the circuit board and the mold recess is discharged from the space while flowing in the space, the movement of the space of the molten solder powder is further promoted. The bonding between the molten solder powders proceeds more uniformly in the space filled with the molten resin. As a result, a more uniform connection body can be formed between the electrode terminal and the connection terminal.

  Furthermore, after injecting molten resin (first molten resin) containing molten solder powder into the space portion to form a connection body between the electrode terminal and the connection terminal, the molten resin is discharged from the space portion. Then, by again injecting a molten resin (second molten resin) containing no molten solder powder into the space, unnecessary solder powder can be removed. As a result, since the semiconductor chip can be fixed to the circuit board by the resin without unnecessary solder powder between the terminals, a highly reliable flip chip mounting body can be realized.

  In addition, the connection body formed between the electrode terminal and the connection terminal is formed by the self-assembly of the molten solder powder floating in the molten resin injected into the space formed by the circuit board and the mold recess. Therefore, the load applied to the semiconductor chip or the circuit board is small. As a result, a flip chip mounting body with a low load and high reliability can be realized even for a semiconductor chip using a porous insulating layer, a thinned semiconductor chip, or the like.

  The applicant of the present application has studied flip-chip mounting applicable to next-generation LSI chips and has proposed a novel flip-chip mounting method capable of forming fine bumps with high uniformity (Japanese Patent Application No. 2004-267919).

  FIGS. 1A to 1C are diagrams showing basic steps of a flip chip mounting method disclosed by the applicant of the present application in the above patent application specification. As shown in FIG. 1A, a resin 13 containing solder powder (not shown) and an additive 12 is supplied onto a circuit board 10 on which a plurality of connection terminals 11 are formed.

  Next, as shown in FIG. 1B, the surface of the resin 13 supplied onto the circuit board 10 is brought into contact with the semiconductor chip 20. At this time, the semiconductor chip 20 having the plurality of electrode terminals 21 is arranged to face the circuit board 10 having the plurality of connection terminals 11. In this state, the circuit board 10 is heated to melt the resin 13. Here, the heating temperature of the circuit board 10 is higher than the melting point of the solder powder.

  And as shown in FIG.1 (c), the fuse | melted solder powder couple | bonds together in the molten resin 13, and makes the connection body 22 by self-assembling between the connection terminal 11 and the electrode terminal 21 with high wettability. Form. Finally, the resin 13 is cured to fix the semiconductor chip 20 to the circuit board 10.

  The feature of this method is that a resin containing solder powder further contains an additive boiling at a temperature at which the solder powder melts. That is, at the temperature at which the solder powder is melted, the additive contained in the resin (hereinafter referred to as convective additive) boils, and the boiled convective additive convects in the resin, thereby floating in the resin. The movement of the molten solder powder is promoted, and the uniform bonding of the molten solder powder proceeds. As a result, the uniformly grown molten solder powder self-assembles between the connection terminal 11 of the circuit board 10 having high wettability and the electrode terminal 21 of the semiconductor chip 20, so that the connection terminal 11 and the electrode terminal 21 In the meantime, a highly uniform electrical connection can be obtained.

  Here, the resin containing the solder powder can be considered to have a role of “sea” in which the melted solder powder can float and move freely at a temperature at which the solder powder melts. However, since the solder powder bonding process is completed in a very short time, even if a “sea” where the solder powder can move is provided, it ends with local progress, and uniform solder powder bonding cannot be obtained. .

  That is, the above method is intended to add means for forcibly moving the molten solder powder by further adding a convection additive to the resin contained in the solder powder.

  The present invention proposes another novel flip chip mounting method intended to add means for forcibly moving the molten solder powder by a method different from the above method from the same technical viewpoint. Is.

  Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of simplicity. In addition, this invention is not limited to the following embodiment.

(Embodiment 1)
2A to 2D and FIGS. 3A and 3B are process cross-sectional views illustrating basic processes of the flip chip mounting method according to the first embodiment of the present invention.

  First, as shown in FIG. 2A, a semiconductor chip 20 having a plurality of electrode terminals 21 is disposed in the recess 5 of the mold 1. The recess 5 is formed to be approximately the same size as the semiconductor chip 20, and the semiconductor chip 20 disposed in the recess 5 is vacuum-sucked and fixed by the vacuum inlet 2 provided in the mold 1. .

  Next, as shown in FIG. 2B, the mold 1 on which the semiconductor chip 20 is disposed is disposed on the circuit board 10 having the plurality of connection terminals 11. At the time of arrangement, the electrode terminals 21 of the semiconductor chip 20 and the connection terminals 11 of the circuit board 10 are aligned so as to face each other. Note that the position of the circuit board 10 can be fixed by placing it on a mounting table (not shown) or by storing it in a recess (not shown) provided in the mold.

  FIG. 2C is a diagram showing a state where the mold 1 on which the semiconductor chip 20 is disposed is disposed on the circuit board 10. As shown in FIG. 2C, a space 6 is formed between the circuit board 10 and the mold 1 on which the semiconductor chip 20 is disposed. Further, the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20 are arranged so as to have a constant interval.

