JP2005150417A - Substrate for semiconductor device, its manufacturing method, and semiconductor device - Google Patents

Substrate for semiconductor device, its manufacturing method, and semiconductor device Download PDF

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JP2005150417A
JP2005150417A JP2003386217A JP2003386217A JP2005150417A JP 2005150417 A JP2005150417 A JP 2005150417A JP 2003386217 A JP2003386217 A JP 2003386217A JP 2003386217 A JP2003386217 A JP 2003386217A JP 2005150417 A JP2005150417 A JP 2005150417A
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substrate
layer
semiconductor device
plating layer
metal
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JP3918803B2 (en
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Toshihide Ito
利秀 伊藤
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Kyocera Circuit Solutions Inc
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NEC Toppan Circuit Solutions Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an extremely thin substrate for a semiconductor device suitable for a fine flip bonding system, and provide its manufacturing method and the semiconductor device. <P>SOLUTION: The substrate 100 for a semiconductor device is configured such that a semiconductor mounting pad 20 composed of a first metal plated layer 12 and a second metal plated layer 13 is formed on one surface of a substrate 40 composed of an insulating layer 42 and an insulating layer 44, and a solder resist pattern 51 and a pad 22a for a solder ball are formed on the other surface of the same. The first metal plated layer 12 comprises a gold or palladium coated film having a thickness of 0.2 to 1.5 μm, and the second metal plated layer 13 comprises a metal or alloy coated film of at least one kind selected from a group composed of 5 to 15 μm thick tin, a tin-silver alloy, a tin-bismuth alloy, a tin-zinc alloy, and a tin-lead alloy. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体チップが搭載されるＢＧＡ（Ball Grid Array）型の極薄の半導体搭載装置用基板であって、特に、微細なフリップ接合に適した半導体搭載装置用基板及びその製造方法並びに半導体装置に関する。   The present invention relates to a BGA (Ball Grid Array) type ultra-thin semiconductor mounting device substrate on which a semiconductor chip is mounted, and more particularly to a semiconductor mounting device substrate suitable for fine flip bonding, a manufacturing method thereof, and a semiconductor Relates to the device.

近年、半導体実装技術の発展によりＬＳＩ等の半導体チップを実装するプリント配線板においては、高密度、高精度の配線層を有する半導体装置用基板が要求されている。
この種の半導体装置用基板には、ＬＳＩ等の半導体チップを搭載可能なＢＧＡ型の半導体装置用基板及び半導体装置用基板に半導体チップを搭載し、樹脂封止することにより、外部要素のマザーボード等に実装可能な半導体装置が提案されている（例えば、特許文献１及び特許文献２参照）。 2. Description of the Related Art In recent years, a semiconductor device substrate having a high-density, high-precision wiring layer is required for a printed wiring board on which a semiconductor chip such as an LSI is mounted due to the development of semiconductor mounting technology.
This type of semiconductor device substrate includes a BGA type semiconductor device substrate on which a semiconductor chip such as an LSI can be mounted, and a semiconductor chip mounted on the semiconductor device substrate and sealed with a resin, thereby providing a mother board of an external element, etc. Have been proposed (see, for example, Patent Document 1 and Patent Document 2).

図１０に上記半導体装置用基板の構成の一例を、図１１に上記半導体装置の一例をそれぞれ示す。   FIG. 10 shows an example of the configuration of the semiconductor device substrate, and FIG. 11 shows an example of the semiconductor device.

図１０に示す半導体装置用基板９００は、絶縁層１４１の一方の面に半導体チップに接続可能な接続電極１３３ｂと、接続電極１３３ｂに個別に接続された配線層１３３ａが、他方の面にランド電極１３１が形成されており、配線層１３３ａとランド電極１３１とはビア１３２にて電気的に接続されている。   10 includes a connection electrode 133b that can be connected to a semiconductor chip on one surface of an insulating layer 141, and a wiring layer 133a that is individually connected to the connection electrode 133b, and a land electrode on the other surface. 131 is formed, and the wiring layer 133 a and the land electrode 131 are electrically connected by a via 132.

各接続電極１３３ｂの表面には、半導体チップと良好な電気的接続を得るためのニッケル層、金層からなるめっき層（特に、図示せず）が形成されている。
図１１に示す半導体装置１０００は、半導体装置用基板９００の半導体チップ搭載部に半導体チップ１５１を搭載し、半導体チップ１５１のパッド電極と接続電極１３３ｂとがボンディングワイヤ１６１にてボンディング接続される。さらに、半導体チップ１５１搭載面はエポキシ樹脂等によるモールド樹脂１７１にて樹脂封止され、ランド電極１３１に半田ボール１８１が形成されたものである。 On the surface of each connection electrode 133b, a plating layer (particularly not shown) made of a nickel layer and a gold layer is formed to obtain good electrical connection with the semiconductor chip.
A semiconductor device 1000 shown in FIG. 11 has a semiconductor chip 151 mounted on a semiconductor chip mounting portion of a semiconductor device substrate 900, and a pad electrode of the semiconductor chip 151 and a connection electrode 133 b are bonded and connected by a bonding wire 161. Further, the semiconductor chip 151 mounting surface is resin-sealed with a mold resin 171 made of epoxy resin or the like, and solder balls 181 are formed on the land electrodes 131.

以下、上記半導体装置用基板９００及び上記半導体装置１０００の製造方法について説明する。   Hereinafter, a method for manufacturing the semiconductor device substrate 900 and the semiconductor device 1000 will be described.

図１２（ａ）〜（ｆ）及び図１３（ｇ）〜（ｋ）は、上記半導体装置用基板９００の製造方法の一例を示す模式構成部分断面図である。   12A to 12F and FIGS. 13G to 13K are schematic configuration partial cross-sectional views showing an example of a method for manufacturing the semiconductor device substrate 900.

まず、シート状の０．２ｍｍ厚の銅合金からなる金属板１１０を洗浄、乾燥後、この金属板１１０の裏面に、ドライフィルム等をラミネートして保護層１１３を形成する。しかる後、この金属板１１０の表面に感光性の液状レジスト（ＰＭＥＲ；商品名：東京応化工業（株）製）を塗布、乾燥し、２５μｍ厚の感光層を形成し、パターン露光、現像等のパターニング処理を行って、開口部１１２を有するレジストパターン１１１を形成する（図１２（ａ）参照）。   First, after cleaning and drying a sheet-like metal plate 110 made of a copper alloy having a thickness of 0.2 mm, a protective film 113 is formed on the back surface of the metal plate 110 by laminating a dry film or the like. Thereafter, a photosensitive liquid resist (PMER; trade name: manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied to the surface of the metal plate 110 and dried to form a photosensitive layer having a thickness of 25 μm. Patterning is performed to form a resist pattern 111 having an opening 112 (see FIG. 12A).

次に、金属板１１０を電極として電解はんだめっきを行い、開口部１１２の金属板１１０上に３〜５μｍのはんだ層１２１を形成する（図１２（ｂ）参照）。   Next, electrolytic solder plating is performed using the metal plate 110 as an electrode to form a 3 to 5 μm solder layer 121 on the metal plate 110 in the opening 112 (see FIG. 12B).

さらに、金属板１１０を電極として電解銅めっきを行い、はんだ層１２１上に約１５μｍ厚のランド電極１３１を形成する（図１２（ｃ）参照）。   Further, electrolytic copper plating is performed using the metal plate 110 as an electrode to form a land electrode 131 having a thickness of about 15 μm on the solder layer 121 (see FIG. 12C).

次に、感光性絶縁樹脂（ＤＰＲ−１０５：商品名：（株）アサヒ化学研究所製）をスクリーン印刷により塗布、乾燥して感光層を形成し、パターン露光、現像等の一連のパターニング処理を行って、ビア用孔１４２を形成し、ランド電極１３１のほぼ中央部に、穴径０．０８ｍｍのビア用孔１４２を有する４０μｍ厚の絶縁層１４１を形成する。（図１２
（ｄ）参照）。 Next, a photosensitive insulating resin (DPR-105: trade name: manufactured by Asahi Chemical Laboratory Co., Ltd.) is applied by screen printing and dried to form a photosensitive layer, followed by a series of patterning processes such as pattern exposure and development. Then, a via hole 142 is formed, and a 40 μm-thick insulating layer 141 having a via hole 142 having a hole diameter of 0.08 mm is formed at substantially the center of the land electrode 131. (Fig. 12
(See (d)).

