JP2009135452A - Device mounting board, semiconductor module, and mobile device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device mounting board in which solder bumps are formed on electrodes easily and highly precisely. <P>SOLUTION: The device mounting board 10 includes an insulating layer 12 formed of an insulating resin, a glass cloth 16 covering the surface of the insulating layer 12, and the electrode 14 provided in a through-hole extending through the glass cloth 16. The angle of contact with solder of the glass cloth 16 is larger than that of the resin. Thus, the solder bumps are formed on the electrode 14 of the device mounting board 10 easily with high precision. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an element mounting substrate and a semiconductor module including the element mounting substrate.

  In recent years, with the further improvement in performance and functionality of circuit elements such as LSIs, there has been an increasing need for increasing the number of pins and pinching pitches of electrode terminals of circuit elements such as LSIs. Correspondingly, the mounting substrate is also required to be downsized and densified, and the necessity of forming bumps corresponding to the increase in the number of pins and the narrow pitch on the mounting substrate is increasing.

In Patent Document 1, a resin containing solder powder and an additive having a boiling point is supplied onto a substrate having a plurality of electrodes, a flat plate is brought into contact with the surface of the resin supplied onto the substrate, By maintaining the distance between the flat plate to be constant, heating the resin above the boiling point of the additive and above the temperature at which the solder powder melts, and collecting the solder powder on the electrode to form bumps, A method of manufacturing a substrate with bumps, which can form bumps on a large number of electrodes, is disclosed.
JP 2007-150355 A

  However, in the method described in Patent Document 1, it is necessary to use a resin containing a special additive, which causes an increase in manufacturing cost.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an element mounting substrate on which solder bumps are easily formed on electrodes with high accuracy.

  In order to solve the above problems, an element mounting substrate according to an aspect of the present invention is surrounded by an insulating layer formed of an insulating resin, a covering portion that covers the surface of the insulating layer, and the covering portion. An electrode provided in the region. The covering portion has a larger contact angle with the solder than the resin.

  According to this aspect, when molten solder is supplied onto the coating portion to form solder bumps on the electrode, the coating portion around the electrode has a larger contact angle with the solder than the resin, and the solder on the coating portion is soldered. Since it is easy to be repelled, it becomes easy for solder to gather on the electrode provided in the region surrounded by the covering portion. The “region surrounded by the covering portion” is not limited to the case where the periphery of the electrode is completely surrounded, but may be a region where the periphery is partially surrounded.

  An element mounting substrate according to another aspect of the present invention includes an insulating layer formed of an insulating resin, a covering portion that covers the surface of the insulating layer, and an electrode provided in a penetrating portion that penetrates the covering portion. And comprising. The covering portion has a larger contact angle with the solder than the resin.

  According to this aspect, when molten solder is supplied onto the coating portion to form solder bumps on the electrode, the coating portion around the electrode has a larger contact angle with the solder than the resin, and the solder on the coating portion is soldered. Since solder is easily repelled, the solder tends to collect on the electrodes.

  The electrode may be formed such that the exposed surface of the electrode is located inside the through portion.

  The covering portion may have a higher thermal conductivity than the resin.

  The covering portion may be glass fiber.

  The covering portion may be a glass cloth in which glass fibers directed in a plurality of intersecting directions are knitted.

  The covering portion may have scattered convex portions and concave portions.

  You may further provide the wiring layer currently formed on the surface on the opposite side to the side in which the coating | coated part of an insulating layer is formed, and the via conductor which electrically connects an electrode and a wiring layer.

  Another embodiment of the present invention is a semiconductor module. The semiconductor module includes a semiconductor element having electrode terminals and an element mounting substrate. The electrode terminal and the electrode are joined by solder.

  According to this aspect, since the element mounting substrate and the semiconductor element are joined via the solder bumps formed on the electrodes of the element mounting substrate with high accuracy, the reliability of the semiconductor module is improved.