  Next, as shown in FIG. 2 (d), a molten resin 13 containing molten solder powder is injected into the space 6 from the injection port 3 provided in the mold 1. At this time, the molten resin 13 filled in the space portion 6 is discharged from the discharge port 4 provided at a position opposite to the injection port 3 while flowing in the space portion 6. Note that Sn-Ag solder is used as the solder powder. The mold 1 is heated to a temperature equal to or higher than the temperature at which the solder powder melts.

  In the injection process of the molten resin 13, as shown in FIG. 3A, molten solder powder (not shown) contained in the molten resin 13 causes the connection terminals 11 of the circuit board 10 and the electrode terminals 21 of the semiconductor chip 20. As a result, the connection body 22 that electrically connects the connection terminal 11 and the electrode terminal 21 is formed. That is, the molten solder powder floating in the molten resin 13 is bonded to grow into a larger solder ball, and the grown solder ball is selectively self-adhered on the connection terminal 11 or the electrode terminal 21 having high wettability. As a result, the connection body 22 is finally formed between the connection terminal 11 and the electrode terminal 21.

  Here, the bonding of the molten solder powder and the self-assembly on the connection terminal 11 or the electrode terminal 21 are considered to proceed extremely locally and in a short time in the molten resin 13. Therefore, in order to cause these phenomena to proceed uniformly over the entire region of the semiconductor chip 20 and thereby form a uniform connection body 22 with no variation, the molten solder powder floating in the molten resin 13 is forced. It is necessary to add a means for moving to.

  However, in the above injection step, the molten resin 13 filled in the space 6 is discharged outside while flowing through the space 6, so that the molten solder powder is as if the molten resin 13 filled in the space 6. It becomes the appearance that can be forcibly moved inside. This brings about the same effect as the movement promotion of the molten solder powder by the convection additive shown in the previous patent application (Japanese Patent Application No. 2004-267919) by the applicant of the present application.

  After the connection body 22 is formed, the semiconductor chip 20 is fixed to the circuit board 10 by curing the molten resin 13 filled in the space 6. Here, for example, if the molten resin 13 is a thermosetting resin, the molten resin 13 can be cured by heating the mold 1 to a temperature higher than the temperature at which the molten resin 13 is cured.

  Finally, as shown in FIG. 3B, by removing the mold 1, a mounting body in which the semiconductor chip 20 is flip-chip mounted on the circuit board 10 is completed.

  According to the method of the present invention, the molten resin powder containing molten solder powder is injected into the space 6 formed by the mold 1 in which the circuit board 10 and the semiconductor chip 20 are disposed, thereby obtaining the molten solder powder. The movement in the molten resin 13 filled in the space 6 is promoted, and the bonding between the molten solder powders proceeds uniformly. As a result, the uniformly grown molten solder powder self-assembles between the connection terminal 11 of the circuit board 10 having high wettability and the electrode terminal 21 of the semiconductor chip 20, so that the connection terminal 11 and the electrode terminal 21 A uniform connection body 22 can be formed therebetween. At the same time, the semiconductor chip 20 can be fixed to the circuit board 10 by curing the molten resin 13 between the circuit board 10 and the semiconductor chip 20. Therefore, the electrical connection between the terminals of the semiconductor chip 20 and the circuit board 10 and the fixing of the semiconductor chip 20 to the circuit board 10 can be performed simultaneously in a series of steps, and a flip-chip mounting body with high productivity can be obtained. realizable.

  The connection body formed between the electrode terminal and the connection terminal is formed by self-assembly of the molten solder powder floating in the molten resin injected into the space formed by the circuit board and the mold recess. Therefore, the load applied to the semiconductor chip or the circuit board is small. As a result, a flip chip mounting body with a low load and high reliability can be realized even for a semiconductor chip using a porous insulating layer, a thinned semiconductor chip, or the like.

  In the method of the present invention, since the molten resin 13 has a role of “sea” in which the molten solder powder floats, the molten resin 13 is a resin whose liquidity or viscosity decreases at the temperature at which the solder powder melts. Preferably there is. For example, an epoxy resin, a polyimide resin, a polyphenylene ether resin, a phenol resin, a fluororesin, an isocyanate resin, or the like can be used as the liquid thermosetting resin at a temperature at which the solder powder melts. In addition, as the thermoplastic resin whose viscosity decreases at the melting temperature, wholly aromatic polyester, fluorine resin, polyphenylene oxide resin, syndiotactic polystyrene resin, polyimide resin, polyamide resin, aramid resin, polyphenylene sunfide resin, etc. are used. be able to.

  Further, in the injection process of the molten resin 13, if the molten resin 13 is injected at a low injection pressure by reducing the space 6, the connection terminals 11 of the circuit board 10 and the electrode terminals 21 of the semiconductor chip 20 are connected. Even if the gap is narrow (typically 20 μm or less), the gap can be easily filled. For example, if the molten resin 13 has a viscosity of 10 Pa · s or less, the minute gap can be reliably filled if the pressure in the space 6 is reduced to 0.5 Pa or less and injected.