次に、金属板１１０を電極として電解銅めっきを行い、ビア用孔１４２内にフィルドビア１３２を形成する。さらに、フィルドビア１３２上面及び絶縁層１４１表面をバフ研磨して、絶縁層１４１の平滑化処理を行う（図１２（ｅ）参照）。   Next, electrolytic copper plating is performed using the metal plate 110 as an electrode to form a filled via 132 in the via hole 142. Further, the top surface of the filled via 132 and the surface of the insulating layer 141 are buffed to perform a smoothing process on the insulating layer 141 (see FIG. 12E).

次に、絶縁層１４１表面に無電解銅めっきにて厚さ０．５μｍのめっき下地層を形成し、さらに、電解銅めっきにて厚さ１０μｍの銅からなる導体層１３３を形成する（図１２（ｆ）参照）。   Next, a plating base layer having a thickness of 0.5 μm is formed on the surface of the insulating layer 141 by electroless copper plating, and a conductor layer 133 made of copper having a thickness of 10 μm is further formed by electrolytic copper plating (FIG. 12). (Refer to (f)).

次に、感光性の液状レジスト（ＰＭＥＲ）を塗布、乾燥し、厚さ１０μｍの感光層を形成し、パターン露光、現像等の一連のパターニング処理を行って、レジストパターン１１４を形成する（図１３（ｇ）参照）。   Next, a photosensitive liquid resist (PMER) is applied and dried to form a photosensitive layer having a thickness of 10 μm, and a series of patterning processes such as pattern exposure and development are performed to form a resist pattern 114 (FIG. 13). (See (g)).

さらに、塩化第２鉄液を用いて導体層１３３をエッチングし、レジストパターン１１４を専用の剥離液で剥離処理し、接続電極１３３ｂ及び配線領域１３３ａを形成する（図１３（ｈ）参照）。
次に、スクリーン印刷等で感光性のレジストを塗布して感光層を形成し、パターン露光、現像等の一連のパターニング処理を行って、配線領域１３３ａ上にレジストパターン１１５を形成する（図１３（ｉ）参照）。さらに、レジストパターン１１５をマスクにして無電解めっきを行い、接続電極１３３ｂ上に、厚さ２μｍのニッケル層及び厚さ０．３μｍの金層（特に、図示せず）を形成し、レジストパターン１１５及び保護層１１３を専用の剥離液で剥離処理し、出荷可能な半導体装置用基板が形成される（図１３（ｊ）参照）。 Further, the conductor layer 133 is etched using a ferric chloride solution, and the resist pattern 114 is stripped with a dedicated stripping solution to form the connection electrode 133b and the wiring region 133a (see FIG. 13 (h)).
Next, a photosensitive resist is applied by screen printing or the like to form a photosensitive layer, and a series of patterning processes such as pattern exposure and development are performed to form a resist pattern 115 on the wiring region 133a (FIG. 13 ( i)). Further, electroless plating is performed using the resist pattern 115 as a mask to form a nickel layer having a thickness of 2 μm and a gold layer having a thickness of 0.3 μm (not shown) on the connection electrode 133b. Then, the protective layer 113 is stripped with a dedicated stripping solution to form a semiconductor device substrate that can be shipped (see FIG. 13J).

さらに、接続電極１３３ｂ及び配線領域１３３ａ面に保護層（特に、図示せず）を形成し、銅合金からなる金属基板１１０をエッチングにより除去して、半導体装置用基板９００を得る（図１３（ｋ）参照）。   Further, a protective layer (not shown) is formed on the surfaces of the connection electrode 133b and the wiring region 133a, and the metal substrate 110 made of a copper alloy is removed by etching to obtain a semiconductor device substrate 900 (FIG. 13 (k)). )reference).

ここで、はんだを溶解せず、銅合金を溶解するエッチング液を用いれば、はんだ層１２１がエッチングストッパー層となり銅合金からなる金属基板１１０のみがエッチングされ、はんだ層１２１及びランド電極１３１は残る。   Here, if an etching solution that dissolves the copper alloy without dissolving the solder is used, the solder layer 121 becomes an etching stopper layer, and only the metal substrate 110 made of the copper alloy is etched, and the solder layer 121 and the land electrode 131 remain.

以下、半導体装置の製造方法について説明する。
まず、図１３（ｋ）に示す半導体装置用基板９００の半導体チップ搭載部に半導体チップ１５１を搭載し、半導体チップ１５１のパッド電極と接続電極１３３ｂとがボンディングワイヤ１６１にてボンディング接続する。さらに、半導体チップ１５１搭載面をエポキシ樹脂等による絶縁樹脂１７１にて樹脂封止して、銅合金からなる金属基板１１０をエッチングにより除去し、ランド電極１３１に半田ボール１８１を形成して、半導体装置１０００を得る。
上記半導体装置では、半導体チップを半導体装置用基板に接合する方式としては、上記ワイヤボンディング方式やＣ４（Controlled Collapse Chip Connection）接続が広く使われているが、さらに、微細な接合を行うために、最近では、半導体に金バンプを利用したＡＣＦ接続、導電性樹脂接続、金−金圧接、金−はんだ接続などのフリップ接合が採用されている。
特開平１０−１２５８１８号公報 特開平１０−１２５８１９号公報 Hereinafter, a method for manufacturing a semiconductor device will be described.
First, the semiconductor chip 151 is mounted on the semiconductor chip mounting portion of the semiconductor device substrate 900 shown in FIG. 13 (k), and the pad electrode of the semiconductor chip 151 and the connection electrode 133 b are bonded and connected by the bonding wire 161. Further, the semiconductor chip 151 mounting surface is resin-sealed with an insulating resin 171 such as an epoxy resin, the metal substrate 110 made of a copper alloy is removed by etching, and solder balls 181 are formed on the land electrodes 131 to form a semiconductor device. Get 1000.
In the semiconductor device, the wire bonding method and the C4 (Controlled Collapse Chip Connection) connection are widely used as a method for bonding a semiconductor chip to a substrate for a semiconductor device. In order to perform fine bonding, Recently, flip bonding such as ACF connection using gold bumps, conductive resin connection, gold-gold pressure welding, and gold-solder connection has been adopted for semiconductors.
JP-A-10-125818 Japanese Patent Laid-Open No. 10-125819

上記、半導体装置用基板の製造方法の一例として述べた銅合金からなる金属板上にビルドアップ工法で製造する半導体装置用基板は、半導体装置の小型化、高密度化の技術動向に伴って、微細なフリップ接合方式の採用が望まれている。   The above-mentioned semiconductor device substrate manufactured by a build-up method on a metal plate made of a copper alloy described as an example of a method for manufacturing a semiconductor device substrate, along with technological trends in downsizing and increasing the density of semiconductor devices, Adoption of a fine flip bonding method is desired.

そこで本発明は、微細なフリップ接合方式に適した極薄の半導体装置用基板及びその製造方法並びに半導体装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide an ultra-thin substrate for a semiconductor device suitable for a fine flip bonding method, a manufacturing method thereof, and a semiconductor device.

本発明は、上記課題を達成するために、まず請求項１においては、基板の一方の面に半導体実装パッドが、他方の面にはんだボール用パッドが形成されてなる半導体装置用基板であって、前記半導体実装パッドが、表面から順に、第１の金属めっき層及び第２の金属めっき層で構成されていることを特徴とする半導体装置用基板としたものである。   In order to achieve the above object, the present invention provides a semiconductor device substrate according to claim 1, wherein a semiconductor mounting pad is formed on one surface of the substrate and a solder ball pad is formed on the other surface. The semiconductor mounting pad includes a first metal plating layer and a second metal plating layer in order from the surface.

また、請求項２においては、基板の一方の面に半導体実装パッドが、他方の面にはんだボール用パッドが形成されてなる半導体装置用基板であって、前記半導体実装パッドが、表面から順に、第１の金属めっき層、第２の金属めっき層及びバリヤめっき層で構成されていることを特徴とする半導体装置用基板としたものである。   According to a second aspect of the present invention, there is provided a substrate for a semiconductor device in which a semiconductor mounting pad is formed on one surface of the substrate and a solder ball pad is formed on the other surface, and the semiconductor mounting pad is in order from the surface. A substrate for a semiconductor device, characterized in that it is composed of a first metal plating layer, a second metal plating layer, and a barrier plating layer.

また、請求項３においては、前記第１の金属めっき層が金もしくはパラジウムのいずれかの金属からなることを特徴とする請求項１または２に記載の半導体装置用基板としたものである。   According to a third aspect of the present invention, in the semiconductor device substrate according to the first or second aspect, the first metal plating layer is made of a metal of gold or palladium.