  Yet another embodiment of the present invention is a portable device. This portable device may be equipped with any of the semiconductor modules described above.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate for element mounting which a solder bump can be easily formed on an electrode accurately can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate. Moreover, the structure described below is an illustration and does not limit the scope of the present invention at all.

(First embodiment)
FIG. 1 is a cross-sectional view showing a schematic configuration of an element mounting substrate according to the first embodiment. The element mounting substrate 10 includes an insulating layer 12 formed of an insulating resin, and an electrode 14 provided so as to penetrate from the lower surface side to the upper surface side of the insulating layer 12. The insulating layer 12 includes a glass cloth 16 as a filler having a thermal conductivity higher than that of the contained resin. The glass cloth 16 is a fibrous filler that is oriented so that the direction of the glass fiber intersects the direction perpendicular to the surface of the substrate. The resin according to the present embodiment has a thermal conductivity of 0.2 W / m · K, and the glass cloth 16 has a thermal conductivity of about 1.0 W / m · K. The glass cloth 16 has an exposed portion 16a exposed from the surface on the same side as the side where the electrode 14 of the insulating layer 12 is exposed. In other words, the exposed portion 16 a of the glass cloth 16 functions as a covering portion that covers the surface of the insulating layer 12. The wiring layer 18 includes a second conductor film 26 described later and a plating layer 30a formed so as to cover the second conductor film 26 when the via conductor 30 is formed.

  Therefore, when a semiconductor element in which a predetermined circuit is formed by a known technique is mounted on the element mounting substrate 10 and operated, heat generated in the semiconductor element is dissipated through the glass cloth 16 having a higher thermal conductivity than the resin. It becomes possible to do. Further, the heat of the element mounting substrate 10 itself can be efficiently radiated.

  The element mounting substrate 10 has a wiring layer 18 formed on the lower surface side of the insulating layer 12 shown in FIG. The electrode 14 according to the present embodiment is formed in a hole penetrating the insulating layer 12, in other words, formed in a penetrating portion penetrating the glass cloth 16, and one end of the wiring layer 18 is electrically connected. A via conductor 30 is included. That is, the via conductor 30 functions as the electrode 14 to which the other end is connected to the electrode terminal of the semiconductor element. Note that copper is used for the electrode 14 according to the present embodiment. Further, as the glass cloth 16 according to the present embodiment, a glass cloth 16 having a larger contact angle with a commonly used solder than the resin contained in the insulating layer 12 is employed. The electrode 14 protrudes from the exposed portion 16 a of the glass cloth 16.

  Next, a method for manufacturing the element mounting substrate 10 will be described. 2 to 4 are process cross-sectional views illustrating a method for manufacturing an element mounting substrate according to the first embodiment.

  First, as shown in FIG. 2A, a substrate 22 having an insulating layer 12 including a glass cloth 16 that is formed of an insulating resin and has a larger contact angle with respect to the solder than the resin is prepared. The insulating layer 12 has a first conductor film 24 made of copper on one surface and a second conductor film 26 made of copper on the other surface.

  Next, as shown in FIG. 2B, the second conductor is formed in a pattern corresponding to a location where a connection hole for electrical connection between the element mounting substrate 10 and a semiconductor element such as an LSI is formed. The film 26 is removed. The pattern is formed by lithography exposure and etching. As the etching, for example, wet etching with iron chloride or the like is preferable.

  Next, as shown in FIG. 2C, a part of the insulating layer 12 is removed by irradiating a laser from the second conductor film 26 side until the first conductor film 24 is exposed, and the opening 28 is formed. Form. Here, for example, a carbon dioxide laser can be used for laser irradiation. Laser irradiation is performed in two stages: a first irradiation condition for digging to an arbitrary depth with a beam having a high energy density, and a second irradiation condition for adjusting the shape of the via sidewall with a beam having a low energy density. Thus, the second conductor film 26 has a tapered side wall whose diameter decreases as it approaches the first conductor film 24 from the surface of the insulating layer 12 (the second conductor film 26 side on the lower side in the figure). An opening 28 having a side diameter of about 100 μm and a first conductor film 24 side diameter of about 80 μm can be formed as a via.