  Further, in the step of injecting the molten resin 13 according to the first embodiment, the molten resin 13 containing the molten solder powder is injected into the space 6, but the molten resin 13 is injected in a state where the solder powder is not melted. Also good. In that case, when the mold 1 is heated to a temperature at which the solder powder melts in the molten resin 13 injection step, the solder powder contained in the molten resin 13 injected into the space 6 is melted, The molten solder powder self-assembles between the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20, thereby forming a connection body 22 that electrically connects the connection terminal 11 and the electrode terminal 21. Is done.

  As for the method of injecting the molten resin 13, the form of the mold 1 in which the semiconductor chip 20 is disposed can be changed depending on how the semiconductor chip 20 is mounted on the circuit board 10.

  4 and 5 are diagrams showing an example of how the molten resin 13 is injected. FIG. 4 shows an example in which a plurality of semiconductor chips 20 (four semiconductor chips are shown in FIG. 4) are arranged in one mold 1. In this example, the molten resin 13 is injected from a plurality of inlets 3 a, 3 b, 3 c provided at one end of the mold 1, and a plurality of outlets 4 a, 4 b, 4 c provided at the other end of the mold 1. Discharged from. In addition, in order to allow the molten resin 13 to flow as uniformly as possible in the space (not shown) of the mold 1, the position or number of the inlet and outlet is appropriately determined.

  FIG. 5 shows an example in which a plurality of molds 1 (four molds are shown in FIG. 5) each having a semiconductor chip 20 disposed thereon are arranged on a circuit board 10. As shown in FIG. 5, in the center where a plurality of molds 1 are arranged, one pot 8 into which the molten resin 13 is placed is arranged, and from this pot 8, the inlets 3a, 3b, 3c, 3d of each mold 1 are arranged. The runners 7a, 7b, 7c, and 7d are connected to each other. Then, the molten resin 13 is poured into the pot 8 and injected into the space inside the mold from each injection port of the mold 1 through each runner.

  By using the injection method shown in FIGS. 4 and 5, a plurality of semiconductor chips 20 can be simultaneously flip-chip mounted on the circuit board 10, and the manufacturing time of the flip-chip mounting body can be greatly reduced. it can.

  In the method of the present invention, the semiconductor chip 20 can be applied not only to a silicon semiconductor but also to a compound semiconductor such as a silicon-germanium semiconductor or a gallium arsenide semiconductor. In particular, for thin silicon semiconductors, silicon-germanium semiconductors and compound semiconductors with low mechanical strength, if the method of the present invention with a small load on a semiconductor chip is applied, a highly reliable flip chip mounting body can be obtained. Can be realized.

  The method of the present invention is also applied to a case where the semiconductor chip 20 is flip-chip mounted on the circuit board 10 in a state where the semiconductor chip 20 is mounted on the interposer, instead of being flip-chip mounted directly on the circuit board 10. Can do.

  6A to 6D are process cross-sectional views showing an example in which the interposer 30 on which the semiconductor chip 20 is mounted is flip-chip mounted on the circuit board 10. Since it is basically the same as the method shown in FIGS. 2 (a) to (d) and FIGS. 3 (a) and 3 (b), hereinafter, simply refer to FIGS. 6 (a) to (d). While explaining.

  First, as shown in FIG. 6A, the interposer 30 on which the semiconductor chip 20 is mounted is disposed in the concave portion 5 of the mold 1. A plurality of electrode terminals (not shown) of the semiconductor chip 20 are electrically connected to a plurality of electrodes 31 formed on the surface of the interposer 30, respectively. In FIG. 6A, the semiconductor chip 20 is disposed so as to be embedded in the recess 5, but a part of the interposer 30 may also be disposed so as to be embedded in the recess 5. The interposer 30 is fixed by vacuum-sucking the back surface of the semiconductor chip 20 with the vacuum port 2 provided in the mold 1.

  And after arrange | positioning the metal mold | die 1 by which the interposer 30 was arrange | positioned on the circuit board 10 which has the some connecting terminal 11 as shown in FIG.6 (b), as shown in FIG.6 (c), A molten resin 13 containing molten solder powder is injected into the space 6 from the injection port 3 provided in the mold 1. In the injection process of the molten resin 13, the molten solder powder (not shown) contained in the molten resin 13 is self-assembled between the connection terminal 11 of the circuit board 10 and the electrode 31 of the interposer 30, thereby connecting terminal A connection body 22 that electrically connects the electrode 11 and the electrode 31 is formed. After the connection body 22 is formed, the interposer 30 is fixed to the circuit board 10 by curing the molten resin 13 filled in the space 6. Finally, as shown in FIG. 6D, by removing the mold 1, a mounting body in which the interposer 30 on which the semiconductor chip 20 is mounted is flip-chip mounted on the circuit board 10 is completed.

(Embodiment 2)
In the flip-chip mounting method described in the first embodiment, the molten solder powder is self-assembled between the terminals of the circuit board 10 and the semiconductor chip 20 to form the connection body 22, and then the molten resin 13 is subsequently cured to thereby form the semiconductor chip. By fixing 20 to the circuit board 10, electrical connection and fixing between the terminals are performed simultaneously.