また、請求項４においては、前記第２の金属めっき層が錫、錫銀合金、錫ビスマス合金、錫亜鉛合金、錫鉛合金からなる群から選ばれた少なくとも１種の金属もしくは合金からなることを特徴とする請求項１または２に記載の半導体装置用基板としたものである。   According to a fourth aspect of the present invention, the second metal plating layer is made of at least one metal or alloy selected from the group consisting of tin, tin silver alloy, tin bismuth alloy, tin zinc alloy, and tin lead alloy. A substrate for a semiconductor device according to claim 1 or 2.

また、請求項５においては、前記バリヤめっき層がニッケルからなることを特徴とする請求項２に記載の半導体装置用基板としたものである。   According to a fifth aspect of the present invention, in the semiconductor device substrate according to the second aspect, the barrier plating layer is made of nickel.

また、請求項６においては、前記半導体実装パッドが、平板上の金属基板にて被覆されていることを特徴とする請求項１乃至５のいずれか一項に記載の半導体装置用基板としたものである。   6. The semiconductor device substrate according to claim 1, wherein the semiconductor mounting pad is covered with a flat metal substrate. It is.

また、請求項７においては、請求項１乃至５のいずれか一項に記載の半導体装置用基板上に半導体を搭載したことを特徴とする半導体装置としたものである。   According to a seventh aspect of the present invention, a semiconductor device is characterized in that a semiconductor is mounted on the substrate for a semiconductor device according to any one of the first to fifth aspects.

また、請求項８においては、少なくとも以下の工程を有することを特徴とする請求項１に記載の半導体装置用基板の製造方法としたものである。
（ａ）金属基板１０の一方の面にバリヤ層１１を形成する工程。
（ｂ）バリヤ層１１上に所定厚の絶縁層４２を形成し、絶縁層４２の所定位置に開口部４３を形成する工程。
（ｃ）開口部４３内に所定厚の第１の金属めっき層１２を形成する工程。
（ｄ）開口部４３内の第１の金属めっき層１２上に第２の金属めっき層１３を形成する工程。
（ｅ）絶縁層（４２）表面を研磨処理して、サブトラクティブ法、もしくはセミアディテブ法、もしくはフルアディティブ法にて、配線層（２２）及びビア（２３）を形成する工程。
（ｆ）必用に応じて、上記（ｅ）の工程を所定回数繰り返す工程。
（ｇ）ソルダーレジストパターン（５１）を形成してはんだボール用パッド（２２ａ）を形成する工程。
（ｈ）金属基板（１０）をエッチングで除去する工程。
（ｉ）バリア層を除去する工程。 Further, according to an eighth aspect of the present invention, there is provided the method for manufacturing a substrate for a semiconductor device according to the first aspect, comprising at least the following steps.
(A) A step of forming the barrier layer 11 on one surface of the metal substrate 10.
(B) A step of forming an insulating layer 42 having a predetermined thickness on the barrier layer 11 and forming an opening 43 at a predetermined position of the insulating layer 42.
(C) A step of forming the first metal plating layer 12 having a predetermined thickness in the opening 43.
(D) A step of forming the second metal plating layer 13 on the first metal plating layer 12 in the opening 43.
(E) A step of polishing the surface of the insulating layer (42) to form a wiring layer (22) and a via (23) by a subtractive method, a semi-additive method, or a full additive method.
(F) A step of repeating the step (e) a predetermined number of times as necessary.
(G) A step of forming a solder ball pad (22a) by forming a solder resist pattern (51).
(H) A step of removing the metal substrate (10) by etching.
(I) A step of removing the barrier layer.

さらにまた、請求項９においては、少なくとも以下の工程を有することを特徴とする請求項２に記載の半導体装置用基板の製造方法としたものである。
（ａ）金属基板１０の一方の面にバリヤ層１１を形成する工程。
（ｂ）バリヤ層１１上に所定厚の絶縁層４２を形成し、絶縁層４２の所定位置に開口部４３を形成する工程。
（ｃ）開口部４３内に所定厚の第１の金属めっき層１２を形成する工程。
（ｄ）開口部４３内の第１の金属めっき層１２上に第２の金属めっき層１３を形成する工程。
（ｅ）開口部４３内の第１の金属めっき層１２及び第２の金属めっき層１３上にバリヤめっき層１４を形成する工程。
（ｆ）絶縁層（４２）表面を研磨処理して、サブトラクティブ法、もしくはセミアディテブ法、もしくはフルアディティブ法にて、配線層（２２）及びビア（２３）を形成する工程。
（ｇ）必用に応じて、上記（ｆ）の工程を所定回数繰り返す工程。
（ｈ）ソルダーレジストパターン（５１）を形成して、はんだボール用パッド（２２ａ）を形成する工程。
（ｉ）金属基板（１０）をエッチングで除去する工程。
（ｊ）バリア層を除去する工程。 Furthermore, according to a ninth aspect of the present invention, there is provided the method for manufacturing a substrate for a semiconductor device according to the second aspect, comprising at least the following steps.
(A) A step of forming the barrier layer 11 on one surface of the metal substrate 10.
(B) A step of forming an insulating layer 42 having a predetermined thickness on the barrier layer 11 and forming an opening 43 at a predetermined position of the insulating layer 42.
(C) A step of forming the first metal plating layer 12 having a predetermined thickness in the opening 43.
(D) A step of forming the second metal plating layer 13 on the first metal plating layer 12 in the opening 43.
(E) A step of forming the barrier plating layer 14 on the first metal plating layer 12 and the second metal plating layer 13 in the opening 43.
(F) A step of polishing the surface of the insulating layer (42) to form a wiring layer (22) and a via (23) by a subtractive method, a semi-additive method, or a full additive method.
(G) A step of repeating the step (f) a predetermined number of times as necessary.
(H) A step of forming a solder resist pattern (51) to form a solder ball pad (22a).
(I) A step of removing the metal substrate (10) by etching.
(J) A step of removing the barrier layer.

本発明の半導体装置用基板は、半導体実装パッドがＳｎまたはＳｎを主成分とする合金にて形成されているため、半導体チップを実装する際３００℃以下の加熱によって、半導体チップに設けた金バンプやはんだバンプと半導体実装パッドとの接合が可能である。   In the semiconductor device substrate of the present invention, since the semiconductor mounting pad is formed of Sn or an alloy containing Sn as a main component, the gold bumps provided on the semiconductor chip by heating at 300 ° C. or lower when the semiconductor chip is mounted. In addition, the solder bump and the semiconductor mounting pad can be joined.

さらに、ＳｎまたはＳｎを主成分とする合金の表面には、金めっき層が形成されているため、銅合金などのエッチング薬液に侵されることを防ぎ、長期保存中でのホイスカの発生を防ぐことができるので、安定した接続性能を維持できる。   Furthermore, since a gold plating layer is formed on the surface of Sn or an alloy containing Sn as a main component, it is prevented from being attacked by an etching chemical such as a copper alloy, and the occurrence of whiskers during long-term storage is prevented. Therefore, stable connection performance can be maintained.

また、本発明の半導体装置用基板の製造方法によれば、半導体実装パッドは銅合金等からなる平板上の金属基板の表面に形成されるので、コプラナリティーに優れた半導体実装パッド表面を得ることができる。   According to the method for manufacturing a substrate for a semiconductor device of the present invention, since the semiconductor mounting pad is formed on the surface of the metal substrate on a flat plate made of a copper alloy or the like, a semiconductor mounting pad surface having excellent coplanarity can be obtained. Can do.

図１（ａ）及び（ｂ）、図２（ａ）及び（ｂ）は、本発明の半導体装置用基板の一実施例を示す模式構成断面図である。   1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b) are schematic sectional views showing one embodiment of a substrate for a semiconductor device of the present invention.

図１（ａ）に示す半導体装置用基板１００は、基板４０の一方の面に第１の金属めっき層１２と第２の金属めっき層１３からなる半導体実装パッド２０が、他方の面にソルダーレジストパターン５１及びはんだボール用パッド２２ａが形成されたものである。   A semiconductor device substrate 100 shown in FIG. 1A has a semiconductor mounting pad 20 composed of a first metal plating layer 12 and a second metal plating layer 13 on one surface of a substrate 40, and a solder resist on the other surface. A pattern 51 and a solder ball pad 22a are formed.