  Next, as shown in FIG. 3A, copper is plated on the inner surface of the opening 28 and the second conductor film 26 to a thickness of about 20 μm by using an electroless plating method and an electrolytic plating method. As a result, a via conductor 30 is formed inside the opening 28 and a plating layer 30a is formed on the second conductor film 26, and the first conductor film 24 and the second conductor film 26 are formed via the via. Is conducted. Thereafter, as shown in FIG. 3B, the wiring layer 18 is formed by etching the second conductor film 26 into a predetermined pattern by a known method. In the via conductor 30 shown in FIG. 3A, the opening 28 has an inverted V-shaped space in the opening 28, but the opening 28 is completely filled with copper as shown in FIG. It may be. In order to fill all the openings 28 with copper, it is necessary to lengthen the formation time of plating. In this case, the plating layer 30a formed on the second conductor film 26 also becomes thick. Therefore, the thickness of the plating layer 30a is appropriately adjusted by etching back the entire plating layer according to the current flowing through the wiring layer 18 including the second conductor film 26.

Next, as shown in FIG. 4A, the first conductor film 24 is removed by etching or the like. Thereby, in the insulating layer 12, the electrode 14 penetrates the glass cloth 16. Thereafter, as shown in FIG. 4B, the resin on the surface of the insulating layer 12 on the same side as the side where the electrode 14 is exposed is dissolved and removed, and a part of the glass cloth 16 is exposed to mount the element. The substrate 10 for manufacturing is manufactured. The glass cloth 16 may be exposed by removing the resin by etching using O ₂ plasma treatment.

  FIG. 5 is a view showing a photograph of the surface of the element mounting substrate 10 according to the first embodiment taken with a scanning electron microscope. As shown in FIG. 5, it can be seen that the electrode 14 protrudes through the glass cloth 16.

  Next, a method for manufacturing an element mounting substrate with solder bumps in which solder bumps are formed on the element mounting substrate 10 will be described. FIG. 6 is a process cross-sectional view illustrating the method for manufacturing the element mounting substrate with solder bumps according to the first embodiment. FIG. 7 is a cross-sectional view of the element mounting substrate with solder bumps according to the first embodiment.

  First, the above-described element mounting substrate 10 is prepared. Thereafter, the molten solder 36 is supplied to the entire surface of the element mounting substrate 10 including the surface of the exposed portion 16 a of the glass cloth 16. The supply method of the solder 36 can be realized, for example, by spraying molten solder 36 or immersing the element mounting substrate 10 itself in a solder bath. Further, it can be realized by placing solder paste on the exposed portion 16a by screen printing and then heating by reflow. By these methods, the melted solder 36 can be easily supplied to the entire surface of the element mounting substrate 10 including the surface of the exposed portion 16a.

  When the molten solder 36 is formed on the element mounting substrate 10 including the exposed portion 16a to form solder bumps on the electrode 14, the exposed portion 16a around the electrode 14 has a resin contact angle of resin. Since the solder 37 is larger and is easily repelled on the exposed portion 16a, the solder 37 is easily collected on the electrode 14.

  As shown in FIG. 5, the glass cloth 16 according to the present embodiment is woven with glass fibers heading in a plurality of intersecting directions, and the exposed portion 16 a has periodic convex portions and concave portions. Will be formed. Therefore, the solder 37 that is repelled on the exposed portion 16 a is easily moved due to a partial inclination, and a part of the solder 37 moves toward the electrode 14. Since the electrode 14 is less likely to repel the solder 37 than the glass cloth 16, the solder 37 that has once reached the electrode tends to stay on the electrode 14. As a result, as shown in FIG. 7, solder bumps 38 are formed on the electrodes 14 in a self-aligning manner. Therefore, the solder bump 38 can be formed on the electrode 14 with high accuracy.