  In this case, the molten resin 13 is required to have a role of “sea” in which the molten solder powder floats, and also to have a role of so-called underfill for fixing the semiconductor chip 20 to the circuit board 10. However, since these two roles are based on completely different effects, there are very few choices of optimal materials that satisfy both roles.

  On the other hand, when next-generation LSIs with more than 5,000 connection terminals are flip-chip mounted on a circuit board, it becomes difficult to ensure reliability for electrical connection, not only resistance characteristics between terminals. Strict specifications including pressure resistance characteristics are required.

  7 (a) to 7 (d) and FIG. 8 (a) regarding a flip chip mounting method capable of realizing a flip chip mounting body with higher reliability by modifying the method shown in the first embodiment. ) To (c) will be described below. In this method, the material having the role of “sea” and the material having the role of underfill are selected separately from each other so as to electrically connect and fix the semiconductor chip to the circuit board. Is.

  First, as shown in FIG. 7A, a semiconductor chip 20 having a plurality of electrode terminals 21 is disposed in the recess 5 of the mold 1. The recess 5 is formed to be approximately the same size as the semiconductor chip 20, and the semiconductor chip 20 disposed in the recess 5 is vacuum-sucked and fixed by the vacuum inlet 2 provided in the mold 1. .

  Next, as illustrated in FIG. 7B, the mold 1 in which the semiconductor chip 20 is disposed is disposed on the circuit board 10 having the plurality of connection terminals 11. At the time of arrangement, the electrode terminals 21 of the semiconductor chip 20 and the connection terminals 11 of the circuit board 10 are aligned so as to face each other. Note that the position of the circuit board 10 can be fixed by placing it on a mounting table (not shown) or by storing it in a recess (not shown) provided in the mold.

  FIG. 7C is a view showing a state where the mold 1 on which the semiconductor chip 20 is disposed is disposed on the circuit board 10. As shown in FIG. 7C, a space 6 is formed between the circuit board 10 and the mold 1 on which the semiconductor chip 20 is disposed. Further, the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20 are arranged so as to have a constant interval.

  Next, as shown in FIG. 7 (d), a first molten resin 40 containing molten solder powder is injected into the space 6 from the injection port 3 provided in the mold 1. In addition, the 1st molten resin 40 with which the space part 6 was filled is discharged | emitted from the discharge port 4 provided in the position on the opposite side to the injection port 3, flowing the space part 6. FIG. In the first injection step of the first molten resin 40, molten solder powder (not shown) contained in the molten resin 13 is interposed between the connection terminals 11 of the circuit board 10 and the electrode terminals 21 of the semiconductor chip 20. By self-assembling, a connection body 22 that electrically connects the connection terminal 11 and the electrode terminal 21 is formed. Here, since the 1st molten resin 40 with which the space part 6 was filled is discharged | emitted outside, flowing through the space part 6, molten solder powder is as if the 1st molten resin with which the space part 6 was filled. It can be forcibly moved within 40. As a result, the bonding between the molten solder powders proceeds uniformly over the entire region of the semiconductor chip 20, and a uniform connection body 22 without variations can be formed.

  After the connection body 22 is formed, the first molten resin 40 filled in the space 6 is discharged from the space 6 as shown in FIG. The discharge of the first molten resin 40 can be performed, for example, by injecting a gas from the injection port 3 provided in the mold 1 and using the pressure of the injected gas. In addition, when discharging the 1st molten resin 40, in order not to collapse the shape of the connection body 22 by the press of gas, etc., the temperature of the metal mold | die 1 is lowered | hung and the connection body 22 is hardened. Is preferred.

  Next, as shown in FIG. 8 (b), after discharging the first molten resin 40 from the space portion 6, the second molten resin 41 not containing molten solder powder is provided in the mold 1. It injects into the space 6 from the inlet 3. In the second injection process of the second molten resin 41, the space 6 is filled again with the second molten resin 41. Then, the semiconductor chip 20 is fixed to the circuit board 10 by curing the second molten resin 41 filled in the space 6. Here, the second molten resin 41 is cured by, for example, heating the mold 1 to a temperature higher than the temperature at which the second molten resin 41 is cured if the second molten resin 41 is a thermosetting resin. Can be done.

  Finally, as shown in FIG. 8C, by removing the mold 1, a mounting body in which the semiconductor chip 20 is flip-chip mounted on the circuit board 10 is completed.

  Here, the discharge process of the first molten resin 40 was performed by injecting gas into the space 6, but in the second injection process of the second molten resin 41, the first molten resin 40 was removed. Alternatively, the second molten resin 41 may be extruded. In this case, a gas injection process is not necessary, and the process can be simplified.

  According to the method of the second embodiment, the first molten resin 40 used in the process of forming the connection body 22 that connects the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20, and the semiconductor chip 20 are connected to the circuit board. By changing the material of the second molten resin 41 used in the process of fixing to 10, a flip chip mounting body with higher reliability can be realized.

  That is, according to the method of the present invention, in the step of forming the connection body 22, the optimum material that plays the role of “sea” for the molten solder powder, the underfilling in the step of fixing the semiconductor chip 20 to the circuit board 10 is performed. It is possible to select an optimum material that plays the role of Thereby, a flip chip mounting body with higher reliability can be realized.