ここで、第１の金属めっき層１２は、０．２〜１．５μｍの膜厚の金もしくはパラジウム皮膜をめっきで形成したもので、金、パラジウムは化学的に変質しにくいため、第２の金属めっき層１３を被覆して、基板製造ならびに半導体パッケージング工程における諸薬品による変質や棚置による環境からの変質を防ぐとともに、０．２〜１．５μｍの薄膜としているため、半導体の実装時には半導体バンプと第２の金属めっき層１３の接合を防害しない。   Here, the first metal plating layer 12 is formed by plating a gold or palladium film having a thickness of 0.2 to 1.5 μm, and gold and palladium are not easily chemically altered. The metal plating layer 13 is coated to prevent deterioration due to various chemicals in the board manufacturing and semiconductor packaging process and from the environment due to shelves, and since it is a thin film of 0.2 to 1.5 μm, when mounting a semiconductor The bonding between the semiconductor bump and the second metal plating layer 13 is not harmed.

第２の金属めっき層１３は、５〜１５μｍ膜厚の錫、錫銀合金、錫ビスマス合金、錫亜鉛合金、錫鉛合金からなる群から選ばれた少なくとも１種の金属もしくは合金皮膜をめっきで形成したもので、３００℃以下の加熱によって溶融されることによって、半導体バンプ材質である金、はんだ合金と拡散接合できる。   The second metal plating layer 13 is formed by plating at least one metal or alloy film selected from the group consisting of tin, tin-silver alloy, tin-bismuth alloy, tin-zinc alloy, and tin-lead alloy having a thickness of 5 to 15 μm. By being formed and melted by heating at 300 ° C. or lower, diffusion bonding can be performed with gold or solder alloy as semiconductor bump materials.

図１（ｂ）に示す半導体装置用基板２００は、上記半導体装置用基板１００を製造する
ために使用した銅合金等からなる金属基板１０を付けた状態の半導体装置用基板である。 A semiconductor device substrate 200 shown in FIG. 1B is a semiconductor device substrate with a metal substrate 10 made of a copper alloy or the like used to manufacture the semiconductor device substrate 100 attached thereto.

これは、樹脂に比較して平坦で、熱変形の少ない金属基板１０を付けた状態にすることによって、基板製造ならびに半導体パッケージング工程における基板の反り、ねじれ変形を防止でき、半導体実装面の高い、コプラナリティーを確保できるので、信頼性の高い接合が可能である。   This is because the metal substrate 10 that is flat compared to the resin and has less thermal deformation can prevent warping and torsional deformation of the substrate in the substrate manufacturing and semiconductor packaging process, and has a high semiconductor mounting surface. Since coplanarity can be secured, highly reliable joining is possible.

図２（ａ）に示す半導体装置用基板３００は、基板４０の一方の面に、第１の金属めっき層１２と第２の金属めっき層１３とバリヤめっき層１４からなるからなる半導体実装パッド３０が、他方の面にソルダーレジストパターン５１及びはんだボール用パッド２２ａが形成されたものである。   A semiconductor device substrate 300 shown in FIG. 2A has a semiconductor mounting pad 30 formed of a first metal plating layer 12, a second metal plating layer 13, and a barrier plating layer 14 on one surface of a substrate 40. However, the solder resist pattern 51 and the solder ball pads 22a are formed on the other surface.

ここで、第１の金属めっき層１２、第２の金属めっき層１３については、上記半導体装置用基板１００と同じ膜組成である。バリヤめっき層１４は１〜８μｍ膜厚のニッケル皮膜をめっきで形成したもので、第２の金属めっき層１３の金属が銅からなる配線層２１に拡散するのを防止する役目をしている。   Here, the first metal plating layer 12 and the second metal plating layer 13 have the same film composition as that of the semiconductor device substrate 100. The barrier plating layer 14 is formed by plating a nickel film having a thickness of 1 to 8 μm, and serves to prevent the metal of the second metal plating layer 13 from diffusing into the wiring layer 21 made of copper.

図２（ｂ）に示す半導体装置用基板４００は、上記半導体装置用基板３００を製造するために使用した銅合金からなる金属基板１０を付けた状態の半導体装置用基板である。
作用効果は、上記半導体装置用基板２００と同じなのでここでは省略する。 A semiconductor device substrate 400 shown in FIG. 2B is a semiconductor device substrate with the metal substrate 10 made of a copper alloy used for manufacturing the semiconductor device substrate 300 attached thereto.
Since the function and effect are the same as those of the semiconductor device substrate 200, the description thereof is omitted here.

上記半導体実装パッド２０及び半導体実装パッド３０の表面は、絶縁層表面と同一面（図９（ａ））でもよいし、凹状（図９（ｂ））でも、凸状（図９（ｃ））でもよい。ソルダーレジストを一部被覆させても良い。   The surface of the semiconductor mounting pad 20 and the semiconductor mounting pad 30 may be the same surface as the insulating layer surface (FIG. 9A), concave (FIG. 9B), or convex (FIG. 9C). But you can. A part of the solder resist may be coated.

図３（ａ）及び（ｂ）、図４（ａ）及び（ｂ）は、本発明の半導体装置の一実施例を示す模式構成断面図である。   FIGS. 3A and 3B and FIGS. 4A and 4B are schematic cross-sectional views showing an embodiment of the semiconductor device of the present invention.

図３（ａ）に示す半導体装置５００は、上記半導体装置用基板１００の一方の面の半導体実装パッド２０に半導体チップ６１の外部接続端子である金バンプ６２を接合し、半導体チップ６１と半導体装置用基板１００の間はアンダーフィル樹脂７１にて固定されており、他方の面のはんだボールパッド２２ａにはんだボール８１が形成された構造になっている。   A semiconductor device 500 shown in FIG. 3A is formed by bonding gold bumps 62, which are external connection terminals of the semiconductor chip 61, to the semiconductor mounting pad 20 on one surface of the semiconductor device substrate 100. The substrate 100 is fixed with an underfill resin 71, and a solder ball 81 is formed on the solder ball pad 22a on the other surface.

ここで、半導体実装パッド２０の第１の金属めっき層１２は第２の金属めっき層１３に溶融拡散しており、第２の金属めっき層と半導体チップ６１の金バンプ６２が結合している。   Here, the first metal plating layer 12 of the semiconductor mounting pad 20 is melted and diffused into the second metal plating layer 13, and the second metal plating layer and the gold bump 62 of the semiconductor chip 61 are bonded.

図３（ｂ）に示す半導体装置６００は、上記半導体装置用基板３００の一方の面の半導体実装パッド３０に半導体チップ６１の外部接続端子である金バンプ６２を接合し、半導体チップ６１と半導体装置用基板３００の間はアンダーフィル樹脂７１にて固定されており、他方の面のはんだボールパッド２２ａにはんだボール８１が形成された構造になっている。   In the semiconductor device 600 shown in FIG. 3B, a gold bump 62 which is an external connection terminal of the semiconductor chip 61 is bonded to the semiconductor mounting pad 30 on one surface of the semiconductor device substrate 300, and the semiconductor chip 61 and the semiconductor device are connected. The substrate 300 is fixed with an underfill resin 71, and a solder ball 81 is formed on the solder ball pad 22a on the other surface.

ここで、半導体実装パッド３０の第１の金属めっき層１２は第２の金属めっき層１３に溶融拡散しており、第２の金属めっき層１３と半導体チップ６１の金バンプ６２が結合している。   Here, the first metal plating layer 12 of the semiconductor mounting pad 30 is melted and diffused into the second metal plating layer 13, and the second metal plating layer 13 and the gold bumps 62 of the semiconductor chip 61 are bonded. .

バリヤめっき層１４は、第２の金属めっき層１３の金属が銅からなる配線層２１に拡散するのを防止する役目をしている。   The barrier plating layer 14 serves to prevent the metal of the second metal plating layer 13 from diffusing into the wiring layer 21 made of copper.

図４（ａ）に示す半導体装置７００は、上記半導体装置用基板１００の一方の面の半導体実装パッド２０に半導体チップ６１の外部接続端子であるはんだバンプ６３を接合し、半導体チップ６１と半導体装置用基板１００の間はアンダーフィル樹脂７１にて固定されており、他方の面のはんだボールパッド２２ａにはんだボール８１が形成された構造になっている。   A semiconductor device 700 shown in FIG. 4A is formed by bonding solder bumps 63 that are external connection terminals of the semiconductor chip 61 to the semiconductor mounting pads 20 on one surface of the semiconductor device substrate 100. The substrate 100 is fixed with an underfill resin 71, and a solder ball 81 is formed on the solder ball pad 22a on the other surface.

ここで、半導体実装パッド２０の第１の金属めっき層１３は第２の金属めっき層１３に溶融拡散しており、第２の金属めっき層１３と半導体チップ６１のはんだバンプ６２が結合している。   Here, the first metal plating layer 13 of the semiconductor mounting pad 20 is melt-diffused into the second metal plating layer 13, and the second metal plating layer 13 and the solder bumps 62 of the semiconductor chip 61 are bonded. .