  On the other hand, since the solder 37 that does not reach the electrode 14 or contribute to the formation of the solder bump 38 gathers in the concave portion of the exposed portion 16a to become a solder ball of a certain size, the device mounting substrate It can be easily removed from the surface of the element mounting substrate 10 by tilting 10 or the like. Thereby, according to the manufacturing method which concerns on this Embodiment, the board | substrate 50 for element mounting with a solder bump can be manufactured by a simple method.

  FIG. 8 is a view showing a photograph of the surface of the solder bumped element mounting substrate 50 according to the first embodiment taken with a scanning electron microscope. As shown in FIG. 8, it can be seen that solder bumps 38 are formed on the electrodes 14.

  FIG. 9 is a process cross-sectional view illustrating the method of manufacturing the semiconductor module according to the first embodiment. First, as shown in FIG. 9A, a semiconductor element 32 such as an LSI or an IC is mounted on an element mounting board 50 with solder bumps. At this time, the electrode terminal 34 of the semiconductor element 32 and the solder bump 38 of the element mounting substrate 10 are aligned and brought into contact with each other.

  Thereafter, a reflow process is performed in a heated atmosphere, and the element mounting substrate and the semiconductor element 32 are joined by the solder bumps 38 as shown in FIG. 9B, whereby the semiconductor module 100 is completed. Since the solder bumped element mounting substrate 50 and the semiconductor element 32 are joined through the solder bumps 38 formed on the electrodes 14 with high accuracy, the reliability of the semiconductor module 100 can be improved.

(Second Embodiment)
In the element mounting substrate 10 described above, the electrode 14 is provided so as to protrude from the exposed portion 16a. However, in this embodiment, the electrode 14 is provided at a location recessed from the exposed portion 16a. It is a different point. The following description will focus on differences from the first embodiment.

  FIG. 10 is a process cross-sectional view illustrating the method for manufacturing the element mounting substrate according to the second embodiment. The element mounting substrate according to the present embodiment is manufactured using the substrate 22 in which the opening 28 is formed by a laser as in the process shown in FIG.

  As shown in FIG. 10A, the first conductor film 24 is removed, and a part of the via conductor 30 is removed by etching. Thereby, the electrode 14 is formed on the insulating layer 12. Thereafter, as shown in FIG. 10B, the resin on the surface of the insulating layer 12 on the same side as the side where the electrode 14 is exposed is dissolved and removed, and a part of the glass cloth 16 is exposed to mount the element. The substrate 40 for manufacturing is manufactured. As described above, in this embodiment, since the electrode is formed by removing a part of the via conductor 30, an element mounting substrate in which the height of the exposed portion 16 a is higher than the height of the electrode 14 can be easily obtained. Can be manufactured.

  FIG. 11 is a sectional view of an element mounting board 60 with solder bumps according to the second embodiment. Also in the present embodiment, first, the above-described element mounting substrate 40 is prepared. Thereafter, the molten solder 36 is supplied to the surface of the exposed portion 16a of the glass cloth 16 as in the first embodiment. As a result, as in the first embodiment, the solder bumps 38 are formed on the electrodes 14 in a self-aligning manner. In particular, in the element mounting substrate 40 according to the present embodiment, since the electrode is formed by removing a part of the via conductor 30, the electrode 14 is provided at a location recessed from the exposed portion 16a. That is, the electrode 14 is formed inside the penetrating portion that penetrates the glass cloth 16. For this reason, the solder is more likely to gather on the electrode 14, and when the molten solder reaches the electrode 14, it is difficult to separate from the electrode 14 again, and the solder bump 38 is formed with higher accuracy.

(Third embodiment)
In the element mounting substrates 10 and 60 described above, the through electrode is described as an example of the electrode on which the solder is formed. However, the present invention is also effective for an electrode that does not necessarily pass through a covering such as a glass cloth. The following description will focus on differences from the above-described embodiments.