  For example, the first molten resin 41 is added with a resin having a viscosity suitable for the movement of the molten solder powder, and the second molten resin 42 is added with an inorganic filler that alleviates the difference in thermal expansion between the circuit board 10 and the semiconductor chip 20. By selecting the respective resins, the electrical connection and mechanical fixation of the semiconductor chip 20 to the circuit board 10 can be more reliably performed.

  In view of such a viewpoint, the first molten resin 41 does not need to have curability, and is not limited to the resin material such as the thermosetting resin and the thermoplastic resin described in the first embodiment. If it is a material (viscous material) which has this, the objective of this invention can be achieved.

  As a material other than the resin, a high boiling point solvent or oil that does not boil at a temperature at which the solder powder melts can be used as a viscous material containing the melted solder powder. For example, butyl carbitol, butyl carbitol acetate or the like can be used as the high boiling point solvent, and silicone oil or the like can be used as the oil. The viscosity of these viscous bodies is not particularly limited, but the viscosity of 10 Pa · s or less is a viscosity that allows the molten solder powder to easily move and be easily injected into a minute gap between the semiconductor chip 20 and the circuit board 10. preferable.

  Further, according to the method of the second embodiment, when the connection body 22 is formed in the first injection step of the first molten resin 40, the molten solder powder does not self-assemble between the terminals, Even if it slightly remains in the molten resin 40, the first molten resin 40 in which such solder powder remains is discharged from the space 6 after forming the connection body 22, Occurrence of the problem of dielectric breakdown voltage degradation can be avoided.

(Embodiment 3)
One of the features of the flip chip mounting method according to the present invention is that the mold 1 is used when the connection body 22 and the underfill 41 are formed. The inventor of the present application has focused on the use of the mold 1 and has come up with a method for forming an underfill that improves the dielectric strength between the connecting bodies 22. Hereinafter, description will be made with reference to FIGS. 9A to 9D, 10, and 11.

  FIG. 9A shows the first molten resin 40 in Embodiment 2 after injecting the first molten resin 40 containing molten solder powder into the space 6 and forming the connection body 22 between the terminals. It is the figure which showed the state which discharged | emitted from the space part 6. FIG.

  In this state, as shown in FIG. 9B, the molten first insulating resin 50 is injected into the space 6 from the injection port 3 provided in the mold 1. Here, as the first insulating resin 50, a low elastic modulus thermosetting resin, for example, a mixture of an epoxy resin and a flexible epoxy resin is used. Since the first insulating resin 50 is characterized by a low elastic modulus, an inorganic filler contained in a resin generally used as an underfill material is not included.

  Note that the first insulating resin 50 injected into the space 6 does not necessarily fill the space 6, and the first insulating resin 50 injected from the injection port 3 provided in the mold 1. However, what is necessary is just to be supplied so that the side surface of the connection body 22 may be contacted when flowing in the space part 6 and discharged | emitted from the discharge port 4.

  FIG. 10 is a cross-sectional view illustrating a configuration of the connection body 22 between the electrode terminal 21 of the semiconductor chip 20 and the connection terminal 11 of the circuit board 10 after the molten first insulating resin 50 is injected into the space 6. is there. As shown in FIG. 10, the side surface of the connection body 22 is covered with the first insulating resin 50. This is considered that the side surface of the connection body 22 is coat | covered with the 1st insulating resin 50 by surface tension. The first insulating resin 50 may also be coated on the surface of the semiconductor chip 20 and the circuit board 10 other than the side surfaces of the connection body 22.

  Next, as shown in FIG. 9C, the melted second insulating resin 51 is injected into the space 6 from the injection port 3 provided in the mold 1. Here, the second insulating resin 51 corresponds to the second molten resin (underfill material) in the second embodiment, and is, for example, a resin containing an inorganic filler.

  FIG. 11 is a cross-sectional view showing the configuration of the connection body 22 between the electrode terminal 21 of the semiconductor chip 20 and the connection terminal 11 of the circuit board 10 after the molten second insulating resin 51 is injected into the space 6. is there. As shown in FIG. 11, the second insulating resin 51 is filled in the space 6 so as to cover the first insulating resin 50.

  In addition, after inject | pouring the 1st insulating resin 50 so that the 1st insulating resin which coat | covers the side surface of the connection body 22 may not remove | deviate when inject | pouring the 2nd insulating resin 51, after a 1st insulation resin 50 is injected | injected. It is preferable to temporarily cure the functional resin 50. The temporary curing can be performed, for example, by heating the mold 1.

  In general, the underfill material is added with an inorganic filler or the like to match the thermal expansion coefficients of the semiconductor chip 20 and the circuit board 10 and to increase the elastic modulus and curing shrinkage, thereby increasing the electrode terminals 21 of the semiconductor chip 20. The adhesion of the connection terminals 11 of the circuit board 10 is ensured. However, since it is highly elastic and highly compressible, when a temperature cycle is applied, stress concentrates on the electrode terminals 21 of the semiconductor chip 20 or the connection terminals 11 of the circuit board 10, leading to deterioration of reliability.