図４（ｂ）に示す半導体装置８００は、上記半導体装置用基板３００の一方の面の半導体実装パッド３０に半導体チップ６１の外部接続端子であるはんだバンプ６３を接合し、半導体チップ６１と半導体装置用基板３００の間はアンダーフィル樹脂７１にて固定されており、他方の面のはんだボールパッド２２ａにはんだボール８１が形成された構造になっている。   A semiconductor device 800 shown in FIG. 4B is formed by bonding solder bumps 63 as external connection terminals of the semiconductor chip 61 to the semiconductor mounting pads 30 on one surface of the semiconductor device substrate 300. The substrate 300 is fixed with an underfill resin 71, and a solder ball 81 is formed on the solder ball pad 22a on the other surface.

ここで、半導体実装パッド３０の第１の金属めっき層１２は第２の金属めっき層１３に溶融拡散しており、第２の金属めっき層１３と半導体チップ６１のはんだバンプ６２が結合している。   Here, the first metal plating layer 12 of the semiconductor mounting pad 30 is melted and diffused into the second metal plating layer 13, and the second metal plating layer 13 and the solder bumps 62 of the semiconductor chip 61 are bonded. .

バリヤめっき層１４は、第２の金属めっき層１３の金属が銅からなる配線層２１に拡散するのを防止する役目をしている。   The barrier plating layer 14 serves to prevent the metal of the second metal plating layer 13 from diffusing into the wiring layer 21 made of copper.

以下、本発明の半導体装置用基板の製造法について説明する。   Hereinafter, a method for manufacturing a substrate for a semiconductor device of the present invention will be described.

請求項８に係わる本発明の半導体装置用基板の製造方法について説明する。   A method for manufacturing a substrate for a semiconductor device according to an eighth aspect of the present invention will be described.

図５（ａ）〜（ｆ）、図６（ｇ）〜（ｋ）は、本発明の半導体装置用基板１００及び２００の製造方法の一例を工程順に示す模式構成断面図である。   FIGS. 5A to 5F and FIGS. 6G to 6K are schematic configuration cross-sectional views showing an example of a method of manufacturing the semiconductor device substrates 100 and 200 of the present invention in the order of steps.

まず、銅合金からなる金属基板１０の他方の面にドライフィルム等をラミネートする等の方法で保護層４１を形成し、金属基板１０の一方の面に電解ニッケルめっきにより、０．５〜２μｍ厚のバリヤ層１１を形成する（図５（ａ）参照）。   First, the protective layer 41 is formed by a method such as laminating a dry film or the like on the other surface of the metal substrate 10 made of a copper alloy, and the thickness of the metal substrate 10 is 0.5 to 2 μm by electrolytic nickel plating. The barrier layer 11 is formed (see FIG. 5A).

このバリヤ層１１は、後で形成する第１の金属めっき層が銅合金からなる金属基板に拡散するのを防止するためである。   This barrier layer 11 is for preventing a first metal plating layer to be formed later from diffusing into a metal substrate made of a copper alloy.

ここで、金属基板１０として銅合金を、バリヤ層１１としてニッケルを挙げたが、銅合金、ニッケルに変えて選択的にエッチング除去可能な他の金属であっても良い。   Here, a copper alloy is used as the metal substrate 10, and nickel is used as the barrier layer 11. However, instead of the copper alloy and nickel, other metals that can be selectively removed by etching may be used.

また、金属基板１０の片面に保護層を形成して、後工程を進めたが、金属基板１０を積層して、両面工法で後工程を進め、最後に金属基板を分離して、半導体装置用基板を作製する方法も可能である。   Further, the protective layer is formed on one side of the metal substrate 10 and the post-process is advanced. However, the metal substrate 10 is laminated, the post-process is advanced by the double-sided construction method, and finally the metal substrate is separated to be used for a semiconductor device. A method for manufacturing a substrate is also possible.

次に、バリヤめっき層１１上にエポキシ樹脂等の樹脂溶液を塗布するか、プリプレグシートをラミネートする等の方法で、所定厚の樹脂層を形成し、加熱硬化して絶縁層４２を形成し、絶縁層４２の所定位置にレーザー加工等により所定サイズの開口部４３を形成し、開口部４３の底または内壁に付着した樹脂残渣を、ドライデスミア、またはウェットデスミア等のデスミア処理にて除去する（図５（ｂ）参照）。   Next, by applying a resin solution such as an epoxy resin on the barrier plating layer 11 or laminating a prepreg sheet, a resin layer having a predetermined thickness is formed, and heat-cured to form the insulating layer 42. An opening 43 having a predetermined size is formed at a predetermined position of the insulating layer 42 by laser processing or the like, and a resin residue adhering to the bottom or inner wall of the opening 43 is removed by a desmear process such as dry desmear or wet desmear ( (Refer FIG.5 (b)).

次に、金属板１０をカソードにして電解めっきを行い、開口部４３内のバリヤめっき層１１上に所定厚の金もしくはパラジウム皮膜からなる第１の金属めっき層１２を形成する（図５（ｃ）参照）。
ここで、第１の金属めっき層１２の膜厚は０．２〜１．５μｍの範囲が好適である。 Next, electrolytic plating is performed using the metal plate 10 as a cathode to form a first metal plating layer 12 made of a gold or palladium film having a predetermined thickness on the barrier plating layer 11 in the opening 43 (FIG. 5C). )reference).
Here, the thickness of the first metal plating layer 12 is preferably in the range of 0.2 to 1.5 μm.

さらに、金属板１０をカソードにして電解めっきを行い、開口部４３内の第１の金属めっき層１２上に所定厚の錫、錫銀合金、錫ビスマス合金、錫亜鉛合金、錫鉛合金からなる群から選ばれた少なくとも１種の金属もしくは合金皮膜からなる第２の金属めっき層１３を形成し、第１の金属めっき層１２及び第２の金属めっき層１３からなる半導体実装パッド２０を作製する（図５（ｄ）参照）。
ここで、第２の金属めっき層１３の膜厚は５〜１５μｍの範囲が好適である。 Further, electrolytic plating is performed using the metal plate 10 as a cathode, and the first metal plating layer 12 in the opening 43 is formed of a predetermined thickness of tin, tin silver alloy, tin bismuth alloy, tin zinc alloy, tin lead alloy. A second metal plating layer 13 made of at least one metal or alloy film selected from the group is formed, and a semiconductor mounting pad 20 made of the first metal plating layer 12 and the second metal plating layer 13 is produced. (See FIG. 5 (d)).
Here, the thickness of the second metal plating layer 13 is preferably in the range of 5 to 15 μm.

次に、絶縁層４２表面を研磨処理して、パラジウム触媒を付与した後無電解銅めっきを
行ってめっき下地導電層（特に、図示せず）を形成し、感光性のドライフィルムをラミネートする等の方法で感光層を形成し、パターン露光、現像等のパターニング処理を行って、絶縁層４２の所定位置にパターンめっき用のレジストパターン４３を形成する（図５（ｅ）参照）。 Next, the surface of the insulating layer 42 is polished, and after applying a palladium catalyst, electroless copper plating is performed to form a plating base conductive layer (not shown), and a photosensitive dry film is laminated. The photosensitive layer is formed by the above method, and patterning processing such as pattern exposure and development is performed to form a resist pattern 43 for pattern plating at a predetermined position of the insulating layer 42 (see FIG. 5E).

次に、めっき下地導電層をカソードにして、電解銅めっきを行い、所定厚の導体層を形成し、レジストパターン４３を専用の剥離液で剥離処理し、レジストパターン４３の下部にあっためっき下地層をクイックエッチングにて除去し、半導体実装パッド２０と電気的に接続された配線層２１を形成する（図５（ｆ）参照）。   Next, electrolytic copper plating is performed using the plating base conductive layer as a cathode, a conductor layer having a predetermined thickness is formed, and the resist pattern 43 is stripped with a dedicated stripping solution. The base layer is removed by quick etching to form a wiring layer 21 electrically connected to the semiconductor mounting pad 20 (see FIG. 5F).