  FIG. 15 is a process cross-sectional view illustrating the method for manufacturing the element mounting substrate according to the third embodiment. The element mounting substrate according to the present embodiment is a substrate 22 having a wiring layer 18 formed on the other surface as shown in FIG. 15A by the same method as the steps shown in FIGS. It is manufactured using. A mask covering the region corresponding to the bump 62 and the electrode 14 shown in FIG. 15B in the first conductor film 24 shown in FIG. 15A is formed by a lithography process, and the other regions are removed by etching. . Thereby, a plurality of electrodes are formed on one surface of the substrate 22.

Thereafter, as shown in FIG. 15C, the resin on the surface of the insulating layer 12 on the same side as the side where the bumps 62 and the electrodes 14 are exposed is dissolved and removed, and a part of the glass cloth 16 is exposed. The element mounting substrate 70 is manufactured. The glass cloth 16 may be exposed by removing the resin by etching using O ₂ plasma treatment. Thus, in the manufacturing method according to the present embodiment, the bumps 62 that function as electrodes that do not penetrate the glass cloth 16 can be formed on the glass cloth 16.

  FIG. 16 is a cross-sectional view of an element mounting board with solder bumps according to a third embodiment. The bumps 62 and the electrodes 14 formed by the method shown in FIG. 15 are surrounded by a glass cloth 16 whose periphery is exposed. Since the glass cloth 16 has a contact angle larger than that of the resin, for example, when molten solder is supplied onto the glass cloth 16, the solder is likely to be repelled on the exposed portion 16 a of the glass cloth 16. As a result, as shown in FIG. 16, the solder adheres to the electrodes 14 and the bumps 62 in a self-aligning manner, and the solder bumps 38 are formed.

  That is, according to the manufacturing method according to the present embodiment, the solder bumps 38 can be easily and accurately formed on the electrodes 14 including the via conductors 30 and the bumps 62 that are protruding electrodes. The bumped element mounting substrate 80 can be manufactured. Then, the semiconductor element 32 such as LSI or IC is mounted on the element mounting substrate 80 with solder bumps. At this time, the electrode terminal 34 of the semiconductor element 32 and the solder bump 38 of the solder bumped element mounting substrate 80 are aligned and brought into contact with each other.

  Thereafter, a reflow process is performed in a heated atmosphere, and the element mounting substrate 70 and the semiconductor element 32 are joined by the solder bumps 38 as shown in FIG. Since the solder bumped element mounting substrate 80 and the semiconductor element 32 are joined via the electrodes 14 including the via conductors 30 and the solder bumps 38 formed on the bumps 62 with high accuracy, the connection reliability of the semiconductor module 110 is determined. Can be improved.

  In addition, since the bump 62 does not penetrate the glass cloth 16, the bump 62 may be formed as a part of a wiring pattern for conducting to other regions. Therefore, when solder is supplied onto the glass cloth 16 in the element mounting substrate on which such bumps 62 are formed, the solder may adhere to the entire wiring pattern. Therefore, there is a demand for a method of forming solder bumps limited to positions corresponding to the bumps 62 in the wiring pattern.

  FIG. 17 is a top view of an element mounting substrate on which a protective film for preventing solder from adhering to a region other than the bump 62 on a wiring pattern that partially functions as the bump 62 is formed. The protective film 64 is a resin layer formed so as to cover a part of the wiring pattern 66 having the bumps 62 by a known exposure process after the process of FIG. The cross-sectional view of the element mounting substrate 70 shown in FIG. 15C corresponds to the AA cross section of FIG.

  18 is a BB cross-sectional view of the element mounting substrate shown in FIG. As shown in FIG. 18, a part of the bump 62 is exposed, and the exposed periphery is surrounded by the glass cloth 16. Thus, even in the case of the bump 62 that does not penetrate the glass cloth 16, the exposed portion of the bump 62 is provided in the region surrounded by the exposed glass cloth 16, The supplied solder is likely to gather on the bumps 62.