  According to the method of the third embodiment, the connection body 22 is insulated by the second insulating resin 51 (so-called underfill material) through the first insulating resin 50 having a low elastic modulus. The stress caused by the second insulating resin 51 can be relaxed by the first insulating resin 51 having a low elastic modulus. As a result, it is possible to prevent a decrease in the withstand voltage between the connection bodies 22, and even if a temperature cycle is applied, stress relaxation is achieved and reliability is not deteriorated.

(Embodiment 4)
The flip chip mounting method in the present invention can also be applied to a bump forming method. Hereinafter, the bump forming method according to the fourth embodiment will be described with reference to FIGS.

  First, as shown in FIG. 12A, a mold 1 having a recess 5 is disposed on a substrate 10 having a plurality of electrodes 11. The mold 1 disposed on the substrate 10 forms a space 6 with the substrate 10 (FIG. 12B). And as shown in FIG.12 (c), the molten resin 40 containing the melted solder powder is inject | poured into the space part 6 from the injection port 3 provided in the metal mold | die 1. As shown in FIG. At this time, the molten resin 40 filled in the space 6 is discharged from the discharge port 4 provided at a position opposite to the injection port 3 while flowing in the space 6. In this molten resin 40 injection step, the molten solder powder self-assembles on the electrode 11 of the substrate 10, thereby forming bumps 60 on the electrode 11. Finally, by removing the mold 1, the substrate 10 having the bumps formed on the electrodes 11 is completed.

  According to the method of the fourth embodiment, the molten resin 40 containing molten solder powder is injected into the space 6 formed by the substrate 10 and the mold 1 to fill the space 6 of the molten solder powder. The movement in the molten resin 40 is promoted, and the bonding between the molten solder powders proceeds uniformly. As a result, the uniformly grown molten solder powder self-assembles on the electrode 11 of the substrate 10 having high wettability, whereby the uniform bump 60 can be formed on the electrode 11.

  The recess 5 of the mold 1 is formed to a depth corresponding to a desired bump height, but the bump height can be adjusted by embedding a spacer in the recess 5.

  Note that the molten resin 40 is not limited to a resin material such as a thermosetting resin or a thermoplastic resin, as in the second embodiment, and can achieve the object of the present invention as long as it is a material (viscous material) having an appropriate viscosity. can do. As the substrate 10, a circuit board, a semiconductor wafer, a semiconductor chip, or the like can be applied.

(Embodiment 5)
FIGS. 13, 14 (a), and 14 (b) are views showing a full-chip mounting apparatus 70 that executes the flip chip mounting method according to the present invention.

  A flip chip mounting apparatus 70 shown in FIG. 13 includes a table 9 on which a circuit board is placed, and a mold 1 on which a semiconductor chip is disposed. The mold 1 includes a recess 5 on which a semiconductor chip is disposed, It has a vacuum inlet 2 for vacuum-sucking a semiconductor chip, and at least one inlet 3 and outlet 4. The mold 1 or the table 9 can be heated by a hot plate.

  FIGS. 14A and 14B are views showing an example in which the flip chip mounting method according to the present invention is executed using the flip chip mounting apparatus 70. FIG.

  As shown in FIG. 14A, the semiconductor chip 20 having a plurality of electrode terminals 21 is vacuum-sucked by the vacuum inlet 2 and disposed in the recess 5 of the mold 1. On the other hand, the circuit board 10 having the plurality of connection terminals 11 is placed on the table 9. And after aligning the electrode terminal 21 of the semiconductor chip 20 and the connection terminal 11 of the circuit board 10, the metal mold | die 1 is arrange | positioned on the table 9 in which the circuit board 10 was mounted. At this time, a space is formed between the circuit board 10 and the mold recess 5.

  Next, as shown in FIG. 14 (b), the viscous body 13 containing the molten solder powder is injected into the space from the injection port 3 provided in the mold 1, thereby connecting terminals 11 of the circuit board 10. A connection body 22 is formed between the electrode terminals 21 of the semiconductor chip 20. The connection body 22 is formed by self-assembly of molten solder powder between the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20. The viscous body 13 injected into the space is discharged from the discharge port 4 of the mold 1 while flowing in the space.

  When a curable molten resin is used as the viscous body 13, the semiconductor chip 20 can be fixed to the circuit board 10 by forming the connection body 22 and then curing the molten resin. Further, when a non-curing high boiling point solvent or oil or the like is used as the viscous body 13, after the connection body 22 is formed, the viscous body 13 is discharged from the space portion, and the molten resin is returned to the space portion again. The semiconductor chip 20 can be fixed to the circuit board 10 by pouring and then curing the molten resin.

  As mentioned above, although this invention was demonstrated by suitable embodiment, such description is not a limitation matter and of course various modifications are possible. For example, Sn—Ag solder is used as the solder powder, but other solders such as Pb-free solder such as Sn—Zn and Sn—Bi solders may be used.

  ADVANTAGE OF THE INVENTION According to this invention, the flip chip mounting method and flip chip mounting body which can be applied to the flip chip mounting of next generation LSI and have high productivity and reliability can be provided.