次に、絶縁層４２及び配線層２１上にエポキシ樹脂等の樹脂溶液を塗布するか、プリプレグシートをラミネートする等の方法で、所定厚の絶縁層４４を形成し、絶縁層４４の所定位置にレーザー加工等により所定サイズのビア用孔４５を形成し、デスミア処理、めっき触媒付与及び無電解銅めっきを行って、めっき下地導電層（特に、図示せず）を形成する（図６（ｇ）参照）。   Next, an insulating layer 44 having a predetermined thickness is formed by applying a resin solution such as an epoxy resin on the insulating layer 42 and the wiring layer 21 or laminating a prepreg sheet. A via hole 45 having a predetermined size is formed by laser processing or the like, desmear treatment, plating catalyst application, and electroless copper plating are performed to form a plating base conductive layer (not shown in particular) (FIG. 6G). reference).

次に、感光性のドライフィルムをラミネートする等の方法で感光層を形成し、パターン露光、現像等のパターニング処理を行って、絶縁層４４の所定位置にパターンめっき用のレジストパターン４６を形成する（図６（ｈ）参照）。   Next, a photosensitive layer is formed by a method such as laminating a photosensitive dry film, and a patterning process such as pattern exposure and development is performed to form a resist pattern 46 for pattern plating at a predetermined position of the insulating layer 44. (See FIG. 6 (h)).

次に、めっき下地導電層をカソードにして、電解銅めっきを行い、所定厚の導体層を形成し、レジストパターン４３を専用の剥離液で剥離処理し、レジストパターン４３の下部にあっためっき下地層をクイックエッチングにて除去し、配線層２２及びビア２３を形成する（図６（ｉ）参照）。   Next, electrolytic copper plating is performed using the plating base conductive layer as a cathode, a conductor layer having a predetermined thickness is formed, and the resist pattern 43 is stripped with a dedicated stripping solution. The base layer is removed by quick etching to form the wiring layer 22 and the via 23 (see FIG. 6I).

ここでは、配線層及びビアをセミアディティブ法で形成した２層の事例で説明したが、これはあくまでも一例であって、他の、サブトラクティブ、フルアディティブ法で作成しても良いし、また、上記絶縁層、配線層、ビア形成工程を繰り返した多層配線構造としてもよい。   Here, the case of the two layers in which the wiring layer and the via are formed by the semi-additive method has been described. It is good also as a multilayer wiring structure which repeated the said insulating layer, wiring layer, and via formation process.

次に、必要に応じて、絶縁層４４及び配線層２２上にスクリーン印刷にてソルダーレジスト溶液を塗布して、ソルダー感光層を形成し、パターン露光、現像等のパターニング処理を行って、ソルダーレジストパターン５１を形成し、ハンダボール用パッド２２ａを形成する。また、必要に応じて、ハンダボール用パッド２２ａ上にニッケル、金皮膜等を形成し、保護層４１を除去して、銅合金からなる金属基板１０を付けた状態の絶縁層４２及び絶縁層４４からなる基板４０の一方の面に第１の金属めっき層１２と第２の金属めっき層１３からなる半導体実装パッド２０が、他方の面にソルダーレジストパターン５１及びはんだボール用パッド２２ａが形成された半導体装置用基板２００を得る（図６（ｊ）参照）。   Next, if necessary, a solder resist solution is applied on the insulating layer 44 and the wiring layer 22 by screen printing to form a solder photosensitive layer, and patterning processing such as pattern exposure and development is performed. A pattern 51 is formed, and a solder ball pad 22a is formed. Further, if necessary, nickel, a gold film or the like is formed on the solder ball pad 22a, the protective layer 41 is removed, and the insulating layer 42 and the insulating layer 44 with the metal substrate 10 made of a copper alloy attached. The semiconductor mounting pad 20 made of the first metal plating layer 12 and the second metal plating layer 13 is formed on one surface of the substrate 40 made of the above, and the solder resist pattern 51 and the solder ball pad 22a are formed on the other surface. A semiconductor device substrate 200 is obtained (see FIG. 6J).

さらに、銅合金からなる金属基板１０をアルカリエッチングで除去した後、続けて、塩化第２鉄溶液にてバリヤ層１１をエッチングして除去し、絶縁層４２及び絶縁層４４からなる基板４０の一方の面に第１の金属めっき層１２と第２の金属めっき層１３からなる半導体実装パッド２０が、他方の面にソルダーレジストパターン５１及びはんだボール用パッド２２ａが形成された半導体装置用基板１００を得る（図６（ｋ）参照）。   Further, after the metal substrate 10 made of copper alloy is removed by alkaline etching, the barrier layer 11 is subsequently removed by etching with a ferric chloride solution, and one of the substrates 40 made of the insulating layer 42 and the insulating layer 44 is removed. The semiconductor device substrate 100 having the first metal plating layer 12 and the second metal plating layer 13 on the surface and the solder resist pattern 51 and the solder ball pad 22a on the other surface is provided. Is obtained (see FIG. 6 (k)).

請求項１１に係わる本発明の半導体装置用基板の製造方法について説明する。
図７（ａ）〜（ｆ）、図８（ｇ）〜（ｌ）は、本発明の半導体装置用基板３００及び４００の製造方法の一例を工程順に示す模式構成断面図である。 A method for manufacturing a substrate for a semiconductor device according to an eleventh aspect of the present invention will be described.
FIGS. 7A to 7F and FIGS. 8G to 8L are schematic cross-sectional views illustrating an example of a method of manufacturing the semiconductor device substrates 300 and 400 according to the present invention in the order of steps.

まず、上記請求項１０に係わる半導体装置用基板１００及び２００の工程と同じ方法で、銅合金からなる金属基板１０の一方の面に、バリヤ層４１及び開口部４３を有するレジ
ストパターン４２を、他方の面に保護層４１をそれぞれ形成する（図７（ａ）〜（ｂ）参照）。 First, a resist pattern 42 having a barrier layer 41 and an opening 43 is formed on one surface of a metal substrate 10 made of a copper alloy by the same method as the steps of the semiconductor device substrates 100 and 200 according to claim 10. The protective layer 41 is formed on each surface (see FIGS. 7A to 7B).

次に、金属板１０をカソードにして電解めっきを行い、開口部４３内のバリヤめっき層１１上に所定厚の金もしくはパラジウム皮膜からなる第１の金属めっき層１２を形成する（図７（ｃ）参照）。
ここで、第１の金属めっき層１２の膜厚は０．２〜１．５μｍの範囲が好適である。 Next, electrolytic plating is performed using the metal plate 10 as a cathode to form a first metal plating layer 12 made of a gold or palladium film having a predetermined thickness on the barrier plating layer 11 in the opening 43 (FIG. 7 (c). )reference).
Here, the thickness of the first metal plating layer 12 is preferably in the range of 0.2 to 1.5 μm.

さらに、金属板１０をカソードにして電解めっきを行い、開口部４３内の第１の金属めっき層１２上に所定厚の錫、錫銀合金、錫ビスマス合金、錫亜鉛合金、錫鉛合金からなる群から選ばれた少なくとも１種の金属もしくは合金皮膜からなる第２の金属めっき層１３を形成する（図７（ｄ）参照）。
ここで、第２の金属めっき層１３の膜厚は５〜１５μｍの範囲が好適である。 Further, electrolytic plating is performed using the metal plate 10 as a cathode, and the first metal plating layer 12 in the opening 43 is formed of a predetermined thickness of tin, tin silver alloy, tin bismuth alloy, tin zinc alloy, tin lead alloy. A second metal plating layer 13 made of at least one metal or alloy film selected from the group is formed (see FIG. 7D).
Here, the thickness of the second metal plating layer 13 is preferably in the range of 5 to 15 μm.

さらに、金属板１０をカソードにして電解めっきを行い、開口部４３内の第１の金属めっき層１２及び第２の金属めっき層１３上に所定厚のニッケル皮膜からなるバリヤめっき層１４を形成し、第１の金属めっき層１２、第２の金属めっき層１３及びバリヤめっき層１４からなる半導体実装パッド３０を作製する（図７（ｅ）参照）。
ここで、バリヤめっき層１４の膜厚は１〜８μｍの範囲が好適である。 Further, electrolytic plating is performed using the metal plate 10 as a cathode, and a barrier plating layer 14 made of a nickel film having a predetermined thickness is formed on the first metal plating layer 12 and the second metal plating layer 13 in the opening 43. Then, the semiconductor mounting pad 30 including the first metal plating layer 12, the second metal plating layer 13, and the barrier plating layer 14 is produced (see FIG. 7E).
Here, the thickness of the barrier plating layer 14 is preferably in the range of 1 to 8 μm.

次に、上記請求項８に係わる半導体装置用基板１００及び２００の工程と同じセミアディティブプロセスで、絶縁層４２及び半導体実装パッド３０上に配線層２１を形成する（図７（ｆ）及び図８（ｇ）参照）。   Next, the wiring layer 21 is formed on the insulating layer 42 and the semiconductor mounting pad 30 by the same semi-additive process as the steps of the semiconductor device substrates 100 and 200 according to the eighth aspect (FIG. 7F and FIG. 8). (See (g)).