(Fourth embodiment)
FIG. 19 is a cross-sectional view of a semiconductor module according to the fourth embodiment. The semiconductor module 200 according to the present embodiment is bonded to the element mounting substrate 90 on which a multilayer (four-layer) wiring pattern is formed via the solder bumps 38 formed on the electrodes of the element mounting substrate 90. And a semiconductor element 92. The semiconductor element 92 has an electrode terminal (not shown).

  In the element mounting substrate 90, a wiring layer 94 is formed on the lower surface side of the insulating layer 12 shown in FIG. The electrode 96 according to the present embodiment is formed in a hole (through hole) that penetrates the insulating layer 12 from the front side to the back side. In other words, the electrode 96 is formed in a penetration part that penetrates the glass cloth 16, and the wiring layer 94 and one end Includes via conductors 98 that are electrically connected. That is, the via conductor 98 functions as an electrode whose other end is electrically connected to the semiconductor element 92. The electrode 97 according to the present embodiment includes a filled via 102 that is electrically connected to the wiring layer 99 formed inside the element mounting substrate 90. Here, the filled via 102 is formed so as to penetrate the glass cloth 16. Also in the semiconductor module 200 configured in this way, the above-described effects can be obtained.

(Fifth embodiment)
Next, a portable device provided with the above-described semiconductor module will be described. In addition, although the example mounted in a mobile telephone as a portable apparatus is shown, electronic devices, such as a personal digital assistant (PDA), a digital video camera (DVC), and a digital still camera (DSC), may be sufficient, for example.

  FIG. 12 is a diagram showing a configuration of a mobile phone including the semiconductor module according to this embodiment. The mobile phone 111 has a structure in which a first housing 112 and a second housing 114 are connected by a movable portion 120. The first housing 112 and the second housing 114 can be rotated about the movable portion 120 as an axis. The first housing 112 is provided with a display unit 118 and a speaker unit 224 for displaying information such as characters and images. The second housing 114 is provided with an operation unit 222 such as operation buttons and a microphone unit 226. The semiconductor module according to the above-described embodiment is mounted inside such a mobile phone 111.

  FIG. 13 is a partial cross-sectional view (cross-sectional view of the first casing 112) of the mobile phone shown in FIG. The semiconductor module 100 according to the present embodiment is mounted on the printed circuit board 128 via the solder bumps 42 and is electrically connected to the display unit 118 and the like via the printed circuit board 128. Further, a heat radiating substrate 116 such as a metal substrate is provided on the back surface side (surface opposite to the solder bumps 42) of the semiconductor module 100, and for example, heat generated from the semiconductor module 100 is transferred into the first housing 112. Heat can be efficiently radiated to the outside of the first housing 112 without being trapped.

  According to the portable device provided with the semiconductor module 100 according to the present embodiment, the connection reliability between the semiconductor element and the element mounting substrate is improved, and as a result, the connection reliability of the semiconductor module 100 is improved. The reliability of the portable device equipped with 100 is improved.

  The present invention has been described with reference to each of the above-described embodiments. However, this is an exemplification, and the present invention is not limited to each of the above-described embodiments, and the configuration of each embodiment is appropriately set. Combinations and substitutions are also included in the present invention. Various modifications such as design changes can be added to each embodiment based on the knowledge of those skilled in the art, and the embodiments to which such modifications are added are also included in the scope of the present invention. sell.

  For example, in each of the embodiments described above, the wiring layer is a single layer, but the present invention is not limited to this, and the wiring layer may be a multilayer.

  Further, in the bump forming step in each of the above-described embodiments, a flat plate may be disposed at a predetermined height from the surface of the element mounting substrate, and molten solder may be supplied to the gap between the element mounting substrate and the flat plate. . As a result, the height of the solder bumps can be made uniform.

  In addition, as a step of removing solder that does not contribute to the formation of solder bumps, the above-described flat plate may be removed, and the element mounting substrate may be tilted with the flat plate removed. As a result, it is possible to easily remove the solder gathered and rounded on the covering portion without forming solder bumps on the electrodes from the element mounting substrate.

