JP3950560B2 - 電子部品用接着剤および電子部品用接着テープ - Google Patents

電子部品用接着剤および電子部品用接着テープ Download PDF

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Publication number
JP3950560B2
JP3950560B2 JP22919998A JP22919998A JP3950560B2 JP 3950560 B2 JP3950560 B2 JP 3950560B2 JP 22919998 A JP22919998 A JP 22919998A JP 22919998 A JP22919998 A JP 22919998A JP 3950560 B2 JP3950560 B2 JP 3950560B2
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Japan
Prior art keywords
adhesive
polyimide
structural unit
formula
resin
Prior art date
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Expired - Fee Related
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JP22919998A
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English (en)
Japanese (ja)
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JP2000063788A (ja
JP2000063788A5 (enExample
Inventor
建 吉岡
均 成嶋
修 岡
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Tomoegawa Co Ltd
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Tomoegawa Paper Co Ltd
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Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP22919998A priority Critical patent/JP3950560B2/ja
Priority to KR1019990033076A priority patent/KR100360048B1/ko
Priority to US09/373,606 priority patent/US6187874B1/en
Publication of JP2000063788A publication Critical patent/JP2000063788A/ja
Priority to US09/643,743 priority patent/US6329050B1/en
Publication of JP2000063788A5 publication Critical patent/JP2000063788A5/ja
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Publication of JP3950560B2 publication Critical patent/JP3950560B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP22919998A 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ Expired - Fee Related JP3950560B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP22919998A JP3950560B2 (ja) 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ
KR1019990033076A KR100360048B1 (ko) 1998-08-14 1999-08-12 전자부품용 접착제 및 전자부품용 접착 테이프
US09/373,606 US6187874B1 (en) 1998-08-14 1999-08-13 Adhesive for electronic parts and adhesive tape for electronic parts
US09/643,743 US6329050B1 (en) 1998-08-14 2000-08-23 Adhesive for electronic parts and adhesive tape for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22919998A JP3950560B2 (ja) 1998-08-14 1998-08-14 電子部品用接着剤および電子部品用接着テープ

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JP2000063788A JP2000063788A (ja) 2000-02-29
JP2000063788A5 JP2000063788A5 (enExample) 2005-07-21
JP3950560B2 true JP3950560B2 (ja) 2007-08-01

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JP2002003795A (ja) * 2000-06-26 2002-01-09 Kanegafuchi Chem Ind Co Ltd 新規接着剤組成物及びそれを用いた接合部材
JP2002080815A (ja) * 2000-09-05 2002-03-22 Kanegafuchi Chem Ind Co Ltd ポリイミド系接着剤溶液およびそれを用いて得られるフィルム状積層部材
KR20020065723A (ko) * 2001-02-07 2002-08-14 (주)새한마이크로닉스 전자부품용 접착제 및 이를 이용한 접착테이프
WO2003076515A1 (en) * 2002-03-08 2003-09-18 Kaneka Corporation Thermosetting resin composition and laminates and circuit board substrates made by using the same
CN100334690C (zh) 2002-03-27 2007-08-29 三井化学株式会社 半导体晶片表面保护用粘结膜及用该粘结膜的半导体晶片的保护方法
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CN1325595C (zh) * 2004-05-11 2007-07-11 日立化成工业株式会社 粘合薄膜、带粘合薄膜的引线框架及使用它们的半导体器件
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US8492474B2 (en) * 2006-11-22 2013-07-23 Sabic Innovative Plastics Ip B.V. Methods of making polymer blend compositions
US20080119616A1 (en) * 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
JP4548855B2 (ja) * 2007-09-05 2010-09-22 信越化学工業株式会社 熱硬化性ポリイミドシリコーン樹脂組成物及びその硬化皮膜
EP2628774B1 (en) 2010-10-14 2016-03-23 LG Chem, Ltd. Resin blend for melting process
JP5738428B2 (ja) * 2011-07-22 2015-06-24 エルジー・ケム・リミテッド 熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板
WO2015107990A1 (ja) * 2014-01-15 2015-07-23 東レ株式会社 接着組成物ならびにそれを有する接着フィルム、接着組成物付き基板、半導体装置およびその製造方法
JP6593649B2 (ja) * 2015-03-31 2019-10-23 荒川化学工業株式会社 接着剤組成物、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、フレキシブル銅張積層板、プリント配線板、フレキシブルプリント配線板、多層配線板、プリント回路板、及びフレキシブルプリント回路板
KR101953369B1 (ko) * 2015-12-04 2019-02-28 주식회사 엘지화학 중합성 조성물
JP7114983B2 (ja) * 2017-03-29 2022-08-09 荒川化学工業株式会社 接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
KR102462940B1 (ko) * 2017-11-03 2022-11-04 삼성전자주식회사 폴리이미드, 폴리이미드 제조용 조성물, 폴리이미드를 포함하는 성형품 및 표시 장치
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JP2000063788A (ja) 2000-02-29
KR20000017278A (ko) 2000-03-25
KR100360048B1 (ko) 2002-11-04
US6329050B1 (en) 2001-12-11

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