次に、絶縁層４４及びビア用孔４５を形成し、セミアディティブプロセスで、配線層２２及びビア２３を形成する（図８（ｈ）、（ｉ）及び（ｊ）参照）。   Next, the insulating layer 44 and the via hole 45 are formed, and the wiring layer 22 and the via 23 are formed by a semi-additive process (see FIGS. 8H, 8I, and 8J).

ここでは、配線層及びビアをセミアディティブ法で形成した２層の事例で説明したが、これはあくまでも一例であって、他の、サブトラクティブ、フルアディティブ法で作成しても良いし、また、上記絶縁層、配線層、ビア形成工程を繰り返した多層配線構造としてもよい。   Here, the case of the two layers in which the wiring layer and the via are formed by the semi-additive method has been described. It is good also as a multilayer wiring structure which repeated the said insulating layer, wiring layer, and via formation process.

次に、必要に応じて、絶縁層４４及び配線層２２上にスクリーン印刷にてソルダーレジスト溶液を塗布して、ソルダー感光層を形成し、パターン露光、現像等のパターニング処理を行って、ソルダーレジストパターン５１を形成し、ハンダボール用パッド２２ａを形成する。また、必要に応じて、ハンダボール用パッド２２ａ上にニッケル、金皮膜等を形成し、保護層４１を除去して、銅合金からなる金属基板１０を付けた状態の絶縁層４２及び絶縁層４４からなる基板４０の一方の面に第１の金属めっき層１２と第２の金属めっき層１３とバリヤめっき層１４とからなる半導体実装パッド３０が、他方の面にソルダーレジストパターン５１及びはんだボール用パッド２２ａが形成された半導体装置用基板４００を得る（図８（ｋ）参照）。   Next, if necessary, a solder resist solution is applied on the insulating layer 44 and the wiring layer 22 by screen printing to form a solder photosensitive layer, and patterning processing such as pattern exposure and development is performed. A pattern 51 is formed, and a solder ball pad 22a is formed. Further, if necessary, nickel, a gold film or the like is formed on the solder ball pad 22a, the protective layer 41 is removed, and the insulating layer 42 and the insulating layer 44 with the metal substrate 10 made of a copper alloy attached. A semiconductor mounting pad 30 composed of the first metal plating layer 12, the second metal plating layer 13, and the barrier plating layer 14 is formed on one surface of the substrate 40, and the solder resist pattern 51 and the solder ball pattern are disposed on the other surface. A semiconductor device substrate 400 on which the pads 22a are formed is obtained (see FIG. 8K).

ここでは、２層の配線層の事例で説明したが、これはあくまでも一例であって、上記絶縁層、配線層を繰り返した多層配線構造としてもよい。   Here, the case of the two wiring layers has been described, but this is only an example, and a multilayer wiring structure in which the insulating layer and the wiring layer are repeated may be employed.

さらに、銅合金からなる金属基板１０をアルカリエッチングで除去した後、続けて、塩化第２鉄溶液にてバリヤ層１１をエッチングして除去し、絶縁層４２及び絶縁層４４からなる基板４０の一方の面に第１の金属めっき層１２と第２の金属めっき層１３とバリヤめっき層１４とからなる半導体実装パッド３０が、他方の面にソルダーレジストパターン５１及びはんだボール用パッド２２ａが形成された半導体装置用基板３００を得る（図８（ｌ）参照）。   Further, after the metal substrate 10 made of copper alloy is removed by alkaline etching, the barrier layer 11 is subsequently removed by etching with a ferric chloride solution, and one of the substrates 40 made of the insulating layer 42 and the insulating layer 44 is removed. A semiconductor mounting pad 30 composed of the first metal plating layer 12, the second metal plating layer 13, and the barrier plating layer 14 is formed on the surface, and a solder resist pattern 51 and a solder ball pad 22a are formed on the other surface. A semiconductor device substrate 300 is obtained (see FIG. 8L).

（ａ）及び（ｂ）は、本発明の半導体装置用基板の一実施例を示す模式構成部分断面図である。(A) And (b) is typical structure fragmentary sectional view which shows one Example of the board | substrate for semiconductor devices of this invention. （ａ）及び（ｂ）は、本発明の半導体装置用基板の他の実施例を示す模式構成部分断面図である。(A) And (b) is a typical structure fragmentary sectional view which shows the other Example of the board | substrate for semiconductor devices of this invention. （ａ）及び（ｂ）は、本発明の半導体装置の一実施例を示す模式構成部分断面図である。(A) And (b) is a typical structure fragmentary sectional view which shows one Example of the semiconductor device of this invention. （ａ）及び（ｂ）は、本発明の半導体装置の他の実施例を示す模式構成部分断面図である。(A) And (b) is a typical structure fragmentary sectional view which shows the other Example of the semiconductor device of this invention. （ａ）〜（ｆ）は、本発明の半導体装置用基板の製造方法における工程の一部を模式的に示す部分構成断面図である。(A)-(f) is a partial structure sectional view showing typically a part of process in a manufacturing method of a substrate for semiconductor devices of the present invention. （ｇ）〜（ｋ）は、本発明の半導体装置用基板の製造方法における工程の一部を模式的に示す部分構成断面図である。(G)-(k) is a partial structure sectional view showing typically a part of process in a manufacturing method of a substrate for semiconductor devices of the present invention. （ａ）〜（ｆ）は、本発明の半導体装置用基板の製造方法における工程の一部を模式的に示す部分構成断面図である。(A)-(f) is a partial structure sectional view showing typically a part of process in a manufacturing method of a substrate for semiconductor devices of the present invention. （ｇ）〜（ｌ）は、本発明の半導体装置用基板の製造方法における工程の一部を模式的に示す部分構成断面図である。(G)-(l) is a partial structure sectional view showing typically a part of process in a manufacturing method of a substrate for semiconductor devices of the present invention. 本発明の半導体装置用基板の半導体実装パッドの状態を示す説明図である。It is explanatory drawing which shows the state of the semiconductor mounting pad of the board | substrate for semiconductor devices of this invention. 従来の半導体装置用基板の一例を示す模式構成部分断面図である。It is a typical structure fragmentary sectional view showing an example of the conventional substrate for semiconductor devices. 従来の半導体装置の一例を示す模式構成部分断面図である。It is a typical structure fragmentary sectional view showing an example of the conventional semiconductor device. （ａ）〜（ｆ）は、従来の半導体装置用基板の製造工程の一部を模式的に示す部分構成断面図である。(A)-(f) is a partial composition sectional view showing typically a part of manufacturing process of the conventional substrate for semiconductor devices. （ｇ）〜（ｋ）は、従来の半導体装置用基板の製造工程の一部を模式的に示す部分構成断面図である。(G)-(k) is a partial composition sectional view showing typically a part of manufacturing process of the conventional substrate for semiconductor devices.

符号の説明Explanation of symbols

１０、１１０……金属基板
１１……バリヤ層
１２……第１の金属めっき層
１３……第２の金属めっき層
１４……バリヤめっき層
２０、３０……半導体実装パッド
２１、２２……配線層
２２ａ……はんだボール用パッド
２３……ビア
４０……基板
４１、１１３……保護層
４２、４４、１４１……絶縁層
４３、４６、１１１、１１４……レジストパターン
４５、１４２……ビア用孔
４１、４２、４３……レジストパターン
５１……ソルダーレジストパターン
１００、２００、３００、４００、９００……半導体装置用基板
５００、６００、７００、８００、１０００……半導体装置
６１、１５１……半導体チップ
６２……金バンプ
６３……はんだバンプ
７１……アンダーフィル
８１、１８１……はんだボール
１１２……開口部
１２１……はんだ層
１３１……ランド電極
１３２……フィルドビア
１３３……導体層
１３３ａ……配線領域
１３３ｂ……接続電極
１６１……ボンディングワイヤ
１７１……絶縁樹脂 DESCRIPTION OF SYMBOLS 10,110 ... Metal substrate 11 ... Barrier layer 12 ... 1st metal plating layer 13 ... 2nd metal plating layer 14 ... Barrier plating layers 20, 30 ... Semiconductor mounting pad 21, 22 ... Wiring Layer 22a ... Solder ball pad 23 ... Via 40 ... Substrate 41, 113 ... Protective layer 42, 44, 141 ... Insulating layer 43, 46, 111, 114 ... Resist pattern 45, 142 ... For via Holes 41, 42, 43 ... Resist pattern 51 ... Solder resist pattern 100, 200, 300, 400, 900 ... Semiconductor device substrate 500, 600, 700, 800, 1000 ... Semiconductor device 61, 151 ... Semiconductor Chip 62 ... Gold bump 63 ... Solder bump 71 ... Underfill 81, 181 ... Solder ball 112 ... Opening 121 ... Solder layer 31 ...... land electrodes 132 ...... filled via 133 ...... conductive layer 133a ...... wiring region 133b ...... connection electrode 161 ...... bonding wires 171 ...... insulating resin