It is sectional drawing which shows schematic structure of the element mounting substrate which concerns on 1st Embodiment. FIG. 2A to FIG. 2C are process cross-sectional views illustrating the method for manufacturing the element mounting substrate according to the first embodiment. FIG. 3A and FIG. 3B are process cross-sectional views illustrating a method for manufacturing an element mounting substrate according to the first embodiment. 4A and 4B are process cross-sectional views illustrating a method for manufacturing an element mounting substrate according to the first embodiment. It is a figure which shows the photograph which image | photographed the surface of the element mounting substrate which concerns on 1st Embodiment with the scanning electron microscope. It is process sectional drawing which shows the manufacturing method of the element mounting board | substrate with a solder bump which concerns on 1st Embodiment. It is sectional drawing of the board | substrate for element mounting with a solder bump which concerns on 1st Embodiment. It is a figure which shows the photograph which image | photographed the surface of the board | substrate for element mounting with a solder bump which concerns on 1st Embodiment with the scanning electron microscope. FIG. 9A and FIG. 9B are process cross-sectional views illustrating the method for manufacturing the semiconductor module according to the first embodiment. FIG. 10A and FIG. 10B are process cross-sectional views illustrating a method for manufacturing an element mounting substrate according to the second embodiment. It is sectional drawing of the element mounting board | substrate with a solder bump which concerns on 2nd Embodiment. It is a figure which shows the structure of the mobile telephone which concerns on 5th Embodiment. It is a fragmentary sectional view of the mobile phone shown in FIG. It is process sectional drawing which shows the other manufacturing method of the element mounting board | substrate which concerns on 1st Embodiment. FIG. 15A to FIG. 15C are process cross-sectional views illustrating a method for manufacturing an element mounting substrate according to the third embodiment. It is sectional drawing of the element mounting board | substrate with a solder bump which concerns on 3rd Embodiment. It is a top view of an element mounting substrate on which a protective film for preventing solder from adhering to a region other than a bump on a wiring pattern that partially functions as a bump is formed. It is BB sectional drawing of the element mounting board | substrate shown in FIG. It is sectional drawing of the semiconductor module which concerns on 4th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Element mounting board | substrate, 12 Insulating layer, 14 Electrode, 16 Glass cloth, 16a Exposed part, 18 Wiring layer, 30 Via conductor, 32 Semiconductor element, 34 Electrode terminal, 38 Solder bump, 50 Bumped element mounting board, 100 Semiconductor module, 111 mobile phone.

Claims (10)

An insulating layer formed of an insulating resin;
A covering portion covering the surface of the insulating layer;
An electrode provided in a region surrounded by the covering portion,
The device mounting board, wherein the covering portion has a contact angle with the solder larger than that of the resin. An insulating layer formed of an insulating resin;
A covering portion covering the surface of the insulating layer;
An electrode provided in a penetrating portion that penetrates the covering portion, and
The device mounting board, wherein the covering portion has a contact angle with the solder larger than that of the resin.   The element mounting substrate according to claim 2, wherein the electrode is formed such that an exposed surface of the electrode is positioned inside the through portion.   The element mounting substrate according to claim 1, wherein the covering portion has a thermal conductivity higher than that of the resin.   The element mounting substrate according to claim 1, wherein the covering portion is made of glass fiber.   5. The element mounting substrate according to claim 1, wherein the covering portion is a glass cloth in which glass fibers heading in a plurality of intersecting directions are knitted.   The element mounting substrate according to any one of claims 1 to 6, wherein the covering portion includes dotted convex portions and concave portions. A wiring layer formed on a surface opposite to the side on which the covering portion of the insulating layer is formed;
A via conductor that electrically connects the electrode and the wiring layer;
The device mounting board according to claim 1, further comprising: A semiconductor element having an electrode terminal;
An element mounting substrate according to any one of claims 1 to 8,
The semiconductor module, wherein the electrode terminal and the electrode are joined by solder.   A portable device comprising the semiconductor module according to claim 9.