(A)-(c) is process sectional drawing which shows the flip-chip mounting method using resin containing a convection additive (A)-(d) is process sectional drawing which shows the flip-chip mounting method in Embodiment 1 of this invention. (A) And (b) is process sectional drawing which shows the flip-chip mounting method in Embodiment 1 of this invention. The top view which shows one form of the metal mold | die in this invention The top view which shows other one form of the metal mold | die in this invention (A)-(d) is process sectional drawing which shows the flip chip mounting method of the interposer in this invention. (A)-(d) is process sectional drawing which shows the flip-chip mounting method in Embodiment 2 of this invention. (A)-(c) is process sectional drawing which shows the flip-chip mounting method in Embodiment 2 of this invention. (A)-(d) is process sectional drawing which shows the flip-chip mounting method in Embodiment 3 of this invention. Sectional drawing which shows the structure of the connection body after injection | pouring of the 1st insulating resin in Embodiment 3 of this invention. Sectional drawing which shows the structure of the connection body after injection | pouring of 2nd insulating resin in Embodiment 3 of this invention. (A)-(d) is a figure which shows the bump formation method in Embodiment 4 of this invention. The figure which shows the structure of the flip-chip mounting apparatus in Embodiment 5 of this invention. (A) And (b) is a figure explaining the full-chip mounting method using the flip-chip mounting apparatus in Embodiment 5 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mold 2 Vacuum inlet 3 Inlet 4 Outlet 5 Mold recessed part 6 Space part 7 Runner 8 Pot 9 Table 10 Board | substrate, circuit board 11 Connection terminal 12 Convection additive 13 Molten resin, viscous body 20 Semiconductor chip 21 Electrode terminal DESCRIPTION OF SYMBOLS 22 Connection body 30 Interposer 31 Electrode 40 1st molten resin 42 2nd molten resin 50 1st insulating resin 51 2nd insulating resin 60 Bump 70 Flip chip mounting apparatus

Claims (30)

