JP3935579B2 - カバーテープ送り装置,カバーテープ処理装置およびフィーダユニット - Google Patents
カバーテープ送り装置,カバーテープ処理装置およびフィーダユニット Download PDFInfo
- Publication number
- JP3935579B2 JP3935579B2 JP29761397A JP29761397A JP3935579B2 JP 3935579 B2 JP3935579 B2 JP 3935579B2 JP 29761397 A JP29761397 A JP 29761397A JP 29761397 A JP29761397 A JP 29761397A JP 3935579 B2 JP3935579 B2 JP 3935579B2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- tape
- lever
- claw
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1906—Delaminating means responsive to feed or shape at delamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29761397A JP3935579B2 (ja) | 1997-10-29 | 1997-10-29 | カバーテープ送り装置,カバーテープ処理装置およびフィーダユニット |
| US09/177,117 US5975395A (en) | 1997-10-29 | 1998-10-22 | Feeding apparatus |
| EP98308851A EP0923281A3 (en) | 1997-10-29 | 1998-10-29 | Cover-tape feeding apparatus, cover-tape treating apparatus, and electric-component feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29761397A JP3935579B2 (ja) | 1997-10-29 | 1997-10-29 | カバーテープ送り装置,カバーテープ処理装置およびフィーダユニット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11135987A JPH11135987A (ja) | 1999-05-21 |
| JPH11135987A5 JPH11135987A5 (enExample) | 2005-06-30 |
| JP3935579B2 true JP3935579B2 (ja) | 2007-06-27 |
Family
ID=17848831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29761397A Expired - Fee Related JP3935579B2 (ja) | 1997-10-29 | 1997-10-29 | カバーテープ送り装置,カバーテープ処理装置およびフィーダユニット |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5975395A (enExample) |
| EP (1) | EP0923281A3 (enExample) |
| JP (1) | JP3935579B2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
| US6332387B1 (en) * | 1997-10-29 | 2001-12-25 | Fuji Machine Manufacturing Co., Ltd. | Cover-tape treating method and apparatus and electric-component supplying unit |
| DE59711263D1 (de) | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial |
| JPH11238999A (ja) * | 1998-02-19 | 1999-08-31 | Fuji Mach Mfg Co Ltd | 電気部品供給方法および装置 |
| JP4117859B2 (ja) * | 1998-06-24 | 2008-07-16 | 富士機械製造株式会社 | 部品供給ユニット |
| JP4014296B2 (ja) * | 1998-06-24 | 2007-11-28 | 富士機械製造株式会社 | テーピング電気部品送り装置および電気部品供給方法 |
| US6409067B1 (en) * | 1998-10-07 | 2002-06-25 | Vincent Huret | Step-by-step recovery of a strip |
| DE10020749A1 (de) * | 2000-04-27 | 2001-11-15 | Siemens Ag | Zuführeinrichtung für in Gurten aufgenommene elektrische Bauteile |
| ATE311738T1 (de) * | 2001-09-19 | 2005-12-15 | Mydata Automation Ab | Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine |
| JP4791314B2 (ja) * | 2006-09-29 | 2011-10-12 | 本田技研工業株式会社 | ギヤシフト装置 |
| JP4800167B2 (ja) | 2006-09-29 | 2011-10-26 | 本田技研工業株式会社 | ギヤシフト装置 |
| US7604148B2 (en) * | 2006-11-15 | 2009-10-20 | The Goodyear Tire & Rubber Company | Device for reducing the tension on an elastomeric feed |
| JP5507169B2 (ja) * | 2009-09-16 | 2014-05-28 | Juki株式会社 | 電子部品実装装置 |
| JP5293708B2 (ja) * | 2010-09-14 | 2013-09-18 | パナソニック株式会社 | 電子部品実装装置及び電子部品実装方法 |
| JP5559735B2 (ja) * | 2011-04-07 | 2014-07-23 | 株式会社日立ハイテクインスツルメンツ | 部品供給装置 |
| US10015919B2 (en) * | 2016-02-26 | 2018-07-03 | Panasonic Intellectual Property Management Co., Ltd. | Component supply device |
| KR102135430B1 (ko) * | 2017-06-20 | 2020-07-17 | (주)엘지하우시스 | 창호 프로파일용 모헤어 삽입구 |
| CN111824535A (zh) * | 2020-07-28 | 2020-10-27 | 深圳市华东兴科技有限公司 | 一种aa设备前端剥单机 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3795356A (en) * | 1972-05-11 | 1974-03-05 | E Orthen | Labelling devices |
| US4542672A (en) * | 1983-12-02 | 1985-09-24 | Gerber Garment Technology, Inc. | Sheet material conveyor loading apparatus |
| JPS62111825A (ja) * | 1985-11-06 | 1987-05-22 | Fuji Kikai Seizo Kk | キヤリヤテ−プから電子部品を取り出す方法 |
| JPH0770858B2 (ja) * | 1987-01-19 | 1995-07-31 | 三洋電機株式会社 | 部品供給装置 |
| US4887778A (en) * | 1988-06-01 | 1989-12-19 | Universal Instruments Corporation | Feeder drive assembly and replaceable section for tape supplying and cover peeling |
| JPH03152050A (ja) * | 1989-11-08 | 1991-06-28 | Hitachi Ltd | 電子部品供給装置 |
| US5191693A (en) * | 1989-12-29 | 1993-03-09 | Canon Kabushiki Kaisha | Tape type work conveying method and conveying apparatus |
| JPH07114319B2 (ja) * | 1991-01-22 | 1995-12-06 | 松下電器産業株式会社 | チップ形電子部品の供給装置 |
| DE4137191A1 (de) * | 1991-11-12 | 1993-05-13 | Siemens Ag | Einrichtung zur bereitstellung von gegurteten bauelementen |
| JPH079381A (ja) * | 1993-06-25 | 1995-01-13 | Fuji Mach Mfg Co Ltd | 電子部品昇降装置 |
| JP3407947B2 (ja) * | 1993-09-30 | 2003-05-19 | 富士機械製造株式会社 | テープ化電子部品のカバーフィルム巻取り装置 |
| KR970001239Y1 (ko) * | 1993-12-29 | 1997-02-21 | 대우중공업 주식회사 | 릴상태의 전자부품 자동공급 장치 |
| JPH09237997A (ja) * | 1995-12-28 | 1997-09-09 | Fuji Mach Mfg Co Ltd | 電子部品搬送装置,方法および電子部品装着システム |
| US5725140A (en) * | 1996-09-09 | 1998-03-10 | Amistar Corporation | Tape feeder for a surface mount placement system |
-
1997
- 1997-10-29 JP JP29761397A patent/JP3935579B2/ja not_active Expired - Fee Related
-
1998
- 1998-10-22 US US09/177,117 patent/US5975395A/en not_active Expired - Fee Related
- 1998-10-29 EP EP98308851A patent/EP0923281A3/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0923281A3 (en) | 2000-02-23 |
| JPH11135987A (ja) | 1999-05-21 |
| US5975395A (en) | 1999-11-02 |
| EP0923281A2 (en) | 1999-06-16 |
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