Claims (9)

基板の一方の面に半導体実装パッドが、他方の面にはんだボール用パッドが形成されてなる半導体装置用基板であって、前記半導体実装パッドが、表面から順に、第１の金属めっき層及び第２の金属めっき層で構成されていることを特徴とする半導体装置用基板。 A semiconductor device substrate in which a semiconductor mounting pad is formed on one surface of a substrate and a solder ball pad is formed on the other surface, wherein the semiconductor mounting pad includes a first metal plating layer and a first metal layer in order from the surface. A substrate for a semiconductor device, comprising two metal plating layers. 基板の一方の面に半導体実装パッドが、他方の面にはんだボール用パッドが形成されてなる半導体装置用基板であって、前記半導体実装パッドが、表面から順に、第１の金属めっき層、第２の金属めっき層及びバリヤめっき層で構成されていることを特徴とする半導体装置用基板。   A semiconductor device substrate in which a semiconductor mounting pad is formed on one surface of a substrate and a solder ball pad is formed on the other surface, wherein the semiconductor mounting pad includes, in order from the surface, a first metal plating layer, A substrate for a semiconductor device, comprising a metal plating layer and a barrier plating layer. 前記第１の金属めっき層が金もしくはパラジウムのいずれかの金属からなることを特徴とする請求項１または２に記載の半導体装置用基板。   3. The semiconductor device substrate according to claim 1, wherein the first metal plating layer is made of one of gold and palladium. 4. 前記第２の金属めっき層が錫、錫銀合金、錫ビスマス合金、錫亜鉛合金、錫鉛合金からなる群から選ばれた少なくとも１種の金属もしくは合金からなることを特徴とする請求項１または２に記載の半導体装置用基板。   The second metal plating layer is made of at least one metal or alloy selected from the group consisting of tin, tin-silver alloy, tin-bismuth alloy, tin-zinc alloy, and tin-lead alloy. 2. The substrate for a semiconductor device according to 2. 前記バリヤめっき層がニッケルからなることを特徴とする請求項２に記載の半導体装置用基板。   The substrate for a semiconductor device according to claim 2, wherein the barrier plating layer is made of nickel. 前記半導体実装パッドが、平板上の金属基板上に被覆されていることを特徴とする請求項１乃至５のいずれか一項に記載の半導体装置用基板。   The semiconductor device substrate according to claim 1, wherein the semiconductor mounting pad is coated on a flat metal substrate. 請求項１乃至５のいずれか一項に記載の半導体装置用基板上に半導体を搭載したことを特徴とする半導体装置。   A semiconductor device comprising a semiconductor mounted on the semiconductor device substrate according to claim 1. 少なくとも以下の工程を有することを特徴とする請求項１に記載の半導体装置用基板の製造方法。
（ａ）金属基板（１０）の一方の面にバリヤ層（１１）を形成する工程。
（ｂ）バリヤ層（１１）上に所定厚の絶縁層（４２）を形成し、絶縁層（４２）の所定位置に開口部（４３）を形成する工程。
（ｃ）開口部（４３）内に所定厚の第１の金属めっき層（１２）を形成する工程。
（ｄ）開口部（４３）内の第１の金属めっき層（１２）上に第２の金属めっき層（１３）を形成する工程。
（ｅ）絶縁層（４２）表面を研磨処理して、サブトラクティブ法、もしくはセミアディテブ法、もしくはフルアディティブ法にて、配線層（２２）及びビア（２３）を形成する工程。
（ｆ）必用に応じて、上記（ｅ）の工程を所定回数繰り返す工程。
（ｇ）ソルダーレジストパターン（５１）を形成してはんだボール用パッド（２２ａ）を形成する工程。
（ｈ）金属基板（１０）をエッチングで除去する工程。
（ｉ）バリア層を除去する工程。 The method for manufacturing a substrate for a semiconductor device according to claim 1, comprising at least the following steps.
(A) A step of forming a barrier layer (11) on one surface of the metal substrate (10).
(B) A step of forming an insulating layer (42) having a predetermined thickness on the barrier layer (11) and forming an opening (43) at a predetermined position of the insulating layer (42).
(C) A step of forming a first metal plating layer (12) having a predetermined thickness in the opening (43).
(D) A step of forming a second metal plating layer (13) on the first metal plating layer (12) in the opening (43).
(E) A step of polishing the surface of the insulating layer (42) to form a wiring layer (22) and a via (23) by a subtractive method, a semi-additive method, or a full additive method.
(F) A step of repeating the step (e) a predetermined number of times as necessary.
(G) A step of forming a solder ball pad (22a) by forming a solder resist pattern (51).
(H) A step of removing the metal substrate (10) by etching.
(I) A step of removing the barrier layer. 少なくとも以下の工程を有することを特徴とする請求項２に記載の半導体装置用基板の製造方法。
（ａ）金属基板（１０）の一方の面にバリヤ層（１１）を形成する工程。
（ｂ）バリヤ層（１１）上に所定厚の絶縁層（４２）を形成し、絶縁層（４２）の所定位置に開口部（４３）を形成する工程。
（ｃ）開口部（４３）内に所定厚の第１の金属めっき層（１２）を形成する工程。
（ｄ）開口部（４３）内の第１の金属めっき層（１２）上に第２の金属めっき層（１３）を形成する工程。
（ｅ）開口部（４３）内の第１の金属めっき層（１２）及び第２の金属めっき層（１３）上にバリアめっき層（１４）を形成する工程。
（ｆ）絶縁層（４２）表面を研磨処理して、サブトラクティブ法、もしくはセミアディテブ法、もしくはフルアディティブ法にて、配線層（２２）及びビア（２３）を形成する工程。
（ｇ）必用に応じて、上記（ｆ）の工程を所定回数繰り返す工程。
（ｈ）ソルダーレジストパターン（５１）を形成して、はんだボール用パッド（２２ａ）を形成する工程。
（ｉ）金属基板（１０）をエッチングで除去する工程。
（ｊ）バリア層を除去する工程。 The method for manufacturing a substrate for a semiconductor device according to claim 2, comprising at least the following steps.
(A) A step of forming a barrier layer (11) on one surface of the metal substrate (10).
(B) A step of forming an insulating layer (42) having a predetermined thickness on the barrier layer (11) and forming an opening (43) at a predetermined position of the insulating layer (42).
(C) A step of forming a first metal plating layer (12) having a predetermined thickness in the opening (43).
(D) A step of forming a second metal plating layer (13) on the first metal plating layer (12) in the opening (43).
(E) A step of forming a barrier plating layer (14) on the first metal plating layer (12) and the second metal plating layer (13) in the opening (43).
(F) A step of polishing the surface of the insulating layer (42) to form a wiring layer (22) and a via (23) by a subtractive method, a semi-additive method, or a full additive method.
(G) A step of repeating the step (f) a predetermined number of times as necessary.
(H) A step of forming a solder resist pattern (51) to form a solder ball pad (22a).
(I) A step of removing the metal substrate (10) by etching.
(J) A step of removing the barrier layer.
JP2003386217A 2003-11-17 2003-11-17 Semiconductor device substrate and manufacturing method thereof Expired - Fee Related JP3918803B2 (en)

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US8188375B2 (en) 2005-11-29 2012-05-29 Tok Corporation Multilayer circuit board and method for manufacturing the same
JP2013058778A (en) * 2012-11-06 2013-03-28 Shinko Electric Ind Co Ltd Wiring board, manufacturing method of the same, and semiconductor device
JP2014160857A (en) * 2006-02-23 2014-09-04 Agere Systems Inc Flexible circuit substrate for flip-chip-on-flex applications
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US8188375B2 (en) 2005-11-29 2012-05-29 Tok Corporation Multilayer circuit board and method for manufacturing the same
US8530752B2 (en) 2005-11-29 2013-09-10 Tdk Corporation Multilayer circuit board and method for manufacturing the same
JP2014160857A (en) * 2006-02-23 2014-09-04 Agere Systems Inc Flexible circuit substrate for flip-chip-on-flex applications
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