In a flip chip mounting method in which a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board and the electrode terminals of the semiconductor chip are electrically connected. ,
A disposing step of disposing the semiconductor chip in the recess of the mold;
An arrangement step of arranging a mold on which the semiconductor chip is arranged on the circuit board;
An injection step of injecting molten resin containing molten solder powder into the space formed by the circuit board and the mold;
A curing step of curing the molten resin filled in the space,
In the molten resin injection step, the molten solder powder is self-assembled between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip, thereby electrically connecting the connection terminal and the electrode terminal. A flip-chip mounting method characterized in that a connecting body is formed. 2. The flip chip mounting according to claim 1, wherein, in the molten resin injection step, the molten resin filled in the space is discharged from the space while flowing in the space. Method. 2. The method according to claim 1, wherein in the step of arranging the mold on the circuit board, the electrode terminals of the semiconductor chip are arranged so as to have a certain distance from the connection terminals of the circuit board. Flip chip mounting method. 2. The flip chip mounting method according to claim 1, wherein in the semiconductor chip arranging step, the semiconductor chip is arranged in the mold recess by vacuum suction. In the molten resin injection step, the molten resin is injected from a plurality of injection ports provided in the mold and discharged from a plurality of discharge ports provided in the mold. Item 2. The flip chip mounting method according to Item 1. 2. The flip chip mounting method according to claim 1, wherein, in the semiconductor chip disposing step, a plurality of semiconductor chips are disposed in the mold recess. 2. The flip chip mounting according to claim 1, wherein, in the step of arranging the mold on the circuit board, a plurality of molds on which different semiconductor chips are mounted are arranged on the circuit board. Method. The semiconductor chip is mounted on an interposer having a plurality of electrodes,
In the molten resin injection step, the molten solder powder self-assembles between the connection terminal of the circuit board and the electrode of the interposer, so that the connection terminal and the protruding electrode are electrically connected. The flip-chip mounting method according to claim 1, wherein: In a flip chip mounting method in which a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board and the electrode terminals of the semiconductor chip are electrically connected. ,
A disposing step of disposing the semiconductor chip in the recess of the mold;
An arrangement step of arranging a mold on which the semiconductor chip is arranged on the circuit board;
A first injection step of injecting a first molten resin containing molten solder powder into the space formed by the circuit board and the mold;
A discharging step of discharging the first molten resin filled in the space portion from the space portion;
A second injecting step of injecting a second molten resin containing no molten solder powder into the space after discharging the first molten resin from the space;
A curing step of curing the second molten resin filled in the space,
In the first injection step of the first molten resin, the molten solder powder self-assembles between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip, whereby the connection terminal and the electrode terminal A connection body is formed to electrically connect the
The flip-chip mounting method, wherein the discharging process of the first molten resin is performed after the connection body is formed in the first injection process of the first molten resin. The first molten resin filled in the space portion is discharged from the space portion while flowing in the space portion in the first injection step of the first molten resin. Item 10. The flip-chip mounting method according to Item 9. 10. The flip chip mounting method according to claim 9, wherein the first molten resin discharging step is performed by injecting a gas into the space. The discharging step of the first molten resin is performed by injecting the second molten resin into the space portion in the second injection step of the second molten resin. 10. The flip chip mounting method according to 9. In a flip chip mounting method in which a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board and the electrode terminals of the semiconductor chip are electrically connected. ,
A disposing step of disposing the semiconductor chip in the recess of the mold;
An arrangement step of arranging a mold on which the semiconductor chip is arranged on the circuit board;
An injection step of injecting a molten resin containing solder powder into the space formed by the circuit board and the mold;
A curing step of curing the molten resin filled in the space part,
In the molten resin injection step, the solder powder contained in the molten resin is melted by heating the mold, and the molten solder powder is connected to the connection terminals of the circuit board and the electrode terminals of the semiconductor chip. A connection body that electrically connects the connection terminal and the electrode terminal is formed by self-assembly between the connection terminal and the flip-chip mounting method. 14. The flip chip mounting method according to claim 13, wherein, in the molten resin injection step, the molten resin filled in the space is discharged from the space while flowing in the space. . The second injection step of the second molten resin includes a first step of injecting a first insulating resin into the space portion and a second step of injecting a second insulating resin into the space portion. And consist of
In the first step, a side surface of the connection body is covered with the first insulating resin,
In the second step, the space is filled with the second insulating resin, covering the first insulating resin covering the side surface of the connection body,
10. The flip chip mounting method according to claim 9, wherein the curing step of the second molten resin comprises a step of curing the first insulating resin and the second insulating resin. The flip-chip mounting method according to claim 15, further comprising a step of temporarily curing the first insulating resin after the first step. 16. The flip chip mounting method according to claim 15, wherein the first insulating resin is coated on a side surface of the connection body by surface tension. 16. The flip chip mounting method according to claim 15, wherein the first insulating resin is made of a material having a lower elastic modulus than the second insulating resin. In the bump formation method of the substrate having a plurality of electrodes,
An arrangement step of arranging a mold having a recess corresponding to a desired bump height on the substrate;
An injection step of injecting a molten resin containing molten solder powder into the space formed by the substrate and the concave portion of the mold,
In the molten resin injection step, the molten solder powder self-assembles on the electrode of the substrate to form a bump on the electrode. The bump forming method according to claim 19, wherein, in the mold arranging step, a bump height is adjusted by embedding a spacer in a concave portion of the mold. The bump forming method according to claim 19, wherein, in the molten resin injection step, the molten resin filled in the space is discharged from the space while flowing in the space. The bump forming method according to claim 19, wherein the substrate is a circuit substrate, a semiconductor wafer, or a semiconductor chip. In a flip chip mounting method in which a semiconductor chip having a plurality of electrode terminals is disposed opposite to a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board and the electrode terminals of the semiconductor chip are electrically connected. ,
A disposing step of disposing the semiconductor chip in the recess of the mold;
An arrangement step of arranging a mold on which the semiconductor chip is arranged on the circuit board;
A first injection step of injecting a viscous material containing molten solder powder into a space formed by the circuit board and the mold;
A discharge step of discharging the viscous material filled in the space portion from the space portion;
A second injection step of injecting molten resin into the space after discharging the viscous body from the space;
A curing step of curing the molten resin filled in the space,
In the first injection step of the viscous material, the molten solder powder self-assembles between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip, thereby electrically connecting the connection terminal and the electrode terminal. Connecting body is formed,
The step of discharging the viscous body is performed after the connection body is formed in the first injection step of the viscous body. The flip-chip mounting method according to claim 23, wherein the viscous body is made of a molten resin, a high boiling point solvent, or oil. In the bump formation method of the substrate having a plurality of electrodes,
A disposing step of disposing a mold having a recess on the substrate;
An injection step of injecting a viscous material containing molten solder powder into the space formed by the substrate and the mold,
In the step of injecting the viscous material, the molten solder powder self-assembles on the electrode of the substrate to form a bump on the electrode. The bump forming method according to claim 25, wherein the viscous body is made of a molten resin, a high boiling point solvent, or oil. A flip chip mounting apparatus for flip chip mounting a semiconductor chip on a circuit board,
A table on which the circuit board is placed;
A mold for disposing the semiconductor chip,
The mold has a recess in which the semiconductor chip is disposed, a vacuum inlet for vacuum-sucking the semiconductor chip, and at least one inlet and outlet.
When the mold is placed on the table, a space is formed by the circuit board and the mold recess,
Flip chip by forming a connection body between the connection terminal of the circuit board and the electrode terminal of the semiconductor chip by injecting a viscous material containing molten solder powder into the space from the injection port of the mold Flip chip mounting device for mounting. 28. The flip chip according to claim 27, wherein the connection body is formed by self-assembling the molten solder powder between a connection terminal of the circuit board and an electrode terminal of the semiconductor chip. Mounting device. 28. The flip chip mounting method according to claim 27, wherein the viscous material injected into the space portion is discharged from the discharge port of the mold while flowing in the space portion. 28. The flip chip mounting apparatus according to claim 27, wherein the viscous body is made of a molten resin, a high boiling point solvent, or oil.

Images